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    INSULATED ADHESIVE TAPE
    152.
    发明专利
    INSULATED ADHESIVE TAPE 失效

    公开(公告)号：JPH08143828A

    公开(公告)日：1996-06-04

    申请号：JP28970894

    申请日：1994-11-24

    Applicant: MITSUI TOATSU CHEMICALS

    Inventor： KITAHARA MIKIO ,  ISHIGAKI KYOICHI ,  KOBA SHIGEO ,  TAMAI MASAJI ,  KUBO TAKAYUKI

    IPC: C09J7/02 ,  C08G73/10 ,  C09J179/08

    Abstract: PURPOSE: To obtain an insulated adhesive tape having high insulating properties and high heat resistances and useful for electronic industrial materials by using a polyimide obtained by a specific method as an adhesive layer on an insulating base material composed of a polymer having imide bonding. CONSTITUTION: This adhesive tape comprises adhesive layers composed of polyimide obtained by heat reaction of (A) a diamine mixture of (i) 1mol of 4,4'-bis(3-aminophenoxy)biphenyl with (ii) a diaminosiloxane compound of the formula ((n) is 0-7) in a molar ratio of (i)/(ii) of 0.10-0.005 with (B) pyromellitic acid dianhydride and/or biphenyltetracarboxylic acid dianhydride in the presence or absence of dicarboxylic acid anhydride and/or monoamine compound coated on both faces of an insulating base material composed of a polymer having imide bonding. Preferably, 0.8-1.2mol of the component A and 0.001-0.20mol of the component C are used to total 1mol of tetracarboxylic acid dianhydride in the component B.

    POLYIMIDE RESIN COMPOSITION
    153.
    发明专利
    POLYIMIDE RESIN COMPOSITION 失效

    公开(公告)号：JPH0853620A

    公开(公告)日：1996-02-27

    申请号：JP17780394

    申请日：1994-07-29

    Applicant: MITSUI TOATSU CHEMICALS

    Inventor： YAMASHITA WATARU ,  OKAWA YUICHI ,  OIKAWA HIDEAKI ,  ASANUMA TADASHI ,  TAMAI MASAJI ,  YAMAGUCHI TERUHIRO

    IPC: C08J5/04 ,  C08J7/02 ,  C08K7/02 ,  C08L79/08 ,  D06M15/37 ,  D06M101/00 ,  D06M101/16 ,  D06M101/30 ,  D06M101/34 ,  D06M101/36 ,  D06M101/40

    Abstract: PURPOSE:To obtain a polyimide resin composition excellent in mechanical properties, capable of retaining high mechanical properties even under high- temperature and high-humidity conditions and reduced in hygroscopicity and water absorption by mixing a polyimide of a specified composition with a fibrous reinforcement. CONSTITUTION:This composition is obtained by mixing a fibrous reinforcement (e.g. glass fiber) with a polyimide essentially consisting of at least one kind of repeating units each represented by formula I (wherein m and n are each 0 or 1; R is a group of any one of formulas II to V; R1 to R4 are each H, halogen, 1-8 C alkyl, aryl, alkenyl, aralkyl or 1-5 C alkoxy; R,5 to R7 are each H, 1-8C alkyl, aryl, alkenyl, aralkyl or the like; and Ar is a tetravalent group selected from among a 6-27C monocyclic aromatic group, a fused polycyclic aromatic group or a nonfused polycyclic aromatic group consisting of aromatic groups bonded with each other directly or through bridging members).

    HEAT-RESISTANT ADHESIVE
    154.
    发明专利
    HEAT-RESISTANT ADHESIVE 失效

    公开(公告)号：JPH07310068A

    公开(公告)日：1995-11-28

    申请号：JP10523094

    申请日：1994-05-19

    Applicant: MITSUI TOATSU CHEMICALS

    Inventor： TAMAI MASAJI ,  IIYAMA KATSUAKI ,  OKAWA YUICHI ,  YAMAGUCHI TERUHIRO

    IPC: C08G73/10 ,  C09J179/08 ,  H05K3/38

    Abstract: PURPOSE:To obtain a heat-resistant adhesive which comprises a polyimide prepared by a specific process, thus is useful in the field of electronics because it can perform adhesion even at lowered temperature under reduced pressure. CONSTITUTION:This adhesive comprises a polyimide which is given by reaction with heat between (A) a diamine mixture of (i) 1 mole of 4,4'-bis(3- aminophenoxy)biphenyl and (ii) 0.10-0.005mole of a diaminosiloxane of the formula (n is 0-7) and (B) a tetracarboxylic dianhydride mixture of (iii) pyromellitic dianhydride and biphenyltetracarboxylic dianhydride wherein the amount of one dianhydride is 0.02 to 0.98mole per 1mole of the total. Further, it is preferred that (C) a dicarboxylic anhydride or (D) a monoamine is additionally used wherein 0.8-1.20mole of the total components A and 0.001-0.20mole of component (C) or (D) are preferably used per mole of the total components B.

    POLYIMIDE
    155.
    发明专利
    POLYIMIDE 失效

    公开(公告)号：JPH07292105A

    公开(公告)日：1995-11-07

    申请号：JP31388794

    申请日：1994-12-19

    Applicant: MITSUI TOATSU CHEMICALS

    Inventor： YAMASHITA WATARU ,  SAKATA YOSHIHIRO ,  OKAWA YUICHI ,  TAMAI MASAJI ,  ISHIDA TSUTOMU ,  MATSUO MITSUKI ,  YAMAGUCHI KEISABURO ,  YAMAGUCHI TERUHIRO

    IPC: C07D213/69 ,  C08G73/10 ,  C08J5/06 ,  C08J5/08 ,  C08J5/18

    Abstract: PURPOSE:To obtain a thermoplastic polyimide provided with colorless transparency, low dielectric property and thermal stability, capable of being melt-molded, and useful as an electric/electronic material, an optical material, etc. CONSTITUTION:A polyimide contains one or more kinds of repeating structural units of formula I (Ar is a tetravalent noncondensed polycyclic aromatic group connected to a 6-27C aromatic group; the trifluoromethyl group is substituted at the 3 or 4-position of the pyridine nucleus; the N of the imide is bound to the 3 or 4-position based on the ether bond) as essential constituting units. The polyimide is obtained by reacting an aromatic diamine of formula II (the amino group is substituted to the 3 or 4-position based on the ether bond) with a tetracarboxylic acid dianhydride of formula III and subsequently subjecting the obtained polyamic acid to a thermal or chemical imidation reaction.

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