公开(公告)号：US20240314927A1

公开(公告)日：2024-09-19

申请号：US18604322

申请日：2024-03-13

Applicant: AT&S Austria Technologie & Systemtechnik AG

Inventor： Nina WANG ,  Artan BAFTIRI

IPC: H05K1/03 ,  H01L23/498

CPC classification number: H05K1/0373 ,  H01L23/49894 ,  H05K2201/0209 ,  H05K2201/0254 ,  H05K2201/0266

Abstract: A sheet for manufacturing a component carrier includes a first structure having first filler particles in a resin matrix, and a second structure stacked with the first structure and having second filler particles in a resin matrix, wherein a hollow volume in a respective one of the second filler particles is larger than in a respective one of the first filler particles.

公开(公告)号：US20180332719A1

公开(公告)日：2018-11-15

申请号：US15593610

申请日：2017-05-12

Applicant: International Business Machines Corporation

Inventor： Matthew S. DOYLE ,  Joseph KUCZYNSKI ,  Phillip V. MANN ,  Kevin M. O'CONNELL

IPC: H05K3/42 ,  H05K3/00 ,  H05K3/22

CPC classification number: H05K3/429 ,  H05K3/0047 ,  H05K3/0094 ,  H05K3/421 ,  H05K2201/0254 ,  H05K2201/09509 ,  H05K2201/09563

Abstract: A method and associated apparatus are disclosed for forming a conductive via that extends partly through a multi-layer assembly, wherein the method comprises forming a cavity from a surface of the multi-layer assembly to a first depth. The cavity extends through a plurality of layers of the multi-layer assembly. The plurality of layers comprises a healing layer comprising a plurality of microcapsules. Forming the cavity ruptures some of the plurality of microcapsules to release encapsulated material into the cavity. The released encapsulated material defines a second depth from the surface, the second depth being closer to the surface than the first depth. The method further comprises depositing conductive material within the cavity to form the conductive via that extends to the second depth.

公开(公告)号：US20150282329A1

公开(公告)日：2015-10-01

申请号：US14231454

申请日：2014-03-31

Applicant: Apple Inc.

Inventor： John J. Baker

IPC: H05K3/28 ,  H05K3/30

CPC classification number: H05K3/284 ,  B05D3/0254 ,  B05D3/067 ,  B05D3/108 ,  C09J5/00 ,  C09J2203/326 ,  C09J2205/302 ,  C09J2205/31 ,  H01L21/563 ,  H01L2224/16225 ,  H01L2924/181 ,  H05K1/0284 ,  H05K3/288 ,  H05K2201/0251 ,  H05K2201/0254 ,  H05K2203/0126 ,  H05K2203/0285 ,  H05K2203/0292 ,  H05K2203/0783 ,  H05K2203/092 ,  H05K2203/102 ,  H05K2203/107 ,  H05K2203/1163 ,  H05K2203/1194 ,  H01L2924/00012

Abstract: An electronic device may have housing structures, electrical components, and other electronic device structures. Adhesive may be used to join electronic device structures. Adhesive may be dispensed as liquid adhesive and cured to form adhesive joints. Adhesive joints may be debonded. Chain reactions may be initiated by applying a localized initiator such as a chemical or localized energy to the adhesive. Once initiated, the chain reaction may spread throughout the adhesive to cure the adhesive, to globally change adhesive viscosity, or to weaken the adhesive to facilitate debonding. Local changes to adhesive may also be made such as local increases and decreases to adhesive viscosity. Chain reaction curing may be used to cure adhesive or debond adhesive that is hidden from view within gaps in the electronic device structures. Viscosity changes may be used to control where adhesive flows.

Abstract translation: 电子设备可以具有壳体结构，电气部件和其他电子设备结构。 粘合剂可用于连接电子器件结构。 粘合剂可以作为液体粘合剂分配并固化以形成粘合剂接合部。 粘合接头可能脱粘。 可以通过将局部引发剂例如化学或局部化的能量施加到粘合剂来引发连锁反应。 一旦开始，连锁反应可能会蔓延到整个粘合剂中以固化粘合剂，从而全局地改变粘合剂粘度，或者削弱粘合剂以促进剥离。 还可以对粘合剂进行局部变化，例如局部增加和降低粘合剂粘度。 链反应固化可用于固化在电子设备结构的间隙内隐藏的粘合剂或脱粘合剂。 粘度变化可用于控制粘合剂流动的位置。

公开(公告)号：US20150156866A1

公开(公告)日：2015-06-04

申请号：US14559474

申请日：2014-12-03

Applicant: SAMSUNG SDI CO., LTD.

Inventor： Dae Seob SHIM ,  Young Kwon KOO ,  Dong Myeong SHIN ,  Do Sang LEE ,  Oh Hyeon HWANG ,  Kyoung Ku KANG

IPC: H05K1/02 ,  H05K1/03 ,  H05K3/00 ,  H05K1/09

CPC classification number: H05K1/0274 ,  H05K1/097 ,  H05K2201/0108 ,  H05K2201/0254 ,  H05K2201/026

Abstract: A transparent conductor, a method of fabricating the same, and an optical display, the transparent conductor including a base layer; and a conductive layer on the base layer, the conductive layer including metal nanowires and a matrix, wherein the matrix is prepared from a matrix composition, the matrix composition including inorganic hollow particles, a fluorine-containing monomer, or a mixture thereof.

Abstract translation: 透明导体，其制造方法和光学显示器，所述透明导体包括基底层; 以及基底层上的导电层，所述导电层包括金属纳米线和基体，其中所述基体由基质组合物制备，所述基质组合物包含无机中空颗粒，含氟单体或其混合物。

公开(公告)号：US20150079343A1

公开(公告)日：2015-03-19

申请号：US14387272

申请日：2013-03-25

Applicant: Sumitomo Electric Fine Polymer, Inc.

Inventor： Makoto Nakabayashi ,  Kazuaki Ikeda

IPC: H05K1/02 ,  H05K1/03

CPC classification number: H05K1/0271 ,  H05K1/024 ,  H05K1/0242 ,  H05K1/0306 ,  H05K1/0373 ,  H05K3/381 ,  H05K2201/015 ,  H05K2201/0209 ,  H05K2201/0254 ,  H05K2201/0358 ,  H05K2201/09136 ,  H05K2203/092 ,  Y10T428/24355 ,  Y10T428/249974

Abstract: The invention offers a fluororesin substrate that has a dielectric layer being mainly composed of fluororesin and being formed on a metal conductor, that sufficiently suppresses the occurrence of warpage at the time of the reflow, and that enables the exhibiting of sufficiently outstanding high-frequency characteristics, the dielectric layer including hollow glass beads; a fluororesin substrate that has a metal conductor having a surface roughness, Rz, of 2.0 μm or less; a fluororesin substrate that has fluororesin irradiated with an ionizing radiation at an exposure dose of 0.01 to 500 kGy; and a fluororesin substrate that has fluororesin being one or two or more of polytetrafluoroethylene (PTFE), a tetrafluoroethylene-perfluoroalkyl vinyl ether copolymer (PFA), a tetrafluoroethylene-hexafluoropropylene copolymer (FEP), and a tetrafluoroethylene-ethylene copolymer (ETFE).

Abstract translation: 本发明提供一种氟树脂基材，其具有主要由氟树脂组成的介电层，并形成在金属导体上，充分抑制了回流时的翘曲发生，并且能够表现出足够突出的高频特性 介电层包括中空玻璃珠; 具有2.0μm以下的表面粗糙度Rz的金属导体的氟树脂基板; 以0.01〜500kGy的曝光剂量照射电离辐射的氟树脂的氟树脂基材; 以及具有氟树脂为聚四氟乙烯（PTFE），四氟乙烯 - 全氟烷基乙烯基醚共聚物（PFA），四氟乙烯 - 六氟丙烯共聚物（FEP）和四氟乙烯 - 乙烯共聚物（ETFE）中的一种或两种以上的氟树脂基材。

公开(公告)号：US08217270B2

公开(公告)日：2012-07-10

申请号：US11990860

申请日：2006-08-18

Applicant: Tadahiro Ohmi ,  Akinobu Teramoto ,  Akihiro Morimoto

Inventor： Tadahiro Ohmi ,  Akinobu Teramoto ,  Akihiro Morimoto

IPC: H05K1/03

CPC classification number: H05K1/024 ,  H05K3/4602 ,  H05K3/4626 ,  H05K3/4673 ,  H05K2201/0116 ,  H05K2201/0195 ,  H05K2201/0209 ,  H05K2201/0254

Abstract: A multilayered circuit board which is provided with a low-permittivity interlayer insulating film, and which can significantly improve the performance such as signal transmission characteristics of the multilayered circuit board such as a package and a printed board, because the surface in contact with the interlayer insulating film of the circuit board has no unevenness to eliminate the lowering of production yield and the deterioration of high-frequency signal transmission characteristics; and electronic equipment using the circuit board. The multilayered circuit board comprises, mounted on a substrate, plural wiring layers and plural insulating layers positioned between the plural wiring layers, wherein at least part of the plural insulating layers are composed of a porous insulating layer containing at least any of materials selected from a porous material group consisting of porous material, aerogel, porous silica, porous polymer, hollow silica and hollow polymer, and a non-porous insulating layer formed on at least one surface of the porous insulating layer and not containing the porous material group.

Abstract translation: 具有低介电常数层间绝缘膜的多层电路板，能够显着地提高诸如封装和印刷电路板的多层电路板的信号传输特性等性能，因为与中间层 电路板的绝缘膜没有不均匀性，消除了生产成本的降低和高频信号传输特性的恶化; 和使用电路板的电子设备。 多层电路板包括安装在基板上的多个布线层和位于多个布线层之间的多个绝缘层，其中多个绝缘层的至少一部分由多孔绝缘层组成，多孔绝缘层至少含有选自 由多孔材料，气凝胶，多孔二氧化硅，多孔聚合物，中空二氧化硅和中空聚合物组成的多孔材料组和形成在多孔绝缘层的至少一个表面上并且不包含多孔材料组的无孔绝缘层。

公开(公告)号：US20120058917A1

公开(公告)日：2012-03-08

申请号：US12593770

申请日：2008-04-04

Applicant: Johannes Adrianus Gaken ,  Azim Mohamedali

Inventor： Johannes Adrianus Gaken ,  Azim Mohamedali

IPC: C40B30/06 ,  C12N5/10 ,  C40B50/00 ,  C12Q1/68 ,  C12N15/63 ,  C40B40/02

CPC classification number: B29C39/10 ,  H01B3/006 ,  H01G4/206 ,  H05K1/024 ,  H05K1/0373 ,  H05K1/162 ,  H05K2201/0116 ,  H05K2201/0209 ,  H05K2201/0218 ,  H05K2201/0254 ,  Y10T428/24967

Abstract: The invention relates to a nucleic acid comprising the following contiguous elements arranged in the 5 prime to 3 prime direction; a promoter; a selectable marker; a cloning site for receipt of a nucleic acid segment, said segment comprising a candidate miRNA target sequence; and a poly adenylation signal, said elements arranged such that a transcript directed by said promoter comprises said selectable marker, said candidate miRNA target sequence, and said poly adenylation signal in that order. Suitably the miRNA test sequence is or is derived from a 3′UTR. The invention also relates to methods for making and screening libraries.

Abstract translation: 本发明涉及一种核酸，其包含排列成5素质素至3个原子方向的以下邻接元件; 启动子 可选标记; 用于接收核酸片段的克隆位点，所述片段包含候选miRNA靶序列; 和聚腺苷酸化信号，所述元件排列成使得由所述启动子引导的转录物依次包含所述选择性标记，所述候选miRNA靶序列和所述多聚腺苷酸化信号。 适当地，miRNA测试序列是或源自3'UTR。 本发明还涉及制备和筛选文库的方法。

公开(公告)号：US20100159231A1

公开(公告)日：2010-06-24

申请号：US12645967

申请日：2009-12-23

Applicant: Chung-Kun CHO ,  Myung-Sup JUNG ,  Kwang-Hee KIM ,  Jae-Jun LEE ,  Kalinina FEDOSYA ,  Mahn Jong KIM ,  Chung Won PARK

Inventor： Chung-Kun CHO ,  Myung-Sup JUNG ,  Kwang-Hee KIM ,  Jae-Jun LEE ,  Kalinina FEDOSYA ,  Mahn Jong KIM ,  Chung Won PARK

IPC: C08K7/26 ,  C08K7/22 ,  C08K7/24 ,  B32B3/26 ,  C08K7/28

CPC classification number: H05K1/0373 ,  C08K5/1515 ,  C08K5/3415 ,  C08K7/28 ,  H05K2201/0209 ,  H05K2201/0254 ,  Y10T428/249953 ,  Y10T428/249971 ,  Y10T428/31678 ,  Y10T428/31681

Abstract: Disclosed is a thermosetting resin composition including a thermosetting aromatic oligomer represented by the following Chemical Formula 1, a hollow particle, and solvent, and a board comprising the same. In the above Chemical Formula 1, wherein B, L1, L2, Z1 and Z2 are the same as in defined in the specification.

Abstract translation: 公开了一种热固性树脂组合物，其包含由以下化学式1表示的热固性芳族低聚物，中空颗粒和溶剂，以及包含该热固性树脂组合物的板。 在上述化学式1中，其中B，L1，L2，Z1和Z2与说明书中定义相同。

公开(公告)号：US20100144924A1

公开(公告)日：2010-06-10

申请号：US12521502

申请日：2007-12-27

Applicant: Akihiko Yoshiwara ,  Junji Kodemura

Inventor： Akihiko Yoshiwara ,  Junji Kodemura

IPC: B05D5/12 ,  C08J9/32

CPC classification number: C08L65/00 ,  C08G61/08 ,  C08G2261/418 ,  C08J5/24 ,  C08J2365/00 ,  C08K3/36 ,  C08K7/26 ,  H01B3/448 ,  H05K1/0373 ,  H05K2201/0158 ,  H05K2201/0254

Abstract: A polymerizable composition is obtained by mixing a metathesis polymerization catalyst including benzylidene(1,3-dimethyl-4-imidazolidin-2-ylidene)(tricyclohexylphosphine)ruthenium dichloride, a cycloolefin monomer such as 2-norbornene or tetracyclo[6.2.1.13,6.02,7]dodec-4-ene, a chain transfer agent such as allyl methacrylate, and hollow particles such as Shirasu balloons. A crosslinkable resin composite is obtained by coating or impregnating the polymerizable composition onto or into a support medium, and carrying out bulk polymerization of the polymerizable composition. A crosslinked resin composite is obtained by crosslinking the crosslinkable resin composite.

Abstract translation: 通过将包含亚苄基（1,3-二甲基-4-咪唑烷-2-亚基）（三环己基膦）二氯化钌，易环烯烃单体如2-降冰片烯或四环[6.2.1.13,6.02 ，7]十二碳-4-烯，链转移剂如甲基丙烯酸烯丙酯和中空颗粒如白砂糖气球。 通过将可聚合组合物涂布或浸渍到载体介质上或浸渍到载体介质中并进行可聚合组合物的本体聚合来获得可交联树脂复合材料。 通过使交联性树脂复合体交联而得到交联树脂复合体。

公开(公告)号：US20090314419A1

公开(公告)日：2009-12-24

申请号：US12550178

申请日：2009-08-28

Applicant: Seung Hyun SOHN ,  Hyo-Soon Shin

Inventor： Seung Hyun SOHN ,  Hyo-Soon Shin

IPC: B32B37/00 ,  B05D5/12

CPC classification number: B32B7/04 ,  H05K1/0233 ,  H05K1/024 ,  H05K1/162 ,  H05K3/386 ,  H05K2201/0116 ,  H05K2201/0195 ,  H05K2201/0209 ,  H05K2201/0254 ,  H05K2201/0355 ,  H05K2201/086 ,  H05K2201/09309 ,  Y10T428/24917 ,  Y10T428/249994 ,  Y10T428/256

Abstract: A printed circuit board material for embedded passive devices, which has excellent electromagnetic properties and reliability is provided. The invention provides a printed circuit board material comprises: a conductive copper foil layer; a resin bonding layer formed on the conductive layer and including above 70-100 vol % of resin and 0-30 vol % of filler; and a functional layer formed on the resin bonding layer and including resin and filler. The printed circuit board material has the resin bonding layer interposed between the copper foil layer and the functional layer. Thus, even when the content of fillers in the functional layer is increased, the adhesion strength between the conductive layer and the functional layer is ensured without deteriorating the properties of the functional layer, such as dielectric and magnetic properties.

Abstract translation: 提供了一种具有优异的电磁特性和可靠性的嵌入式无源器件印刷电路板材料。 本发明提供一种印刷电路板材料，包括：导电铜箔层; 形成在导电层上的树脂粘结层，包括70-100体积％的树脂和0-30体积％的填料; 以及形成在树脂粘合层上并包括树脂和填料的功能层。 印刷电路板材料具有插入在铜箔层和功能层之间的树脂粘合层。 因此，即使功能层中的填料的含量增加，也可以确保导电层与功能层之间的粘合强度，而不会劣化功能层的性质，例如电介质和磁性。