Wiring circuit board and fuel cell
    153.
    发明专利
    Wiring circuit board and fuel cell 审中-公开
    接线电路板和燃料电池

    公开(公告)号:JP2008300238A

    公开(公告)日:2008-12-11

    申请号:JP2007145953

    申请日:2007-05-31

    Abstract: PROBLEM TO BE SOLVED: To provide a wiring circuit board in which corrosion of a conductor layer is prevented, and a fuel cell equipped with it.
    SOLUTION: An FPC board 1 is equipped with a base insulating layer 2 composed of for example polyimide. The conductor layer 3 composed of for example copper is formed on one face of the base insulating layer 2. The conductor layer 3 is composed of a pair of a rectangular current collecting parts 3a, 3b and extraction conductor parts 4a, 4b extended in a long length shape from the current collecting parts 3a, 3b. Covering layers 6a, 6b are formed on the base insulating layer 2 so as to cover the conductor layer 3. The covering layer 6a is formed so as to cover the current collecting part 3a and the extraction conductor part 4a of the conductor layer 3, and the covering layer 6b is formed so as to cover the current collecting part 3b and the extraction conductor part 4b of the conductor 3. The covering layers 6a, 6b is composed of a resin composition containing carbon.
    COPYRIGHT: (C)2009,JPO&INPIT

    Abstract translation: 要解决的问题:提供防止导体层腐蚀的布线电路板和配备有导体层的燃料电池。 解决方案:FPC基板1配备有由例如聚酰亚胺构成的基底绝缘层2。 由例如铜构成的导体层3形成在基极绝缘层2的一个面上。导体层3由一对矩形集电部分3a,3b和延长延伸的引出导体部分4a,4b组成 来自集电部3a,3b的长度形状。 覆盖层6a,6b形成在基底绝缘层2上以覆盖导体层3.覆盖层6a形成为覆盖导体层3的集电部分3a和提取导体部分4a,并且 覆盖层6b形成为覆盖导体3的集电部3b和引出导体部4b。覆盖层6a,6b由含有碳的树脂组合物构成。 版权所有(C)2009,JPO&INPIT

    Electronic component packaging system and electronic component packaging method
    155.
    发明专利
    Electronic component packaging system and electronic component packaging method 有权
    电子元件包装系统和电子元件包装方法

    公开(公告)号:JP2008066626A

    公开(公告)日:2008-03-21

    申请号:JP2006245229

    申请日:2006-09-11

    Abstract: PROBLEM TO BE SOLVED: To provide an electronic component packaging system and an electronic component packaging method in which packaging quality can be ensured in case of a such a substrate as the amount of solder is deficient owing to poor printing. SOLUTION: In a packaging system comprising a device for measuring the height of solder paste printed on an electrode and an electronic component mounting device, a decision is made whether the height of a solder paste is correct or not based on the measurement of the height of solder paste printed on the electrode, a decision is further made whether transfer of solder paste to the solder bump is required or not based on the judgment results, and the paste is transferred to an electronic component held on a mounting head if it is required. Consequently, a proper amount of solder is added in case of such a substrate as the amount of solder is deficient owing to poor printing, and packaging quality can be ensured. COPYRIGHT: (C)2008,JPO&INPIT

    Abstract translation: 要解决的问题:提供一种电子部件包装系统和电子部件包装方法,其中在由于打印不良而导致的焊料量不足的情况下可以确保包装质量。 解决方案:在包括用于测量印刷在电极上的焊膏的高度的装置和电子部件安装装置的包装系统中,基于测量值来确定焊膏的高度是否正确 印刷在电极上的焊膏的高度,进一步决定是否需要根据判断结果将焊膏传递到焊料凸块,并且如果糊状物被传送到保持在安装头上的电子部件 是必须的。 因此,由于印刷不良,在焊料量不足的基板的情况下,添加适量的焊料,能够确保包装质量。 版权所有(C)2008,JPO&INPIT

    CIRCUIT BOARD AND ELECTRONIC APPARATUS PROVIDED WITH SAME
    158.
    发明公开
    CIRCUIT BOARD AND ELECTRONIC APPARATUS PROVIDED WITH SAME 审中-公开
    LELERPLATTE UND ELEKTRONISCHE VORRICHTUNG DAMIT

    公开(公告)号:EP2773169A1

    公开(公告)日:2014-09-03

    申请号:EP12842736.6

    申请日:2012-09-28

    Abstract: [Object] To provide a circuit board having good heat dissipation characteristics capable of promptly dissipating the heat generated by a metal wiring layer on the basis of operations of an electronic component and exhibiting high reliability enabling a long term of use by improving the adhesion strength between a ceramic sintered body and a metal wiring layer and, thereby, reducing peeling of the metal wiring layer due to cooling/heating cycles when operation and non-operation of the electronic component are repeated, and an electronic apparatus in which an electronic component is mounted on the circuit board.
    [Solution] A circuit board is provided with a metal wiring layer 12 on at least one principal surface of a ceramic sintered body 11, wherein the above-described metal wiring layer includes a first region 12a which is in contact with the principal surface and which contains a glass component and a second region 12b which is located on the first region 12a and which does not contain a glass component, the thickness of the first region 12a is 35% or more and 70% or less of the thickness of the metal wiring layer 12, and the average grain size in the first region 12b is smaller than the average grain size in the second region 12b.

    Abstract translation: 本发明提供一种具有良好的散热特性的电路板,其能够基于电子部件的操作迅速地消散由金属布线层产生的热量,并且具有高的可靠性,能够长期使用,从而提高第 陶瓷烧结体和金属布线层,并且由此在电子部件的操作和不操作被重复时由于冷却/加热循环而减少金属布线层的剥离;以及电子装置,其中安装电子部件 在电路板上。 电路板在陶瓷烧结体11的至少一个主面上设置有金属布线层12,其中上述金属布线层包括与主面接触的第一区域12a, 包含位于第一区域12a上并且不含有玻璃成分的玻璃成分和第二区域12b,第一区域12a的厚度为金属布线的厚度的35%以上且70%以下 层12,第一区域12b的平均粒径小于第二区域12b的平均粒径。

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