公开(公告)号：JP4693861B2

公开(公告)日：2011-06-01

申请号：JP2008095412

申请日：2008-04-01

Applicant: サムソン エレクトロ−メカニックス カンパニーリミテッド.

Inventor： 應 碩 李 ,  彰 燮 柳 ,  濟 光 柳 ,  智 秀 睦 ,  俊 午 黄

IPC: H05K1/09 ,  H05K1/02 ,  H05K1/11 ,  H05K3/40

CPC classification number: H05K3/4069 ,  B82Y10/00 ,  H05K1/0206 ,  H05K1/0209 ,  H05K3/06 ,  H05K3/249 ,  H05K3/427 ,  H05K3/4614 ,  H05K3/4647 ,  H05K2201/026 ,  H05K2201/0347 ,  H05K2201/035 ,  H05K2201/096 ,  Y10T428/24851

公开(公告)号：JPWO2007139076A1

公开(公告)日：2009-10-08

申请号：JP2007558252

申请日：2007-05-28

Applicant: 株式会社フジクラ

Inventor： 修造 平田 ,  修造 平田 ,  朗伸 小野 ,  朗伸 小野

IPC: H05K1/11 ,  H01R12/50 ,  H05K1/09

CPC classification number: H05K1/117 ,  H05K1/095 ,  H05K3/247 ,  H05K3/28 ,  H05K2201/035 ,  H05K2201/0769 ,  H05K2201/09436 ,  H05K2201/09709

Abstract: 配線基板は、基板と、基板の一面に形成された導電回路と、この導電回路を覆う絶縁層を備える。配線基板の嵌合部では、絶縁層に導電回路の一部を露呈させる開口部が形成される。開口部で導電回路の一部が露呈面として絶縁層から露呈される。導電回路の露呈面の上には、導電性の部材からなる電極が形成される。電極は、下面で導電回路と接し、上面では導電回路の配線幅方向Wにおいて、絶縁層の一部も覆うように広げられる。

公开(公告)号：JP2008300238A

公开(公告)日：2008-12-11

申请号：JP2007145953

申请日：2007-05-31

Applicant: Nitto Denko Corp ,  日東電工株式会社

Inventor： YAMAZAKI HIROSHI ,  SUEYOSHI HIROKI

IPC: H01M8/02 ,  H01M8/10

CPC classification number: H05K3/249 ,  H01M8/0206 ,  H01M8/0221 ,  H01M8/0228 ,  H01M8/04201 ,  H01M8/1011 ,  H01M8/1097 ,  H05K1/0272 ,  H05K1/16 ,  H05K3/06 ,  H05K2201/035 ,  H05K2201/056 ,  Y02E60/523

Abstract: PROBLEM TO BE SOLVED: To provide a wiring circuit board in which corrosion of a conductor layer is prevented, and a fuel cell equipped with it.
SOLUTION: An FPC board 1 is equipped with a base insulating layer 2 composed of for example polyimide. The conductor layer 3 composed of for example copper is formed on one face of the base insulating layer 2. The conductor layer 3 is composed of a pair of a rectangular current collecting parts 3a, 3b and extraction conductor parts 4a, 4b extended in a long length shape from the current collecting parts 3a, 3b. Covering layers 6a, 6b are formed on the base insulating layer 2 so as to cover the conductor layer 3. The covering layer 6a is formed so as to cover the current collecting part 3a and the extraction conductor part 4a of the conductor layer 3, and the covering layer 6b is formed so as to cover the current collecting part 3b and the extraction conductor part 4b of the conductor 3. The covering layers 6a, 6b is composed of a resin composition containing carbon.
COPYRIGHT: (C)2009,JPO&INPIT

Abstract translation: 要解决的问题：提供防止导体层腐蚀的布线电路板和配备有导体层的燃料电池。 解决方案：FPC基板1配备有由例如聚酰亚胺构成的基底绝缘层2。 由例如铜构成的导体层3形成在基极绝缘层2的一个面上。导体层3由一对矩形集电部分3a，3b和延长延伸的引出导体部分4a，4b组成 来自集电部3a，3b的长度形状。 覆盖层6a，6b形成在基底绝缘层2上以覆盖导体层3.覆盖层6a形成为覆盖导体层3的集电部分3a和提取导体部分4a，并且 覆盖层6b形成为覆盖导体3的集电部3b和引出导体部4b。覆盖层6a，6b由含有碳的树脂组合物构成。 版权所有（C）2009，JPO＆INPIT

公开(公告)号：JP4170335B2

公开(公告)日：2008-10-22

申请号：JP2005363827

申请日：2005-12-16

Applicant: インターナショナル・ビジネス・マシーンズ・コーポレーションInternational Business Maschines Corporation

Inventor： 靖彦 塩田 ,  英夫 木村 ,  利之 横上

IPC: H01L23/12

CPC classification number: H05K3/3484 ,  H01L24/11 ,  H01L24/75 ,  H01L2224/11822 ,  H01L2224/13099 ,  H01L2224/136 ,  H01L2224/75 ,  H01L2224/7515 ,  H01L2224/758 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01033 ,  H01L2924/01075 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/3025 ,  H05K3/1275 ,  H05K2201/035 ,  H05K2201/10734 ,  H05K2203/0139 ,  H05K2203/0143 ,  H05K2203/0534

公开(公告)号：JP2008066626A

公开(公告)日：2008-03-21

申请号：JP2006245229

申请日：2006-09-11

Applicant: Matsushita Electric Ind Co Ltd ,  松下電器産業株式会社

Inventor： OKAMOTO KAZUO ,  NISHI SHOICHI ,  MORITA TAKESHI ,  HIYOSHI MASAYOSHI ,  TOMOYASU KAZUHIKO

IPC: H05K3/34 ,  H05K13/04

CPC classification number: H05K3/3484 ,  H01L2224/81 ,  H05K3/1216 ,  H05K3/3436 ,  H05K2201/035 ,  H05K2201/10734 ,  H05K2203/0338 ,  H05K2203/163 ,  Y02P70/613

Abstract: PROBLEM TO BE SOLVED: To provide an electronic component packaging system and an electronic component packaging method in which packaging quality can be ensured in case of a such a substrate as the amount of solder is deficient owing to poor printing. SOLUTION: In a packaging system comprising a device for measuring the height of solder paste printed on an electrode and an electronic component mounting device, a decision is made whether the height of a solder paste is correct or not based on the measurement of the height of solder paste printed on the electrode, a decision is further made whether transfer of solder paste to the solder bump is required or not based on the judgment results, and the paste is transferred to an electronic component held on a mounting head if it is required. Consequently, a proper amount of solder is added in case of such a substrate as the amount of solder is deficient owing to poor printing, and packaging quality can be ensured. COPYRIGHT: (C)2008,JPO&INPIT

Abstract translation: 要解决的问题：提供一种电子部件包装系统和电子部件包装方法，其中在由于打印不良而导致的焊料量不足的情况下可以确保包装质量。 解决方案：在包括用于测量印刷在电极上的焊膏的高度的装置和电子部件安装装置的包装系统中，基于测量值来确定焊膏的高度是否正确 印刷在电极上的焊膏的高度，进一步决定是否需要根据判断结果将焊膏传递到焊料凸块，并且如果糊状物被传送到保持在安装头上的电子部件 是必须的。 因此，由于印刷不良，在焊料量不足的基板的情况下，添加适量的焊料，能够确保包装质量。 版权所有（C）2008，JPO＆INPIT

公开(公告)号：JP2006074008A

公开(公告)日：2006-03-16

申请号：JP2005203725

申请日：2005-07-12

Applicant: E I Du Pont De Nemours & Co ,  イー・アイ・デュポン・ドウ・ヌムール・アンド・カンパニーE.I.Du Pont De Nemours And Company

Inventor： BACHER RUDOLPH J ,  NEEDES CHRISTOPHER R ,  ORZEL ANTHONY J

IPC: H05K3/24 ,  H05K3/12

CPC classification number: H05K1/092 ,  H01L24/80 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01019 ,  H01L2924/0102 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01038 ,  H01L2924/0104 ,  H01L2924/01047 ,  H01L2924/01056 ,  H01L2924/01072 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/09701 ,  H01L2924/12042 ,  H01L2924/15787 ,  H05K3/248 ,  H05K3/4061 ,  H05K2201/035 ,  H01L2924/00

Abstract: PROBLEM TO BE SOLVED: To provide a method for manufacturing a ceramic substrate that demonstrate superior adhesion characteristics when a mounted component is soldered to a metallized part of a substrate surface, and that provide superior stability when a completed circuit is exposed to high-temperature storage conditions. SOLUTION: A method for forming an electronic circuit comprises a step (a) for coating the substrate with a first conductive composition, a step (b) for drying the first conductive composition to form a dried first metal layer, a step (c) for forming a first calcined metal conductive layer of a calcined double metal layer, a step (d) for coating the first calcined conductive metal layer with a second conductive composition so that the first calcined metal layer is covered with the second conductive composition, a step (e) for drying the second conductive composition to form a second dried metal layer, and a step (f) for calcining the second dried metal layer to form a second layer of the double metal layer. COPYRIGHT: (C)2006,JPO&NCIPI

Abstract translation: 要解决的问题：提供一种制造陶瓷基板的方法，当将安装的部件焊接到基板表面的金属化部分时，其表现出优异的粘合特性，并且当完成的电路暴露于高电平时提供优异的稳定性 温度保存条件。 解决方案：一种形成电子电路的方法包括用第一导电组合物涂覆衬底的步骤（a），用于干燥第一导电组合物以形成干燥的第一金属层的步骤（b），步骤 c）用于形成煅烧双金属层的第一煅烧金属导电层，步骤（d），用于用第二导电组合物涂覆第一煅烧导电金属层，以使第一煅烧金属层被第二导电组合物覆盖， 用于干燥第二导电组合物以形成第二干燥金属层的步骤（e）和用于煅烧第二干燥金属层以形成双金属层的第二层的步骤（f）。 版权所有（C）2006，JPO＆NCIPI

公开(公告)号：JP3721982B2

公开(公告)日：2005-11-30

申请号：JP2000368046

申请日：2000-12-04

Applicant: 松下電器産業株式会社

Inventor： 眞治 中村 ,  勇一郎 杉田 ,  敏昭 竹中 ,  英明 菰田 ,  利浩 西井 ,  俊和 近藤

IPC: B05D7/00 ,  B05C11/04 ,  B05D7/24 ,  H05K1/09 ,  H05K3/12 ,  H05K3/24 ,  H05K3/40 ,  H05K3/46

CPC classification number: H05K3/4069 ,  H05K1/095 ,  H05K3/1233 ,  H05K3/247 ,  H05K2201/035 ,  H05K2201/0355 ,  H05K2203/1461 ,  H05K2203/1476 ,  Y10T29/49155 ,  Y10T29/49165

公开(公告)号：EP2773169A1

公开(公告)日：2014-09-03

申请号：EP12842736.6

申请日：2012-09-28

Applicant: Kyocera Corporation

Inventor： NAKAMURA,Kiyotaka ,  OHASHI,Yoshio ,  SHIKATA,Kunihide

IPC: H05K1/09 ,  H05K3/24

CPC classification number: H05K1/09 ,  C04B41/009 ,  C04B41/52 ,  C04B41/90 ,  C04B2111/00405 ,  C04B2111/00844 ,  H01L23/15 ,  H01L23/3731 ,  H01L23/3735 ,  H01L23/3736 ,  H01L2924/0002 ,  H05K1/0306 ,  H05K1/092 ,  H05K3/245 ,  H05K3/38 ,  H05K2201/0269 ,  H05K2201/0338 ,  H05K2201/035 ,  H05K2203/1126 ,  C04B35/00 ,  C04B35/10 ,  C04B35/185 ,  C04B35/48 ,  C04B35/581 ,  C04B35/584 ,  C04B41/4539 ,  C04B41/4572 ,  C04B41/5022 ,  C04B41/5127 ,  C04B41/5116 ,  C04B41/522 ,  C04B41/5155 ,  H01L2924/00

Abstract: [Object] To provide a circuit board having good heat dissipation characteristics capable of promptly dissipating the heat generated by a metal wiring layer on the basis of operations of an electronic component and exhibiting high reliability enabling a long term of use by improving the adhesion strength between a ceramic sintered body and a metal wiring layer and, thereby, reducing peeling of the metal wiring layer due to cooling/heating cycles when operation and non-operation of the electronic component are repeated, and an electronic apparatus in which an electronic component is mounted on the circuit board.
[Solution] A circuit board is provided with a metal wiring layer 12 on at least one principal surface of a ceramic sintered body 11, wherein the above-described metal wiring layer includes a first region 12a which is in contact with the principal surface and which contains a glass component and a second region 12b which is located on the first region 12a and which does not contain a glass component, the thickness of the first region 12a is 35% or more and 70% or less of the thickness of the metal wiring layer 12, and the average grain size in the first region 12b is smaller than the average grain size in the second region 12b.

Abstract translation: 本发明提供一种具有良好的散热特性的电路板，其能够基于电子部件的操作迅速地消散由金属布线层产生的热量，并且具有高的可靠性，能够长期使用，从而提高第 陶瓷烧结体和金属布线层，并且由此在电子部件的操作和不操作被重复时由于冷却/加热循环而减少金属布线层的剥离;以及电子装置，其中安装电子部件 在电路板上。 电路板在陶瓷烧结体11的至少一个主面上设置有金属布线层12，其中上述金属布线层包括与主面接触的第一区域12a， 包含位于第一区域12a上并且不含有玻璃成分的玻璃成分和第二区域12b，第一区域12a的厚度为金属布线的厚度的35％以上且70％以下 层12，第一区域12b的平均粒径小于第二区域12b的平均粒径。

公开(公告)号：EP2234466A4

公开(公告)日：2013-07-10

申请号：EP08865333

申请日：2008-12-24

Applicant: FUJIKURA LTD

Inventor： SAGAWA TOMOHARU ,  KUME ATSUSHI

IPC: H05K3/34 ,  H05K1/09 ,  H05K1/11 ,  H05K3/24 ,  H05K3/30

CPC classification number: H05K3/3442 ,  H05K1/095 ,  H05K1/111 ,  H05K3/247 ,  H05K3/305 ,  H05K2201/035 ,  H05K2201/10636 ,  H05K2201/10977 ,  Y02P70/611 ,  Y02P70/613 ,  Y10T29/4913

Abstract: A mounting board of the invention includes: an insulative base; a plurality of first conductive elements provided on the insulative base and having lands; a plurality of second conductive elements disposed on the lands; a plurality of solder pieces each disposed on each of the second conductive elements; and an electronic component which includes electrode sections each contacting each of the solder pieces, wherein the first conductive elements are made from a first element that contains at least silver; the second conductive elements are made from a second element that contains at least copper; and the solder pieces are made from a third element that contains at least tin.

公开(公告)号：EP2009968A4

公开(公告)日：2012-12-05

申请号：EP08720606

申请日：2008-03-26

Applicant: PANASONIC CORP

Inventor： ASAHI TOSHIYUKI ,  SHIMASAKI YUKIHIRO ,  ECHIGO FUMIO

IPC: H05K1/02 ,  H05K7/20

CPC classification number: H05K1/0209 ,  H01L2224/16225 ,  H01L2924/00014 ,  H05K3/202 ,  H05K3/28 ,  H05K3/284 ,  H05K3/285 ,  H05K2201/0209 ,  H05K2201/035 ,  H01L2224/0401

Abstract: A wiring board includes an insulating board having a top surface arranged to have an electronic component mounted thereto, a conductor pattern formed on the top surface of the insulating board, and a heat emitting layer made of heat-emitting material covering the conductor pattern. The heat-emitting material has an emissivity not less than 0.8 for an electromagnetic wave having a wavelength » = 0.002898/T at a temperature T ranging from 293K to 473K. This wiring board suppresses the temperature rise of the electronic component.