Abstract:
PROBLEM TO BE SOLVED: To provide a wiring circuit board in which corrosion of a conductor layer is prevented, and a fuel cell equipped with it. SOLUTION: An FPC board 1 is equipped with a base insulating layer 2 composed of for example polyimide. The conductor layer 3 composed of for example copper is formed on one face of the base insulating layer 2. The conductor layer 3 is composed of a pair of a rectangular current collecting parts 3a, 3b and extraction conductor parts 4a, 4b extended in a long length shape from the current collecting parts 3a, 3b. Covering layers 6a, 6b are formed on the base insulating layer 2 so as to cover the conductor layer 3. The covering layer 6a is formed so as to cover the current collecting part 3a and the extraction conductor part 4a of the conductor layer 3, and the covering layer 6b is formed so as to cover the current collecting part 3b and the extraction conductor part 4b of the conductor 3. The covering layers 6a, 6b is composed of a resin composition containing carbon. COPYRIGHT: (C)2009,JPO&INPIT
Abstract:
PROBLEM TO BE SOLVED: To provide an electronic component packaging system and an electronic component packaging method in which packaging quality can be ensured in case of a such a substrate as the amount of solder is deficient owing to poor printing. SOLUTION: In a packaging system comprising a device for measuring the height of solder paste printed on an electrode and an electronic component mounting device, a decision is made whether the height of a solder paste is correct or not based on the measurement of the height of solder paste printed on the electrode, a decision is further made whether transfer of solder paste to the solder bump is required or not based on the judgment results, and the paste is transferred to an electronic component held on a mounting head if it is required. Consequently, a proper amount of solder is added in case of such a substrate as the amount of solder is deficient owing to poor printing, and packaging quality can be ensured. COPYRIGHT: (C)2008,JPO&INPIT
Abstract:
PROBLEM TO BE SOLVED: To provide a method for manufacturing a ceramic substrate that demonstrate superior adhesion characteristics when a mounted component is soldered to a metallized part of a substrate surface, and that provide superior stability when a completed circuit is exposed to high-temperature storage conditions. SOLUTION: A method for forming an electronic circuit comprises a step (a) for coating the substrate with a first conductive composition, a step (b) for drying the first conductive composition to form a dried first metal layer, a step (c) for forming a first calcined metal conductive layer of a calcined double metal layer, a step (d) for coating the first calcined conductive metal layer with a second conductive composition so that the first calcined metal layer is covered with the second conductive composition, a step (e) for drying the second conductive composition to form a second dried metal layer, and a step (f) for calcining the second dried metal layer to form a second layer of the double metal layer. COPYRIGHT: (C)2006,JPO&NCIPI
Abstract:
[Object] To provide a circuit board having good heat dissipation characteristics capable of promptly dissipating the heat generated by a metal wiring layer on the basis of operations of an electronic component and exhibiting high reliability enabling a long term of use by improving the adhesion strength between a ceramic sintered body and a metal wiring layer and, thereby, reducing peeling of the metal wiring layer due to cooling/heating cycles when operation and non-operation of the electronic component are repeated, and an electronic apparatus in which an electronic component is mounted on the circuit board. [Solution] A circuit board is provided with a metal wiring layer 12 on at least one principal surface of a ceramic sintered body 11, wherein the above-described metal wiring layer includes a first region 12a which is in contact with the principal surface and which contains a glass component and a second region 12b which is located on the first region 12a and which does not contain a glass component, the thickness of the first region 12a is 35% or more and 70% or less of the thickness of the metal wiring layer 12, and the average grain size in the first region 12b is smaller than the average grain size in the second region 12b.
Abstract:
A mounting board of the invention includes: an insulative base; a plurality of first conductive elements provided on the insulative base and having lands; a plurality of second conductive elements disposed on the lands; a plurality of solder pieces each disposed on each of the second conductive elements; and an electronic component which includes electrode sections each contacting each of the solder pieces, wherein the first conductive elements are made from a first element that contains at least silver; the second conductive elements are made from a second element that contains at least copper; and the solder pieces are made from a third element that contains at least tin.
Abstract:
A wiring board includes an insulating board having a top surface arranged to have an electronic component mounted thereto, a conductor pattern formed on the top surface of the insulating board, and a heat emitting layer made of heat-emitting material covering the conductor pattern. The heat-emitting material has an emissivity not less than 0.8 for an electromagnetic wave having a wavelength » = 0.002898/T at a temperature T ranging from 293K to 473K. This wiring board suppresses the temperature rise of the electronic component.