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    Multi-chips module assembly package
    152.
    发明申请
    Multi-chips module assembly package 有权
    多芯片模块组装包装

    公开(公告)号：US20050098868A1

    公开(公告)日：2005-05-12

    申请号：US10704793

    申请日：2003-11-12

    Applicant: Chih-Huang Chang ,  Shih-Chang Lee

    Inventor： Chih-Huang Chang ,  Shih-Chang Lee

    IPC: H01L25/10 ,  H05K1/14 ,  H05K3/34 ,  H05K3/42 ,  H01L23/02

    CPC classification number: H05K1/144 ,  H01L25/105 ,  H01L2224/16225 ,  H01L2225/1023 ,  H01L2225/107 ,  H01L2924/01078 ,  H01L2924/15311 ,  H05K1/141 ,  H05K3/3436 ,  H05K3/429 ,  H05K2201/045 ,  H05K2201/0959 ,  H05K2201/09645 ,  H05K2201/10378

    Abstract: A multi-chips module assembly package mainly comprises a first package, a second package and an intermediate substrate. The intermediate substrate includes an opening, at least a via and a plurality of circuit layers, wherein the second package is accommodated in the opening. The via has an inner wall, and a plurality of separated electrically conductive layers, which is formed on the inner wall and connected with the corresponding circuit layers. The first package electrically connects with the second package through the intermediate substrate, and the intermediate substrate is interposed between the first package and the second package. At least an insulator is formed in the via, and the separated electrically conductive layers are separated from each other. After the intermediate substrate is interposed between the first package and the second package, there will be not enough space between the intermediate substrate, the first package and the second package for disposing conductive devices therein. Therefore, the first package will be electrically connected to the second package through the separated electrically conductive layers of the intermediate substrate for providing more conductive devices disposed and interposed between the intermediate substrate, the first package and the second package.

    Abstract translation: 多芯片模块组装封装主要包括第一封装，第二封装和中间基板。 中间基板包括开口，至少通孔和多个电路层，其中第二封装容纳在开口中。 通孔具有内壁和多个分离的导电层，其形成在内壁上并与相应的电路层连接。 第一包装通过中间基板与第二包装电连接，并且中间基板插入在第一包装和第二包装之间。 至少在通孔中形成绝缘体，并且分离的导电层彼此分离。 在中间基板插入在第一封装和第二封装之间之后，中间基板，第一封装和第二封装之间将没有足够的空间用于在其中设置导电器件。 因此，第一封装将通过中间衬底的分离的导电层电连接到第二封装，用于提供设置和介于中间衬底，第一封装和第二封装之间的更多导电器件。

    Industry computer structure with two expansive forms
    154.
    发明申请
    Industry computer structure with two expansive forms 审中-公开
    行业计算机结构有两种膨胀形式

    公开(公告)号：US20050013112A1

    公开(公告)日：2005-01-20

    申请号：US10892110

    申请日：2004-07-16

    Applicant: Chein Lin

    Inventor： Chein Lin

    IPC: G06F1/18 ,  H05K1/14 ,  G06F1/16

    CPC classification number: H05K1/14 ,  G06F1/18 ,  G06F1/181 ,  H05K2201/045

    Abstract: An industry computer structure includes a seat (1) and a cover (2) attached to each other to form a receiving space (A). A side cover (5) is attached to the seat (1) and the cover (2) to close the receiving space (A). A main board (31) is secured on the seat (1). A second socket (34) is mounted on the main board (31) and provided for multiple first expansion cards (4A) separately piled one after one under a standard of PC104/104-plus. A connector (35) is mounted to the first side of the main board (31) and a bridge card (36) is partially inserted into the connector (35). The bridge card (36) includes multiple expansion connectors (361) sequentially mounted thereto and provided for multiple second expansion cards (4B) being mounted on the bridge card (36) under a standard of PCI/ISA.

    Abstract translation: 工业计算机结构包括彼此附接以形成容纳空间（A）的座（1）和盖（2）。 侧盖（5）安装在座（1）和盖（2）上，以封闭接收空间（A）。 主板（31）固定在座椅（1）上。 第二插座（34）安装在主板（31）上并且被设置用于多个第一扩展卡（4A），其在PC104 / 104-plus的标准之下分开堆放。 连接器（35）安装到主板（31）的第一侧，并且桥接卡（36）部分地插入连接器（35）中。 桥卡（36）包括顺序地安装到其上的多个扩展连接器（361），并且以PCI / ISA标准安装在桥卡（36）上的多个第二扩展卡（4B）提供。

    Power module adapter
    155.
    发明授权
    Power module adapter 有权
    电源模块适配器

    公开(公告)号：US06778405B2

    公开(公告)日：2004-08-17

    申请号：US09964151

    申请日：2001-09-25

    Applicant: Jeffrey Boylan ,  Carl Milton Wildrick ,  Gordon K. Y. Lee

    Inventor： Jeffrey Boylan ,  Carl Milton Wildrick ,  Gordon K. Y. Lee

    IPC: H05K706

    CPC classification number: H05K1/141 ,  H05K1/0295 ,  H05K3/3421 ,  H05K3/3447 ,  H05K2201/045 ,  H05K2201/049 ,  H05K2201/09954

    Abstract: The adapter couples a power module to a circuit board. An adapter embodying the present invention can be configured to allow the connection of any power module regardless of pin out to any circuit board. Signal modifying circuitry can also be added to the adapter to enhance or simply modify the signal to the end user's circuit board. The modifying circuitry can act on either the input to the adapter or the output from the adapter. At least one conductive path couples the input interconnects and the output interconnects.

    Abstract translation: 适配器将电源模块连接到电路板。 体现本发明的适配器可以被配置为允许任何电源模块的连接，而不管引脚到任何电路板。 信号修改电路也可以添加到适配器，以增强或简单地将信号修改到终端用户的电路板。 修改电路可以作用于适配器的输入或适配器的输出。 至少一个导电路径耦合输入互连和输出互连。

    Semiconductor assembly with a semiconductor module
    156.
    发明申请
    Semiconductor assembly with a semiconductor module 失效
    具有半导体模块的半导体组件

    公开(公告)号：US20030193085A1

    公开(公告)日：2003-10-16

    申请号：US10414837

    申请日：2003-04-16

    Inventor： Jurgen Hogerl ,  Erich Syri

    IPC: H01L023/02

    CPC classification number: H05K1/141 ,  H01L25/0655 ,  H01L2924/0002 ,  H05K3/301 ,  H05K3/366 ,  H05K2201/045 ,  H05K2201/10159 ,  H05K2201/10189 ,  H01L2924/00

    Abstract: A semiconductor assembly includes a module holder and a semiconductor module, which has a board substrate with conductor tracks and one or more unpackaged semiconductor chips mounted on the substrate, which are connected to conductor tracks on the substrate by electrical contacts. The substrate has at one edge at least one contact strip with connection contact areas, which are connected to at least some of the conductor tracks. The module holder has a plug-in connection for the electrical connection to other components, at least one mating contact strip for the connection to the contact strip of the at least one semiconductor module and electrical conductors between the contact areas of the at least one semiconductor module and electrical contacts of the plug-in connection. The configuration allows semiconductor modules to be connected to the outside world in an economical way.

    Abstract translation: 半导体组件包括模块保持器和半导体模块，其具有带有导体轨迹的板基板和安装在基板上的一个或多个未封装的半导体芯片，其通过电触点连接到基板上的导体轨道。 衬底在一个边缘处具有至少一个具有连接接触区域的接触片，其连接到至少一些导体轨道。 模块保持器具有用于与其他部件的电连接的插入式连接，用于连接至少一个半导体模块的接触条的至少一个配合接触条和至少一个半导体的接触区之间的电导体 插头连接的模块和电气触点。 该配置允许半导体模块以经济的方式连接到外部世界。

    High density, high frequency memory chip modules having thermal management structures
    157.
    发明授权
    High density, high frequency memory chip modules having thermal management structures 有权
    具有热管理结构的高密度高频存储器芯片模块

    公开(公告)号：US06480014B1

    公开(公告)日：2002-11-12

    申请号：US09781089

    申请日：2001-01-12

    Applicant: Che-yu Li ,  Thomas L. Sly ,  Weimin Shi

    Inventor： Che-yu Li ,  Thomas L. Sly ,  Weimin Shi

    IPC: G01R3102

    CPC classification number: G11C5/143 ,  G11C5/00 ,  H05K1/0203 ,  H05K1/141 ,  H05K3/3447 ,  H05K3/366 ,  H05K2201/045 ,  H05K2201/066 ,  H05K2201/09709 ,  Y10T29/49004

    Abstract: The present invention features an ultra high density, three-dimensional electronic circuit package suitable for constructing high capacity, high speed computer memory cards and the like. A demountable contact system allows easy test and/or burn-in. A memory card has a number of electrical receptacles adapted to receive a daughter card. The daughter card has memory devices attached to it and a corresponding number of electrical connectors placed along at least one edge, adapted to detachably mate with the electrical receptacles of the memory card. The demountable connectors allow easy rework of the module before optional, permanent solder attach. Bare dies or thin packages are mounted onto daughter cards, which in turn are mounted onto either a motherboard or memory card using pin/hole technology.

    Abstract translation: 本发明具有适用于构造高容量，高速计算机存储卡等的超高密度三维电子电路封装。 可拆卸的触点系统允许轻松测试和/或老化。 存储卡具有适于接收子卡的许多电插座。 子卡具有连接到其上的存储器件和沿着至少一个边缘放置的相应数量的电连接器，其适于可拆卸地与存储卡的电插座配合。 可拆卸的连接器允许在可选的永久焊接附着之前轻松地返修模块。 子卡上安装裸芯片或薄封装，子卡再次使用针/孔技术安装在主板或存储卡上。

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