公开(公告)号：EP3109016B1

公开(公告)日：2018-03-07

申请号：EP15173954.7

申请日：2015-06-25

Applicant: The Gillette Company LLC

Inventor： Broemse, Norbert ,  Heubch, Klaus

IPC: B26B21/48 ,  B26B21/40 ,  H05K1/02

CPC classification number: B26B21/48 ,  B26B21/06 ,  B26B21/225 ,  B26B21/227 ,  B26B21/405 ,  B26B21/443 ,  H05B3/0014 ,  H05B3/12 ,  H05K1/0212 ,  H05K1/111 ,  H05K1/147 ,  H05K1/189 ,  H05K3/363 ,  H05K2201/05 ,  H05K2201/09063

Abstract: A heating element (16) for a shaving razor (10) having an insulating member (42) with a base (74) and at least one electrical terminal (60). A flexible printed circuit board (34) having a base (76) with at least one electrical terminal (54) electrically and mechanically coupled to the corresponding electrical terminal of the insulating member. A non electrically conductive underfiller encapsulant (72) is positioned between the base of the insulating member and the base of the flexible printed circuit board to provide a water tight seal around the electrical terminals.

公开(公告)号：EP3041059A1

公开(公告)日：2016-07-06

申请号：EP15197808.7

申请日：2015-12-03

Applicant: LG Display Co., Ltd.

Inventor： LIM, MyungJin ,  CHOI, SuSeok ,  HAM, Yong-Su ,  KIM, Taeheon ,  LEE, YongWoo ,  CHOI, Seulgi

IPC: H01L41/277

CPC classification number: H01L41/083 ,  G06F1/1652 ,  G06F3/016 ,  G09F9/301 ,  H01L41/042 ,  H01L41/0926 ,  H01L41/193 ,  H01L41/277 ,  H05K1/028 ,  H05K5/0017 ,  H05K2201/05

Abstract: Provided is a multilayer actuator comprising a plurality of electroactive layers, wherein the electroactive layers comprise a ferroelectric polymer, and polarization directions of all electroactive layers are the same.

Abstract translation: 提供了包括多个电活性层的多层致动器，其中电活性层包括铁电聚合物，并且所有电活性层的偏振方向相同。

公开(公告)号：EP3010060A1

公开(公告)日：2016-04-20

申请号：EP14829789.8

申请日：2014-07-24

Applicant: LG Chem, Ltd.

Inventor： OH, Ducksu ,  PARK, Sung Soo ,  KANG, Minsoo

IPC: H01L51/52 ,  H05B33/06 ,  G09F9/00

CPC classification number: H05K1/028 ,  H01L27/3276 ,  H05K1/111 ,  H05K1/117 ,  H05K1/118 ,  H05K1/14 ,  H05K1/141 ,  H05K1/142 ,  H05K1/145 ,  H05K1/147 ,  H05K1/189 ,  H05K3/323 ,  H05K3/361 ,  H05K3/363 ,  H05K2201/0397 ,  H05K2201/046 ,  H05K2201/05 ,  H05K2201/058 ,  H05K2201/09418 ,  H05K2201/10128 ,  H05K2201/10681 ,  H05K2203/049

Abstract: A flexible printed circuit board installed on a substrate in a display device is provided.

Abstract translation: 提供了一种安装在显示装置中的基板上的柔性印刷电路板。

公开(公告)号：EP2960908A1

公开(公告)日：2015-12-30

申请号：EP14754412.6

申请日：2014-02-19

Applicant: Tokyo Institute of Technology ,  JX Nippon Oil & Energy Corporation

Inventor： SAKAJIRI, Koichi ,  AZUMA, Keisuke ,  MATSUMOTO, Hidetoshi ,  WATANABE, Junji ,  TOKITA, Masatoshi

IPC: H01B5/14 ,  H01B13/00

CPC classification number: H05K1/097 ,  G02F1/13439 ,  G06F3/041 ,  H01B1/023 ,  H01L31/022466 ,  H05K3/02 ,  H05K2201/05

Abstract: There are provided a conductive nanowire network, a conductive board and transparent electrode utilizing it, and a method for producing the same. The conductive nanowire network of the invention has essentially unbroken, continuous conductive nanowires randomly formed into a network. In the method for producing a conductive nanowire network according to the invention, nanofibers are applied in a random network-like fashion onto a substrate covered with a conductive layer, the conductive layer regions that are not covered with the nanofibers are removed, and then the nanofibers are removed. The network structure (wire diameter and network density) are also controlled to obtain a transparent electrode exhibiting both transparency and conductivity.

公开(公告)号：EP2792483A1

公开(公告)日：2014-10-22

申请号：EP12865468.8

申请日：2012-01-13

Applicant: JX Nippon Mining & Metals Corporation

Inventor： TANAKA Koichiro ,  KAMMURI Kazuki

IPC: B32B15/08 ,  H05K1/02

CPC classification number: H05K1/0393 ,  B32B7/02 ,  B32B15/08 ,  B32B15/20 ,  B32B2307/712 ,  B32B2457/08 ,  H05K1/053 ,  H05K1/056 ,  H05K1/09 ,  H05K3/022 ,  H05K2201/0145 ,  H05K2201/0154 ,  H05K2201/0355 ,  H05K2201/0358 ,  H05K2201/05 ,  H05K2201/06 ,  Y10T29/302 ,  Y10T428/12438 ,  Y10T428/273

Abstract: A copper foil composite comprising a copper foil and a resin layer laminated thereon, satisfying an equation 1: (f 3 x t 3 )/(f 2 x t 2 ) => 1 wherein t 2 (mm) is a thickness of the copper foil, f 2 (MPa) is a stress of the copper foil under tensile strain of 4%, t 3 (mm) is a thickness of the resin layer, f 3 (MPa) is a stress of the resin layer under tensile strain of 4%, and an equation 2:1 1 /(F x T) wherein f 1 (N/mm) is 180° peeling strength between the copper foil and the resin layer, F(MPa) is strength of the copper foil composite under tensile strain of 30%, and T (mm) is a thickness of the copper foil composite, wherein a Cr oxide layer is formed at an coating amount of 5 to 100 µg/dm 2 .is formed on a surface of the copper foil on which the resin layer is not laminated.

Abstract translation: （f3×t3）/（f2×t2）=> 1其中，t2（mm）是所述铜箔的厚度，f2（MPa）是包括铜箔和层压在其上的树脂层的铜箔复合物，满足等式1： ）为拉伸应变4％时铜箔的应力，t3（mm）为树脂层的厚度，f3（MPa）为拉伸应变4％时树脂层的应力，式2： 1 <= 33f1 /（F×T）其中，f1（N / mm）为铜箔与树脂层之间的180°剥离强度，F（MPa）为拉伸应变30％下的铜箔复合体的强度， T（mm）是铜箔复合体的厚度，其中在未层压树脂层的铜箔的表面上形成5至100μg/ dm 2的涂布量的Cr氧化物层。

公开(公告)号：EP3055882A4

公开(公告)日：2018-02-14

申请号：EP14891614

申请日：2014-12-22

Applicant: INTEL CORP

Inventor： JEN WEI-LUN KANE ,  JAIN PADAM ,  SENEVIRATNE DILAN ,  CHEN CHI-MON

IPC: H01L25/065 ,  H05K1/03 ,  H05K1/11 ,  H05K3/00

CPC classification number: H05K1/0271 ,  H01L21/02002 ,  H01L21/02008 ,  H01L21/02035 ,  H01L21/4857 ,  H01L21/6835 ,  H01L23/12 ,  H01L23/13 ,  H01L23/3185 ,  H01L23/49822 ,  H01L23/49838 ,  H01L23/49894 ,  H01L24/16 ,  H01L25/0657 ,  H01L2221/68345 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2924/0002 ,  H01L2924/15311 ,  H05K1/0298 ,  H05K1/036 ,  H05K1/0393 ,  H05K1/115 ,  H05K1/181 ,  H05K3/0014 ,  H05K3/0044 ,  H05K2201/0191 ,  H05K2201/05 ,  H05K2203/0278 ,  H05K2203/085 ,  H01L2924/00

Abstract: Embodiments disclosed include a multilayer substrate for semiconductor packaging. The substrate may include a first layer with a first side with an xy-plane and individual locations on the first side have a first side distance below the first side xy-plane, and a second side with a second side xy-plane and individual locations on the second side may have a second side distance below the second side xy-plane; and a second layer with a first side coupled to the second side of the first layer and a second side opposite the first side of the second layer, wherein a thickness of the second layer at the individual locations on the second layer may be comprised of the first side distance plus the second side distance. Other embodiments may be described and/or claimed.

公开(公告)号：EP3010060A4

公开(公告)日：2017-03-22

申请号：EP14829789

申请日：2014-07-24

Applicant: LG DISPLAY CO LTD

Inventor： OH DUCKSU ,  PARK SUNG SOO ,  KANG MINSOO

IPC: H05K1/14 ,  H01L51/52 ,  H05K1/11 ,  H05K1/18 ,  H05K3/32 ,  H05K3/36

CPC classification number: H05K1/028 ,  H01L27/3276 ,  H05K1/111 ,  H05K1/117 ,  H05K1/118 ,  H05K1/14 ,  H05K1/141 ,  H05K1/142 ,  H05K1/145 ,  H05K1/147 ,  H05K1/189 ,  H05K3/323 ,  H05K3/361 ,  H05K3/363 ,  H05K2201/0397 ,  H05K2201/046 ,  H05K2201/05 ,  H05K2201/058 ,  H05K2201/09418 ,  H05K2201/10128 ,  H05K2201/10681 ,  H05K2203/049

Abstract: A flexible printed circuit board installed on a substrate in a display device is provided.

公开(公告)号：EP3109016A1

公开(公告)日：2016-12-28

申请号：EP15173954.7

申请日：2015-06-25

Applicant: The Gillette Company LLC

Inventor： Broemse, Norbert ,  Heubch, Klaus

IPC: B26B21/48 ,  B26B21/40 ,  H05K1/02

CPC classification number: B26B21/48 ,  B26B21/06 ,  B26B21/225 ,  B26B21/227 ,  B26B21/405 ,  B26B21/443 ,  H05B3/0014 ,  H05B3/12 ,  H05K1/0212 ,  H05K1/111 ,  H05K1/147 ,  H05K1/189 ,  H05K3/363 ,  H05K2201/05 ,  H05K2201/09063

Abstract: A heating element (16) for a shaving razor (10) having an insulating member (42) with a base (74) and at least one electrical terminal (60). A flexible printed circuit board (34) having a base (76) with at least one electrical terminal (54) electrically and mechanically coupled to the corresponding electrical terminal of the insulating member. A non electrically conductive underfiller encapsulant (72) is positioned between the base of the insulating member and the base of the flexible printed circuit board to provide a water tight seal around the electrical terminals.

Abstract translation: 一种用于剃须刀（10）的加热元件（16），其具有带有基座（74）和至少一个电气端子（60）的绝缘构件（42）。 具有基座（76）的柔性印刷电路板（34）具有至少一个电气端子（54），电气和机械耦合到绝缘构件的相应电气端子。 不导电的底层填料密封剂（72）位于绝缘构件的基部和柔性印刷电路板的基部之间，以在电端子周围提供防水密封。

公开(公告)号：EP2960908A4

公开(公告)日：2016-09-07

申请号：EP14754412

申请日：2014-02-19

Applicant: TOKYO INST TECH ,  JX NIPPON OIL & ENERGY CORP

Inventor： SAKAJIRI KOICHI ,  AZUMA KEISUKE ,  MATSUMOTO HIDETOSHI ,  WATANABE JUNJI ,  TOKITA MASATOSHI

IPC: H01B1/02 ,  H01L31/0224 ,  H05K1/09 ,  H05K3/02

CPC classification number: H05K1/097 ,  G02F1/13439 ,  G06F3/041 ,  H01B1/023 ,  H01L31/022466 ,  H05K3/02 ,  H05K2201/05

公开(公告)号：EP2726964A4

公开(公告)日：2015-03-25

申请号：EP12805392

申请日：2012-06-29

Applicant: LG INNOTEK CO LTD

Inventor： KIM BYUNG SOO ,  LEE KEUN SIK

IPC: G06F3/041

CPC classification number: G06F3/0416 ,  G06F3/044 ,  G06F2203/04102 ,  G06F2203/04103 ,  G06F2203/04104 ,  G06F2203/04111 ,  H05K1/028 ,  H05K1/0298 ,  H05K2201/0145 ,  H05K2201/05 ,  H05K2201/10128

Abstract: Disclosed are a touch panel and a method for manufacturing the same. A touch panel can include a substrate, a transparent electrode base on the substrate, a first transparent electrode on the transparent electrode base and extending in a first direction, and a second transparent electrode on the transparent electrode base and extending in a second direction. A method of manufacturing a touch panel can include preparing a substrate and a transparent electrode base, forming a transparent electrode over the transparent electrode base, and forming an electrode material over the transparent electrode base.