公开(公告)号：US11683889B2

公开(公告)日：2023-06-20

申请号：US17475429

申请日：2021-09-15

Applicant: Infineon Technologies Austria AG

Inventor： Danny Clavette ,  Darryl Galipeau

IPC: H05K1/14 ,  H05K1/16 ,  H05K1/18 ,  H05K1/05

CPC classification number: H05K1/188 ,  H05K1/05 ,  H05K1/162 ,  H05K1/165 ,  H05K2201/0221

Abstract: An interposer for a processor includes: an electrically insulating material having a first main side and a second main side opposite the first main side; an electrical interface for a processor substrate at the first main side of the electrically insulating material; and a power device module embedded in the electrically insulating material and configured to convert a voltage provided at the second main side of the electrically insulating material to a lower voltage. The power device module has at least one contact configured to receive the voltage provided at the second main side of the electrically insulating material. Distribution circuitry embedded in the electrically insulating material is configured to carry the lower voltage provided by the power device module to the first main side of the electrically insulating material.

公开(公告)号：US09777197B2

公开(公告)日：2017-10-03

申请号：US14512535

申请日：2014-10-13

Applicant: SunRay Scientific LLC

Inventor： S. Kumar Khanna

IPC: C09J9/02 ,  C09J9/00 ,  H05K13/04 ,  H05K3/30 ,  H05K3/32 ,  H01L23/00 ,  C08K9/02

CPC classification number: C09J9/02 ,  C08K9/02 ,  C08K2201/001 ,  C08K2201/01 ,  C09J9/00 ,  H01L24/29 ,  H01L24/75 ,  H01L24/83 ,  H01L2224/16227 ,  H01L2224/2929 ,  H01L2224/29298 ,  H01L2224/29355 ,  H01L2224/29357 ,  H01L2224/2936 ,  H01L2224/29388 ,  H01L2224/29393 ,  H01L2224/29499 ,  H01L2224/29562 ,  H01L2224/2957 ,  H01L2224/29639 ,  H01L2224/29644 ,  H01L2224/32013 ,  H01L2224/32057 ,  H01L2224/32225 ,  H01L2224/75253 ,  H01L2224/75265 ,  H01L2224/75266 ,  H01L2224/75734 ,  H01L2224/75735 ,  H01L2224/81193 ,  H01L2224/83192 ,  H01L2224/83851 ,  H01L2224/83874 ,  H01L2224/8393 ,  H01L2924/00014 ,  H05K3/323 ,  H05K2201/0218 ,  H05K2201/0221 ,  H05K2201/0323 ,  H05K2201/083 ,  H05K2203/104 ,  H01L2924/2064 ,  H01L2924/0665 ,  H01L2224/0401

Abstract: Illustrative embodiments of anisotropic conductive adhesive (ACA) and associated methods are disclosed. In one illustrative embodiment, the ACA may comprise a binder curable using UV light and a plurality of particles suspended in the binder. Each of the plurality of particles may comprise a ferromagnetic material coated with a layer of electrically conductive material. The electrically conducting material may form electrically conductive and isolated parallel paths when the ACA is cured using UV light after being subjected to a magnetic field.

公开(公告)号：US09706667B2

公开(公告)日：2017-07-11

申请号：US15001140

申请日：2016-01-19

Applicant: SIERRA CIRCUITS, INC.

Inventor： Konstantine Karavakis ,  Kenneth S. Bahl

IPC: H05K1/09 ,  H05K3/38 ,  H05K3/42

CPC classification number: H05K3/387 ,  H05K3/427 ,  H05K2201/0221 ,  H05K2201/0236 ,  H05K2203/0709 ,  Y10T29/49167

Abstract: A via in a printed circuit board is composed of a patterned metal layer that extends through a hole in dielectric laminate material. A layer of catalytic adhesive coats walls within the hole. The patterned metal layer is placed over the catalytic adhesive within the hole.

公开(公告)号：US09670385B2

公开(公告)日：2017-06-06

申请号：US15116081

申请日：2015-02-13

Applicant: DEXERIALS CORPORATION

Inventor： Hidetsugu Namiki ,  Shiyuki Kanisawa ,  Akira Ishigami ,  Masaharu Aoki

IPC: H01L33/00 ,  C09J9/02 ,  H01L33/62 ,  C09J11/04 ,  H01L33/60 ,  C09J163/00 ,  C08K9/02 ,  C08K3/22 ,  H01L33/64

CPC classification number: C09J9/02 ,  C08K3/22 ,  C08K7/16 ,  C08K9/02 ,  C08K2003/0806 ,  C08K2003/2241 ,  C08K2201/001 ,  C08K2201/003 ,  C08K2201/005 ,  C09J11/04 ,  C09J163/00 ,  C09J201/00 ,  H01B1/22 ,  H01L24/29 ,  H01L24/81 ,  H01L24/83 ,  H01L33/60 ,  H01L33/62 ,  H01L33/641 ,  H01L33/644 ,  H01L33/647 ,  H01L2224/16238 ,  H01L2224/2929 ,  H01L2224/293 ,  H01L2224/29386 ,  H01L2224/2939 ,  H01L2224/29439 ,  H01L2224/29499 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/49107 ,  H01L2224/73204 ,  H01L2224/73265 ,  H01L2224/81193 ,  H01L2224/81194 ,  H01L2224/81203 ,  H01L2933/0066 ,  H01L2933/0075 ,  H05K3/323 ,  H05K2201/0221 ,  H05K2201/0272 ,  H05K2201/10106 ,  H05K2201/2054 ,  H01L2924/00014 ,  H01L2224/16225 ,  H01L2924/00 ,  H01L2924/014 ,  H01L2924/05341 ,  H01L2924/05432

Abstract: Provided is an anisotropic conductive adhesive in which excellent optical characteristics and heat dissipation characteristics are obtainable. The anisotropic conductive adhesive contains conductive particles each comprising a metal layer having Ag as a primary constituent formed on an outermost surface of a resin particle, solder particles having a smaller average particle diameter than the conductive particles, reflective insulating particles having a smaller average particle diameter than the solder particles and a binder into which the conductive particles solder particles and reflective insulating particles are dispersed. The conductive particles and the reflective insulating particles efficiently reflect light, thereby improving light-extraction efficiency of an LED mounting body. Additionally, inter-terminal solder bonding of the solder particles during compression bonding increases contact area between opposing terminals, thereby enabling achievement of high heat dissipation characteristics.

公开(公告)号：US20160086687A1

公开(公告)日：2016-03-24

申请号：US14891615

申请日：2014-05-20

Applicant: SEKISUI CHEMICAL CO., LTD.

Inventor： Hideaki Ishizawa ,  Takashi Kubota

IPC: H01B1/22 ,  H05K1/09

CPC classification number: H01B1/22 ,  B22F1/0062 ,  B22F1/02 ,  B22F1/025 ,  C08J3/128 ,  C08L63/00 ,  C08L101/02 ,  H01L24/80 ,  H01L2924/01322 ,  H01L2924/15788 ,  H05K1/09 ,  H05K3/323 ,  H05K3/3436 ,  H05K3/3457 ,  H05K3/363 ,  H05K2201/0221 ,  H01L2924/00

Abstract: There is provided a conductive material which has a rapid reaction rate and is high in fluxing effect. The conductive material according to the present invention includes a conductive particle having solder at at least an external surface, an anionically hardenable compound, an anionic hardener, and an organic acid having a carboxyl group and having a functional group that is an esterified carboxyl group.

Abstract translation: 提供了具有快速反应速率并且具有高的助焊效果的导电材料。 根据本发明的导电材料包括在至少外表面具有焊料的导电颗粒，阴离子可硬化的化合物，阴离子硬化剂和具有羧基并具有被酯化的羧基的官能团的有机酸。

公开(公告)号：US20150334836A1

公开(公告)日：2015-11-19

申请号：US14281802

申请日：2014-05-19

Applicant: Konstantine Karavakis ,  Kenneth S. Bahl

Inventor： Konstantine Karavakis ,  Kenneth S. Bahl

IPC: H05K1/11 ,  H05K3/00 ,  H05K3/42 ,  H05K1/09

CPC classification number: H05K3/426 ,  H05K1/09 ,  H05K1/115 ,  H05K3/0047 ,  H05K3/387 ,  H05K2201/0221 ,  H05K2201/0236 ,  H05K2203/0709 ,  Y10T29/49167

Abstract: A via in a printed circuit board is composed of a patterned metal layer that extends through a hole in dielectric laminate material that has been covered with catalytic adhesive material on both faces of the dielectric laminate material. The layer of catalytic adhesive coats a portion of the dielectric laminate material around the hole. The patterned metal layer is placed over the catalytic adhesive material on both faces of the dielectric laminate material and within the hole.

Abstract translation: 印刷电路板中的通孔由延伸穿过电介质层压材料中的孔的图案化金属层组成，该电介质层压材料已经在介电层压材料的两个表面上被催化粘合剂材料覆盖。 催化粘合剂层将电介质层叠材料的一部分涂覆在孔周围。 图案化的金属层放置在介电层压材料的两个表面上和孔内的催化粘合剂材料上。

公开(公告)号：US20150322298A1

公开(公告)日：2015-11-12

申请号：US14652050

申请日：2013-12-13

Applicant: CONPART AS

Inventor： Helge Kristiansen ,  Keith Redford ,  Tore Helland ,  Jakob Gakkestad ,  Ottar Opland

IPC: C09J9/02 ,  C09J7/02 ,  B29D7/01

CPC classification number: C09J9/02 ,  B29D7/01 ,  B29K2063/00 ,  B29K2105/0097 ,  B29K2105/16 ,  B29K2501/00 ,  B29K2505/14 ,  B29K2995/0005 ,  C08K7/16 ,  C08K9/12 ,  C09J7/401 ,  C09J11/00 ,  C23C18/1635 ,  C23C18/285 ,  C23C18/30 ,  C23C18/44 ,  H01B1/22 ,  H05K3/321 ,  H05K3/323 ,  H05K2201/0221 ,  H05K2203/013 ,  Y10T428/1405

Abstract: A method of applying a conductive adhesive comprising: using a conductive adhesive 18 made up of conductive beads 12 in an adhesive matrix 8, the conductive beads comprising a polymer core and a conductive coating and having a maximum dimension of 100 μm or less; and depositing droplets of the adhesive 18 on a substrate via a nozzle 20.

Abstract translation: 一种施加导电粘合剂的方法，包括：使用由粘合剂基体8中的导电珠12构成的导电粘合剂18，所述导电珠包含聚合物芯和导电涂层，并且具有100μm或更小的最大尺寸; 以及经由喷嘴20将粘合剂18的液滴沉积在基底上。

公开(公告)号：US20140360763A1

公开(公告)日：2014-12-11

申请号：US14372566

申请日：2013-01-10

Applicant: Toray Industries, Inc.

Inventor： Tsukuru Mizuguchi ,  Kazutaka Kusano

IPC: H01B1/22 ,  H05K1/09 ,  G03F7/20 ,  H05K1/02

CPC classification number: H01B1/22 ,  C09D7/40 ,  C09D11/037 ,  C09D11/52 ,  C09D201/02 ,  C09D201/08 ,  G03F7/0047 ,  G03F7/027 ,  G03F7/038 ,  G03F7/40 ,  G06F3/041 ,  G06F2203/04103 ,  H01B1/20 ,  H05K1/0274 ,  H05K1/092 ,  H05K3/02 ,  H05K2201/0218 ,  H05K2201/0221 ,  H05K2201/0326 ,  H05K2203/0514

Abstract: A conductive paste includes: composite particles (A) formed by coating a surface of a core material composed of an inorganic material with an antimony-containing compound; a compound (B) having an acid value of 30 to 250 mg KOH/g; and a conductive filler (C).

Abstract translation: 导电糊包括：通过用含锑化合物涂覆由无机材料构成的芯材的表面形成的复合颗粒（A）; 酸值为30〜250mg KOH / g的化合物（B） 和导电填料（C）。

公开(公告)号：US08780568B2

公开(公告)日：2014-07-15

申请号：US13983169

申请日：2012-12-14

Applicant: Takashi Osako ,  Yuji Tanaka

Inventor： Takashi Osako ,  Yuji Tanaka

IPC: H05K1/00 ,  H05K1/18 ,  H05K7/00

CPC classification number: H05K1/118 ,  H01B1/22 ,  H01L27/3276 ,  H01L2251/5338 ,  H05B33/22 ,  H05K3/323 ,  H05K3/361 ,  H05K2201/0221

Abstract: A flexible display device comprises a device substrate and a flexible circuit substrate, and achieves high reliability of electrical connection. The device substrate includes a flexible substrate, a display unit and a first terminal part. The flexible circuit substrate includes a second terminal part. An ACF including conductive particles connects the first and second terminal parts. Each conductive particle consists of a core part covered by a metal layer. An electrode layer and a cushioning layer are provided between the flexible substrate and the first terminal part. A quotient of a sum of a product of average particle diameter and elastic modulus for the core part, and a product of double average thickness and elastic modulus for the metal layer, divided by a sum of products of average thickness and elastic modulus for the first terminal part, the cushioning layer and the electrode layer, is no greater than 1.5.

Abstract translation: 柔性显示装置包括器件基板和柔性电路基板，并实现电连接的高可靠性。 器件基板包括柔性基板，显示单元和第一端子部件。 柔性电路基板包括第二端子部。 包括导电颗粒的ACF连接第一和第二端子部分。 每个导电颗粒由覆盖有金属层的核心部分组成。 在柔性基板和第一端子部之间设置电极层和缓冲层。 核心部分的平均粒径和弹性模量的乘积之和以及金属层的双重平均厚度和弹性模量的乘积除以第一次的平均厚度和弹性模量的乘积之和 端子部分，缓冲层和电极层，不大于1.5。

公开(公告)号：US08541685B2

公开(公告)日：2013-09-24

申请号：US12869184

申请日：2010-08-26

Applicant: Takahiro Sugiyama ,  Hideki Nounen

Inventor： Takahiro Sugiyama ,  Hideki Nounen

IPC: H05K1/00 ,  H05K7/12

CPC classification number: H01R12/62 ,  H01R13/035 ,  H01R13/2414 ,  H01R13/2478 ,  H05K3/0061 ,  H05K3/365 ,  H05K2201/0133 ,  H05K2201/0221 ,  H05K2201/0715 ,  H05K2201/10234 ,  H05K2201/10409 ,  H05K2201/2009

Abstract: There is provided a flexible harness adapted to be detachably connected to electrode pads of an electric/electronic component. The flexible harness according to the present invention comprises: a flexible insulator film; a conductor pattern formed on the flexible insulator film; a terminal plane which is an end region of the conductor pattern; and ball-like contact bumps formed on the terminal plane. Each contact bump includes a core made of an elastically deformable resin and an electrical conductor layer surrounding the core.

Abstract translation: 提供了适于可拆卸地连接到电气/电子部件的电极焊盘的柔性线束。 根据本发明的柔性线束包括：柔性绝缘膜; 形成在柔性绝缘膜上的导体图案; 作为导体图案的端部区域的端子平面; 以及形成在端子平面上的球状接触凸点。 每个接触凸块包括由可弹性变形的树脂制成的芯和围绕芯的电导体层。