公开(公告)号：US09125310B2

公开(公告)日：2015-09-01

申请号：US13328468

申请日：2011-12-16

Applicant: Mohammad Moniruzzaman

Inventor： Mohammad Moniruzzaman

IPC: H01B1/06 ,  H05K1/03 ,  H01B1/24 ,  H01L23/29 ,  H05K9/00 ,  H05K1/02

CPC classification number: H05K1/0366 ,  H01B1/24 ,  H01L23/295 ,  H01L2924/0002 ,  H05K1/0259 ,  H05K9/0079 ,  H05K2201/0154 ,  H05K2201/0293 ,  H01L2924/00

Abstract: The present disclosure relates to thermoplastic electrostatic dissipative (ESD) composites. The disclosed composites comprise a thermoplastic resin phase and a plurality of intermediate modulus carbon fibers dispersed within the thermoplastic resin phase. Also disclosed herein are methods for the manufacture and/or use of the disclosed ESD composites as well as articles formed from such composites.

Abstract translation: 本公开涉及热塑性静电耗散（ESD）复合材料。 所公开的复合材料包括分散在热塑性树脂相内的热塑性树脂相和多个中等模量的碳纤维。 本文还公开了用于制造和/或使用所公开的ESD复合材料以及由这种复合材料形成的制品的方法。

公开(公告)号：US20150159016A1

公开(公告)日：2015-06-11

申请号：US14367337

申请日：2011-12-29

Applicant: Yungdong Meng ,  Kehong Fang

Inventor： Yungdong Meng ,  Kehong Fang

IPC: C08L79/00 ,  C08L71/12 ,  C08L63/00 ,  C08J5/24

CPC classification number: C08L79/00 ,  C08J5/24 ,  C08J2363/00 ,  C08J2371/12 ,  C08J2379/00 ,  C08J2463/00 ,  C08J2471/12 ,  C08J2479/00 ,  C08K5/5313 ,  C08L63/00 ,  C08L71/12 ,  C08L71/126 ,  C08L2201/02 ,  C08L2205/03 ,  H05K2201/029 ,  H05K2201/0293 ,  Y10T428/31522 ,  Y10T442/20 ,  C08L79/04

Abstract: The present invention relates to a thermoset resin composition, and a prepreg and a laminate for a printed circuit board manufactured therefrom. The thermoset resin composition comprises the following components: a phosphorus-containing polyphenyl ether resin having low molecular weight, an epoxy resin, a cyanate resin and an accelerator. The prepreg manufactured using the resin composition comprises a base material and the thermoset resin composition adhered to the base material by impregnation and drying. The laminate for a printed circuit board manufactured using the resin composition comprises a plurality of laminated prepregs, a metal foil covering one or two faces of the laminated prepregs by pressing, with each prepreg comprising a base material and the thermoset resin composition adhered to the base material by impregnation and drying. The thermoset resin composition of the present invention has properties such as a low dielectric constant and a dielectric dissipation factor, high heat resistance, a high glass transition temperature, and flame retardancy, etc. The laminates for a printed circuit board manufactured using same have excellent metal foil peel strength, heat resistance and dielectric properties, and are suitable for high frequency and high speed electronic circuit boards.

Abstract translation: 本发明涉及一种热固性树脂组合物，以及由其制成的用于印刷电路板的预浸料和层压材料。 热固性树脂组合物包含以下组分：低分子量的含磷聚苯醚树脂，环氧树脂，氰酸酯树脂和促进剂。 使用树脂组合物制造的预浸料包含基材，并且通过浸渍和干燥将热固性树脂组合物粘附到基材上。 使用该树脂组合物制造的印刷电路板用层压体包括多层叠预浸料，通过压制覆盖层叠预浸料坯的一面或两面的金属箔，每个预浸料坯包含基材，并且热固性树脂组合物粘附于基材 材料通过浸渍和干燥。 本发明的热固性树脂组合物具有低介电常数和介电损耗因子，高耐热性，高玻璃化转变温度和阻燃性等性质。使用该印刷电路板制造的印刷电路板的层压板具有优异的 金属箔剥离强度，耐热性和介电性能，适用于高频高速电路板。

公开(公告)号：US20140147682A1

公开(公告)日：2014-05-29

申请号：US14129183

申请日：2013-03-15

Applicant: MITSUBISHI ENGINEERING PLASTICS CORPORATION

Inventor： Takahiro Takano ,  Takahiko Sumino ,  Kentarou Ishihara

IPC: C08K3/00 ,  H05K1/03 ,  F21V7/22

CPC classification number: C08K3/00 ,  C08K3/22 ,  C08K3/2279 ,  C08K3/40 ,  C08K7/14 ,  C08K9/02 ,  C08K2003/2231 ,  C08K2003/2241 ,  C08L23/06 ,  C08L77/06 ,  C08L91/06 ,  C08L101/12 ,  C23C18/1608 ,  C23C18/1612 ,  C23C18/1641 ,  C23C18/204 ,  C23C18/32 ,  C23C18/38 ,  C23C18/42 ,  F21V7/22 ,  H05K1/0373 ,  H05K3/105 ,  H05K2201/0129 ,  H05K2201/0209 ,  H05K2201/0221 ,  H05K2201/0245 ,  H05K2201/0254 ,  H05K2201/0293 ,  H05K2201/0347 ,  H05K2201/09118 ,  H05K2201/10106 ,  H05K2201/2054 ,  H05K2203/0723 ,  H05K2203/107

Abstract: Provided is a thermoplastic resin composition which is excellent in platability (appearance of plating), and keeps high reflectance even after thermal aging. A thermoplastic resin composition comprising: per (A) 100 parts by weight of a crystalline thermoplastic resin having a melting point, measured by differential scanning calorimetry (DSC) at a heating rate of 10° C./min, of 250° C. or above; (B) 10 to 80 parts by weight of a glass filler; (C) 1 to 30 parts by weight of a laser direct structuring additive having a reflectance at 450 nm of 25% or above; and (D) 20 to 150 parts by weight of titanium oxide.

Abstract translation: 提供一种热塑性树脂组合物，其电镀性（电镀外观）优异，即使在热老化后也保持高反射率。 一种热塑性树脂组合物，其包含：（A）100重量份具有熔点的结晶热塑性树脂，其通过差示扫描量热法（DSC）以10℃/ min的加热速率测定为250℃，或 以上; （B）10〜80重量份玻璃填料; （C）1〜30重量份在450nm以上的反射率为25％以上的激光直接结构化添加剂; 和（D）20〜150重量份的氧化钛。

公开(公告)号：US20140002311A1

公开(公告)日：2014-01-02

申请号：US14005692

申请日：2012-03-16

Applicant: Takahiro Takano ,  Takahiko Sumino ,  Kentarou Ishihara ,  Bernardus Antonius Gerardus Schrauwen

Inventor： Takahiro Takano ,  Takahiko Sumino ,  Kentarou Ishihara ,  Bernardus Antonius Gerardus Schrauwen

IPC: C08K13/04 ,  H01Q1/38

CPC classification number: C08K13/04 ,  B41M5/265 ,  C08G69/265 ,  C08J5/043 ,  C08J2377/00 ,  C08K3/2279 ,  C08K7/04 ,  C08K9/02 ,  C08L77/06 ,  C23C18/1608 ,  C23C18/1612 ,  C23C18/1641 ,  C23C18/204 ,  C23C18/38 ,  H01Q1/38 ,  H05K1/0366 ,  H05K3/185 ,  H05K2201/0129 ,  H05K2201/0236 ,  H05K2201/0293 ,  H05K2201/09118 ,  H05K2201/0999 ,  H05K2203/107 ,  C08L77/00

Abstract: Provided is a thermoplastic resin molded article excellent in bending strength, flexural modulus and Charpy impact strength, on which the plated layer may be formed in a successful manner. The thermoplastic resin composition for laser direct structuring comprising, per 100 parts by weight of the thermoplastic resin, 10 to 150 parts by weight of an inorganic fiber and 1 to 30 parts by weight of a laser direct structuring additive, the laser direct structuring additive containing at least one of copper, antimony and tin, and having a Mohs hardness 1.5 or more smaller than the Mohs hardness of the inorganic fiber.

Abstract translation: 提供了弯曲强度，弯曲模量和夏氏冲击强度优异的热塑性树脂成型体，其上可以成功地形成镀层。 用于激光直接结构的热塑性树脂组合物包括：相对于100重量份的热塑性树脂，10至150重量份的无机纤维和1至30重量份的激光直接结构化添加剂，所述激光直接结构化添加剂包含 铜，锑和锡中的至少一种，并且具有比无机纤维的莫氏硬度小1.5或更大的莫氏硬度。

公开(公告)号：US20130260123A1

公开(公告)日：2013-10-03

申请号：US13827796

申请日：2013-03-14

Applicant: John R. Krahn ,  Erich Otto Teutsch ,  Dennis Lockyer ,  Thomas Adjei

Inventor： John R. Krahn ,  Erich Otto Teutsch ,  Dennis Lockyer ,  Thomas Adjei

IPC: H01B3/52 ,  H01B19/00

CPC classification number: H01B3/52 ,  B32B27/12 ,  B32B2262/02 ,  B32B2262/0261 ,  B32B2262/0269 ,  B32B2262/0276 ,  B32B2262/14 ,  B32B2307/206 ,  B32B2379/08 ,  B32B2457/00 ,  B32B2457/04 ,  C08J5/048 ,  C08J2379/08 ,  D04H1/541 ,  D21H5/0002 ,  D21H5/2671 ,  D21H17/72 ,  D21H21/18 ,  H01B19/00 ,  H05K1/0366 ,  H05K2201/0293

Abstract: Fibrous substrates containing polyetherimides and other synthetic fibers are disclosed, along with methods of preparing electrical insulation paper and articles comprising the fibrous substrates.

Abstract translation: 公开了含有聚醚酰亚胺和其它合成纤维的纤维底物，以及制备电绝缘纸和包含纤维基材的制品的方法。

公开(公告)号：US08450618B2

公开(公告)日：2013-05-28

申请号：US13137656

申请日：2011-08-31

Applicant: Keung-Jin Sohn ,  Joon-Sik Shin ,  Joung-Gul Ryu ,  Jung-Hwan Park ,  Ho-Sik Park ,  Sang-Youp Lee

Inventor： Keung-Jin Sohn ,  Joon-Sik Shin ,  Joung-Gul Ryu ,  Jung-Hwan Park ,  Ho-Sik Park ,  Sang-Youp Lee

IPC: H05K1/03 ,  H05K1/09

CPC classification number: H05K1/0366 ,  C08J5/046 ,  H05K2201/0116 ,  H05K2201/0129 ,  H05K2201/0141 ,  H05K2201/0293 ,  Y10T29/49126 ,  Y10T29/49156

Abstract: A printed circuit board includes; a thermoplastic reinforcement material having fibers secured by a thermoplastic polymer binder and having pores formed therein; a thermoplastic resin layer having the thermoplastic reinforcement material impregnated with a thermoplastic resin; and a circuit pattern formed over the thermoplastic resin layer, wherein the thermoplastic reinforcement material and the thermoplastic resin layer have a thickness ratio (thickness of the thermoplastic reinforcement material÷thickness of the thermoplastic resin layer) of 0.9 or higher.

Abstract translation: 印刷电路板包括： 一种热塑性增强材料，其具有通过热塑性聚合物粘合剂固定并具有形成在其中的孔的纤维; 热塑性树脂层，其具有浸渍有热塑性树脂的热塑性增强材料; 以及形成在热塑性树脂层上的电路图案，其中，热塑性增强材料和热塑性树脂层的厚度比（热塑性增强材料的厚度÷热塑性树脂层的厚度）为0.9以上。

公开(公告)号：US20130062045A1

公开(公告)日：2013-03-14

申请号：US13232515

申请日：2011-09-14

Applicant: FU HUA CHU ,  DAVID SHAU CHEW WANG ,  YI AN SHA ,  KUO HSUN CHEN

Inventor： FU HUA CHU ,  DAVID SHAU CHEW WANG ,  YI AN SHA ,  KUO HSUN CHEN

IPC: F28F7/00

CPC classification number: H05K1/0373 ,  F28F7/00 ,  F28F21/06 ,  H05K1/0203 ,  H05K2201/0278 ,  H05K2201/0293

Abstract: A heat-conductive dielectric polymer material includes a thermosetting epoxy resin, a nonwoven fiber component, a curing agent and a heat-conductive filler. The thermosetting epoxy resin is selected from the group consisting of end-epoxy-function group epoxy resin, side chain epoxy function group epoxy resin, multi-functional epoxy resin or the mixture thereof. The thermosetting epoxy resin comprises 4%-60% by volume of the heat-conductive dielectric polymer material. The curing agent is configured to cure the thermosetting epoxy resin at a curing temperature. The heat-conductive filler comprises 40%-70% by volume of the heat-conductive dielectric polymer material. The nonwoven fiber component comprises 1%-35% by volume of the heat-conductive dielectric polymer material. The heat-conductive dielectric polymer material has a thermal conductivity greater than 0.5 W/mK.

Abstract translation: 导热介电聚合物材料包括热固性环氧树脂，非织造纤维组分，固化剂和导热填料。 热固性环氧树脂选自端环氧官能团环氧树脂，侧链环氧官能团环氧树脂，多官能环氧树脂或其混合物。 热固性环氧树脂占导热介电聚合物材料的4％-60％（体积）。 固化剂被配置为在固化温度下固化热固性环氧树脂。 导热填料包含导热介电聚合物材料的40体积％-70体积％。 非织造纤维组分包含1％-35％体积的导热介电聚合物材料。 导热介电聚合物材料的导热率大于0.5W / mK。

公开(公告)号：US20120211270A1

公开(公告)日：2012-08-23

申请号：US13399107

申请日：2012-02-17

Applicant: Hideaki YOSHIMURA

Inventor： Hideaki YOSHIMURA

IPC: H05K1/11 ,  H05K3/46 ,  H05K3/42

CPC classification number: H05K3/445 ,  H05K3/427 ,  H05K3/429 ,  H05K3/4608 ,  H05K2201/029 ,  H05K2201/0293 ,  H05K2201/0323 ,  H05K2201/09636 ,  Y10T29/49165

Abstract: A method of manufacturing a printed wiring board includes forming a first hole penetrating a base having conductivity, closing an opening of the first hole with a film, filling an insulating material into the first hole after closing the opening, removing the film after filling the insulating material, forming a plurality of second holes penetrating the insulating material, and forming a film having conductivity on an inner surface of each of the second holes to form a plurality of wirings penetrating the insulating material.

Abstract translation: 一种制造印刷电路板的方法包括：形成贯穿具有导电性的基体的第一孔，用薄膜封闭第一孔的开口，在封闭开口之后将绝缘材料填充到第一孔中，在填充绝缘体之后除去膜 形成穿过绝缘材料的多个第二孔，并且在每个第二孔的内表面上形成具有导电性的膜，以形成穿过绝缘材料的多个布线。

公开(公告)号：US08246201B2

公开(公告)日：2012-08-21

申请号：US11813857

申请日：2006-01-16

Applicant: Pierre-Alain Dumas

Inventor： Pierre-Alain Dumas

IPC: F21S4/00

CPC classification number: H05K1/18 ,  H05K1/0209 ,  H05K3/281 ,  H05K3/3447 ,  H05K2201/029 ,  H05K2201/0293 ,  H05K2201/062 ,  H05K2201/09363 ,  H05K2201/10106

Abstract: The invention relates to a specific printed circuit (7) comprising independent etched blocks (4) or segments in series of four such that, on a series circuit comprising five LEDs, the four blocks serve as the positioning and connection points for the welding of the pins of the LEDs, said pins being welded in an anode-to-cathode series, or the reverse depending on the direction of the current, i.e. eight electrodes in isolated blocks, such as to ensure that the connection is powered and the LEDs are fixed correctly in series of five. According to the invention, the square or rectangular blocks have a large surface (2) such that the successive holes do not tear the film of epoxy copper. In addition, said blocks are disposed along a path and a successive diagram (21) defines the symbol or pattern to be represented by the LEDs (12) which are disposed and aligned on the other decorated face of the epoxy. The incoming or outgoing bases, which supply the positive (20) or negative (3) power, or the opposite depending on the direction of the LEDs, can comprise the outgoing or incoming base that is common to other series, by means of suitable etching. The negative is always at the center of the pattern. The circuit is divided into three connection zones, A, B, C, and is powered by external contact springs. The invention is intended for the series powering of a longilineal distribution of five LEDs in series, or a multiple thereof.

Abstract translation: 本发明涉及一种特定的印刷电路（7），其包括独立的蚀刻块（4）或四个串联的段，使得在包括五个LED的串联电路上，四个块用作焊接的定位和连接点 LED的引脚，所述引脚以阳极至阴极串联焊接，或者反向取决于电流的方向，即隔离块中的八个电极，以确保连接被供电，并且LED固定 正确的五个系列。 根据本发明，正方形或矩形块具有大的表面（2），使得连续的孔不会撕裂环氧铜的膜。 此外，所述块沿着路径设置，并且连续图（21）限定由LED（12）表示的符号或图案，其被布置并对准在环氧树脂的另一装饰面上。 根据LED的方向提供正（20）或负（3）功率或相反的输入或输出基极可以通过适当的蚀刻包括其他系列共同的输出或输入基极 。 负数总是在图案的中心。 电路分为三个连接区域A，B，C，并由外部接触弹簧供电。 本发明旨在对串联的五个LED的串联分配进行串联供电，或其倍数。

公开(公告)号：US20110315437A1

公开(公告)日：2011-12-29

申请号：US13137656

申请日：2011-08-31

Applicant: Keung-Jin Sohn ,  Joon-Sik Shin ,  Joung-Gul Ryu ,  Jung-Hwan Park ,  Ho-Sik Park ,  Sang-Youp Lee

Inventor： Keung-Jin Sohn ,  Joon-Sik Shin ,  Joung-Gul Ryu ,  Jung-Hwan Park ,  Ho-Sik Park ,  Sang-Youp Lee

IPC: H05K1/00

CPC classification number: H05K1/0366 ,  C08J5/046 ,  H05K2201/0116 ,  H05K2201/0129 ,  H05K2201/0141 ,  H05K2201/0293 ,  Y10T29/49126 ,  Y10T29/49156

Abstract: A printed circuit board includes; a thermoplastic reinforcement material having fibers secured by a thermoplastic polymer binder and having pores formed therein; a thermoplastic resin layer having the thermoplastic reinforcement material impregnated with a thermoplastic resin; and a circuit pattern formed over the thermoplastic resin layer, wherein the thermoplastic reinforcement material and the thermoplastic resin layer have a thickness ratio (thickness of the thermoplastic reinforcement material÷thickness of the thermoplastic resin layer) of 0.9 or higher.

Abstract translation: 印刷电路板包括： 一种热塑性增强材料，其具有通过热塑性聚合物粘合剂固定并具有形成在其中的孔的纤维; 热塑性树脂层，其具有浸渍有热塑性树脂的热塑性增强材料; 以及形成在热塑性树脂层上的电路图案，其中热塑性增强材料和热塑性树脂层具有0.9或更高的厚度比（热塑性增强材料的厚度÷热塑性树脂层的厚度）。