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    Memory module interface card adapter
    161.
    发明授权
    Memory module interface card adapter 失效
    内存模块接口卡适配器

    公开(公告)号：US6004139A

    公开(公告)日：1999-12-21

    申请号：US881497

    申请日：1997-06-24

    Applicant: Kent A. Dramstad ,  Steven A. Grundon ,  Jeffrey N. Ohler

    Inventor： Kent A. Dramstad ,  Steven A. Grundon ,  Jeffrey N. Ohler

    IPC: H01R31/06 ,  H05K1/14 ,  H05K3/36 ,  H01R9/09

    CPC classification number: H05K1/147 ,  H01R12/716 ,  H01R12/721 ,  H01R31/06 ,  H05K1/141 ,  H05K2201/045 ,  H05K2201/10189 ,  H05K3/361 ,  H05K3/366

    Abstract: This discloses a memory module adapter card that allows newer dual in-line memory modules (DIMMs) to be used by computer system boards that were built to use older single inline memory modules (SIMMs) thereby permitting computer owners to update and upgrade older machines without modifying or changing their system boards. This memory module adapter card is designed to connect a memory DIMM inserted into a DIMM socket, carried thereon, to a pair of smaller SIMM sockets on a computer system board such that the DIMM appears to the computer as a pair of the smaller SIMMs that the board was originally designed for. This decreases the need for manufacturing and maintaining an inventory of the older SIMMs and provides owners of older computers the means to extend the useful life of their existing computer system even if the SIMMs designed for the computer no longer exist or are prohibitively expensive or very difficult to locate.

    Abstract translation: 这公开了一种存储器模块适配器卡，其允许较新的双列直插式存储器模块（DIMM）由计算机系统板使用，这些计算机系统板被构建为使用较旧的单列直插式存储器模块（SIMM），从而允许计算机所有者更新和升级旧机器而无需 修改或更改其系统板。 该存储器模块适配器卡被设计成将插入到其中的DIMM插槽中的存储器DIMM连接到计算机系统板上的一对较小的SIMM插槽，使得DIMM作为一对较小的SIMM显示在计算机上 董事会原来是为了设计。 这减少了制造和维护旧的SIMM的库存的需要，并且为老式计算机的所有者提供扩展其现有计算机系统的使用寿命的手段，即使为计算机设计的SIMM不再存在或者非常昂贵或非常困难 定位。

    MULTILAYER PRINTED-CIRCUIT BOARD, AND ITS PARTS MOUNTING METHOD
    166.
    发明公开
    MULTILAYER PRINTED-CIRCUIT BOARD, AND ITS PARTS MOUNTING METHOD 审中-公开
    维多利亚州蒙特利尔峡谷之旅MEHRSCHICHTIGE LEITERPLATTE

    公开(公告)号：EP1998603A1

    公开(公告)日：2008-12-03

    申请号：EP07713764.4

    申请日：2007-02-01

    Applicant: IBIDEN CO., LTD.

    Inventor： YOKOMAKU, Toshihiko

    IPC: H05K3/34 ,  H05K3/46

    CPC classification number: H05K3/3463 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73253 ,  H01L2924/00014 ,  H01L2924/15311 ,  H01L2924/16251 ,  H05K1/0262 ,  H05K1/141 ,  H05K3/341 ,  H05K3/3415 ,  H05K3/3457 ,  H05K3/4602 ,  H05K2201/045 ,  H05K2201/10189 ,  H05K2201/10318 ,  H05K2201/10424 ,  H05K2201/10674 ,  H05K2203/1572 ,  Y02P70/613 ,  Y10T29/49126 ,  Y10T29/4913 ,  Y10T29/49144 ,  Y10T29/49147 ,  Y10T29/49149 ,  H01L2224/05599

    Abstract: A component mounting method of a multilayer printed wiring board includes a plurality of solder bumps to mount electronic components formed on both of or either of the front and back thereof, wherein when the solder bumps are formed of any of first, second, third and fourth solders, the first, second, third and fourth solders have different melting points and the melting points of the first, second, third and fourth solders are arranged as the melting point of the first solder, the melting point of the second solder, the melting point of the third solder and the melting point of the fourth solder in order of high melting point and the first, second, third and fourth solders are sequentially used to solder electronic components and the like in order of high melting point. Further, in that case, it is preferable that the solder bump having large volume should be soldered earlier than other solder bumps. This multilayer printed wiring board is easy to mount components, excellent in work efficiency or easy in reworkable process and a mounting method of such multilayer printed wiring board is also provided.

    Abstract translation: 多层印刷线路板的部件安装方法包括：多个焊料凸块，用于安装形成在其前后的电子部件，其中当焊料凸块由第一，第二，第三和第四 焊料，第一，第二，第三，第四焊料具有不同的熔点，第一，第二，第三，第四焊料的熔点排列为第一焊料的熔点，第二焊料的熔点，熔化 第三焊料的点和第四焊料的熔点按照高熔点顺序依次使用，并且第一，第二，第三和第四焊料依次用于以高熔点顺序焊接电子部件等。 此外，在这种情况下，优选地，具有大体积的焊料凸块应当比其它焊料凸块更早地焊接。 该多层印刷电路板容易安装部件，工作效率优异或易于再加工的工艺，并且还提供了这种多层印刷线路板的安装方法。

    MODULE HAVING BUILT-IN COMPONENT AND METHOD FOR FABRICATING SUCH MODULE
    167.
    发明公开
    MODULE HAVING BUILT-IN COMPONENT AND METHOD FOR FABRICATING SUCH MODULE 审中-公开
    根据上述制造这样的模块集成的设备和方法模块

    公开(公告)号：EP1965615A1

    公开(公告)日：2008-09-03

    申请号：EP06811275.4

    申请日：2006-10-05

    Applicant: MURATA MANUFACTURING CO., LTD.

    Inventor： NOMURA, Masato ,  IEKI, Tsutomu

    IPC: H05K1/14 ,  H05K3/46 ,  H05K9/00

    CPC classification number: H05K1/141 ,  H01L23/552 ,  H01L2224/16225 ,  H01L2924/19105 ,  H05K1/0218 ,  H05K1/144 ,  H05K1/181 ,  H05K1/183 ,  H05K3/20 ,  H05K3/284 ,  H05K3/3442 ,  H05K2201/045

    Abstract: [Object] To provide a component-containing module capable of reducing cost and improving yield.
    [Solving Means] A component-containing module A includes a module substrate 1 having first wiring lines 2 formed on the top surface of the module substrate; a first circuit component 7 mounted on the first wiring lines of the module substrate; a submodule substrate 10 having an area smaller than the area of the module substrate and mounted on the first wiring lines of the module substrate at a position where the first circuit component is not mounted; a second circuit component 15 mounted on second wiring lines 11 formed on the top surface of the submodule substrate; and an insulating resin layer 20 formed on the entire top surface of the module substrate so as to encompass the first circuit component, the second circuit component, and the submodule substrate. Application of a substrate having a wiring accuracy higher than that of the module substrate 1 to the submodule substrate 10 allows an integrated-circuit element 15a to be mounted on the submodule substrate, and realizes a highly reliable and low-cost component-containing module.

    Abstract translation: 本发明的课题是提供一种能够降低成本，提高产率的成分含有模块。 [解决手段]一种成分含有模块A包括：模块基板1具有形成在模块基板的上表面上的第一布线2; 第一电路部件7安装在所述模块基板的所述第一布线; 的子模块基板10具有面积比所述模块基板的面积小，并安装在在所述第一电路部件没有被安装的位置上的模块基板的第一布线; 第二电路部件15安装在第二配线11形成的子模块基板的上表面上; 和绝缘层，形成模块基板的整个顶表面上，以便包围第一电路部件，在第二电路部件，以及在子模块基板树脂层20。 将被安装在子模块基板具有比模块基板1的子模块基板10允许以集成电路元件15a的高的布线精度的基板的应用，实现了高度可靠的，低成本的成分含有模块。

    ADVANCED MEZZANINE CARD ADAPTER
    169.
    发明公开
    ADVANCED MEZZANINE CARD ADAPTER 审中-公开
    高级夹层卡适配器

    公开(公告)号：EP1859352A2

    公开(公告)日：2007-11-28

    申请号：EP06738653.2

    申请日：2006-03-10

    Applicant: Intel Corporation

    Inventor： STAHL, Douglas ,  FORMISANO, David ,  SAFFARIAN, Andy ,  KHOURY, Marwan

    IPC: G06F13/40 ,  H05K1/14

    CPC classification number: H05K1/14 ,  H05K1/144 ,  H05K2201/044 ,  H05K2201/045

    Abstract: An Advanced Mezzainine Card An Advanced Mezzanine Card (AMC) adapter may be used to connect a non-AMC mezzanine cared to an AMC carrier. The AMC adapter may include a card edge connector configured to be connected to an AMC connector on the AMC carrier and one or more mezzanine connectors configured to be connected to the non-MC mezzanine card. The AMC adapter may also include a bridge to convert between communication protocols used by the non-AMC mezzanine card and the AMC carrier. Of course, many alternatives, variations, and modification are possible without departing from this embodiment.

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