公开(公告)号：JP2011096656A

公开(公告)日：2011-05-12

申请号：JP2010231676

申请日：2010-10-14

Applicant: Itei Kofun Yugenkoshi ,  易鼎股▲ふん▼有限公司

Inventor： LIN GWUN-JIN ,  CHUO CHIH-HENG ,  SU KUO-FU

IPC: H01B7/08 ,  H01B7/04 ,  H01B7/17 ,  H05K1/02

CPC classification number: H05K1/028 ,  H05K1/144 ,  H05K2201/043 ,  H05K2201/09063 ,  H05K2201/09109 ,  H05K2201/09254 ,  H05K2201/10598

Abstract: PROBLEM TO BE SOLVED: To provide a flexible flat cable aimed at prevention of degradation of smoothness of rotating movement of a rotating shaft, prevention of degradation of flexibility of a flat cable, and prevention of degradation of durability of the flat cable. SOLUTION: The flexible flat cable with gap parts is provided with a first substrate 11, a first conductive layer, a second substrate 21, a second conductive layer, an adhesive layer 3, and a cluster part 4. The first substrate 11, extended in an extension direction, is equipped with a first surface and a second surface. The first conductive layer is formed on the first surface of the first substrate 11. The second substrate 21, equipped with a first surface and a second surface, is arranged in correspondence with a position of the first substrate 11, and the second surface of the second substrate 21 is opposed to the second surface of the first substrate 11. The second conductive layer is formed on the first surface of the second substrate 21. COPYRIGHT: (C)2011,JPO&INPIT

Abstract translation: 要解决的问题：提供一种柔性扁平电缆，其旨在防止旋转轴的旋转运动的平滑度的劣化，防止扁平电缆的柔性的劣化，并防止扁平电缆的耐久性劣化。 解决方案：具有间隙部分的柔性扁平电缆设置有第一基板11，第一导电层，第二基板21，第二导电层，粘合层3和簇部4.第一基板11 沿着延伸方向延伸的第一表面和第二表面。 第一导电层形成在第一基板11的第一表面上。配备有第一表面和第二表面的第二基板21与第一基板11的位置对应地布置，并且第二表面 第二基板21与第一基板11的第二表面相对。第二导电层形成在第二基板21的第一表面上。版权所有：（C）2011，JPO＆INPIT

公开(公告)号：JP2010529657A

公开(公告)日：2010-08-26

申请号：JP2010510490

申请日：2008-05-29

Applicant: オッカム ポートフォリオ リミテッド ライアビリティ カンパニー

Inventor： シー．フェルスタッド ジョセフ

IPC: H05K3/32 ,  H01L25/10 ,  H01L25/11 ,  H01L25/18 ,  H05K1/18 ,  H05K3/34

CPC classification number: H05K1/144 ,  H01L24/73 ,  H01L24/82 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2224/73265 ,  H01L2924/01063 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/14 ,  H01L2924/15184 ,  H01L2924/3025 ,  H05K1/0207 ,  H05K1/185 ,  H05K3/284 ,  H05K3/4664 ,  H05K2201/042 ,  H05K2201/043 ,  H05K2201/10189 ,  H05K2201/10318 ,  H05K2201/10386 ,  H05K2201/1056 ,  H05K2203/1316 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

Abstract: The present invention provides an electronic assembly 400 and a method for its manufacture 800, 900, 1000 1200, 1400, 1500, 1700. The assembly 400 uses no solder. Components 406, or component packages 402, 802, 804, 806 with I/O leads 412 are placed 800 onto a planar substrate 808. The assembly is encapsulated 900 with electrically insulating material 908 with vias 420, 1002 formed or drilled 1000 through the substrate 808 to the components' leads 412. Then the assembly is plated 1200 and the encapsulation and drilling process 1500 repeated to build up desired layers 422, 1502, 1702.

公开(公告)号：JP4532110B2

公开(公告)日：2010-08-25

申请号：JP2003529526

申请日：2002-08-29

Applicant: シーメンス アクチエンゲゼルシヤフトSiemens Aktiengesellschaft

Inventor： ルッケ オラフ ,  テューツェル ベルント

IPC: H01L23/36 ,  H05K7/20 ,  H01L23/373 ,  H01L25/07 ,  H01L25/18 ,  H05K1/02 ,  H05K1/03 ,  H05K3/00

CPC classification number: H01L23/3735 ,  H01L25/072 ,  H01L2224/291 ,  H01L2224/32225 ,  H05K1/0271 ,  H05K1/0306 ,  H05K3/0061 ,  H05K2201/043 ,  H05K2203/1572 ,  H01L2924/014

公开(公告)号：JP2004343995A

公开(公告)日：2004-12-02

申请号：JP2004141323

申请日：2004-05-11

Applicant: Friwo Mobile Power Gmbh ,  エフアールアイダブリューオー モバイル パワー ゲーエムベーハー

Inventor： BOTHE MICHAEL ,  MOERBE STEFAN ,  BECKS MICHAEL ,  GRAD PETER

IPC: H02M3/28 ,  H01F27/28 ,  H05K1/03 ,  H05K1/14 ,  H05K1/16 ,  H05K1/18

CPC classification number: H05K1/144 ,  H01F27/2804 ,  H05K1/0306 ,  H05K1/142 ,  H05K1/162 ,  H05K1/167 ,  H05K1/181 ,  H05K2201/0187 ,  H05K2201/043 ,  H05K2201/1003 ,  H05K2201/10083

Abstract: PROBLEM TO BE SOLVED: To provide a power circuit which is of reduced size and of increased power density and has higher flexibility in formation of a safe distance between a primary circuit and a secondary circuit.
SOLUTION: The power circuit 100 has at least one transformer 106 connected with the primary circuit 102 and the secondary circuit 104. The power circuit 100 is manufactured as follows: the primary circuit 102 and the secondary circuit 104 are mounted on circuit carriers 110, 114, and 118 and a lead frame 122. The circuit carriers 110, 114, and 118 and the lead frame 122 are mechanically and electrically joined with each other. The circuit carriers and the lead frame are disposed on at least two different planes and preferably disposed so that they are in parallel with each other or they cross each other.
COPYRIGHT: (C)2005,JPO&NCIPI

公开(公告)号：US09997504B2

公开(公告)日：2018-06-12

申请号：US15075824

申请日：2016-03-21

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Jae Hyun Lim ,  Jong In Ryu ,  Sung Ho Kim ,  Jin Su Kim

IPC: H05K1/11 ,  H01L25/16 ,  H01L23/498 ,  H01L21/78 ,  H05K1/14 ,  H01L21/56 ,  H01R12/50 ,  H01L23/31 ,  H01L23/00

CPC classification number: H01L25/16 ,  H01L21/561 ,  H01L21/565 ,  H01L21/78 ,  H01L23/3128 ,  H01L23/49816 ,  H01L23/49822 ,  H01L23/49833 ,  H01L23/49838 ,  H01L23/50 ,  H01L24/13 ,  H01L24/16 ,  H01L24/48 ,  H01L24/97 ,  H01L2224/131 ,  H01L2224/16227 ,  H01L2224/48227 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/15787 ,  H01L2924/15788 ,  H01L2924/181 ,  H01L2924/18161 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/19105 ,  H01L2924/19106 ,  H01R23/68 ,  H01R23/6886 ,  H05K1/14 ,  H05K1/141 ,  H05K1/144 ,  H05K1/145 ,  H05K2201/041 ,  H05K2201/042 ,  H05K2201/043 ,  H05K2201/049 ,  H01L2924/014 ,  H01L2224/85 ,  H01L2224/81 ,  H01L2924/00 ,  H01L2224/45099

Abstract: In one general aspect, an electronic device module includes a first board, a first device mounted on a first surface of the first board, a second board disposed below the first board, and a plurality of second devices disposed between the first board and the second board, wherein a surface of each second device the plurality of second devices is bonded to a second surface of the first board and another surface of each of the second devices is bonded to the second board.

公开(公告)号：US20180107251A1

公开(公告)日：2018-04-19

申请号：US15794221

申请日：2017-10-26

Applicant: Google LLC

Inventor： Paul Eremenko ,  Ara Knaian ,  Seth Newburg ,  David Fishman

IPC: G06F1/16 ,  H04M1/02 ,  H04W88/02 ,  H05K1/14

CPC classification number: G06F1/1658 ,  G06F1/1684 ,  H04M1/0254 ,  H04M1/0274 ,  H04W88/02 ,  H05K1/144 ,  H05K2201/041 ,  H05K2201/042 ,  H05K2201/043 ,  H05K2201/044

Abstract: Examples herein include modules and connections for modules to couple to a computing device. An example module includes a housing comprising an end to couple to a computing device, multiple capacitive pads that each include data contacts to enable data transfer, a power contact pad to provide or receive power, and a ground contact pad to couple to ground. The ground contact pad is larger in size than the power contact pad, and the ground contact pad is positioned closer than the power contact pad to the end of the housing configured to couple to the computing device.

公开(公告)号：US20170285666A1

公开(公告)日：2017-10-05

申请号：US15462417

申请日：2017-03-17

Applicant: HORIBA STEC, Co., Ltd.

Inventor： Katsuya Ohtani

IPC: G05D7/06 ,  H01R12/71 ,  H05K1/14 ,  H01R12/75 ,  H05K5/00 ,  H05K1/18

CPC classification number: H05K1/141 ,  H01R12/712 ,  H01R12/716 ,  H01R12/732 ,  H01R23/68 ,  H05K1/117 ,  H05K1/14 ,  H05K1/142 ,  H05K1/145 ,  H05K1/181 ,  H05K3/368 ,  H05K2201/041 ,  H05K2201/043 ,  H05K2201/048 ,  H05K2201/049 ,  H05K2201/09072 ,  H05K2201/09181 ,  H05K2201/10189 ,  H05K2201/10287 ,  Y02P70/611

Abstract: A fluid control apparatus is provided which makes it possible to effortlessly perform cable connection even when a plurality of the fluid control apparatuses are disposed adjacent to each other. The fluid control apparatus includes fluid control units to control a flow rate or pressure of a fluid, an electric circuit board to send and receive a signal to and from the fluid control units, a casing to accommodate therein the fluid control units and the electric circuit board, and an apparatus-side connector interposed between the electric circuit board and a cable electrically connected thereto. The fluid control apparatus further includes a connector board configured to mount thereon the apparatus-side connector. The connector board is secured to the electric circuit board with at least a part of the connector board in surface contact with the electric circuit board, or overlapping the electric circuit board with a clearance therebetween.

公开(公告)号：US20160174377A1

公开(公告)日：2016-06-16

申请号：US14571369

申请日：2014-12-16

Applicant: MOTOROLA SOLUTIONS, INC

Inventor： SENG HUAN CHUAH ,  FRIEDRICH JOSEF BOLLMANN ,  KHAI JIN CHOO ,  WENG KONG HOR ,  SIH HAU TAN

IPC: H05K1/14 ,  H05K3/36

CPC classification number: H05K1/144 ,  H04M1/0277 ,  H05K1/0215 ,  H05K1/0224 ,  H05K1/14 ,  H05K5/064 ,  H05K2201/041 ,  H05K2201/042 ,  H05K2201/043 ,  H05K2201/045 ,  H05K2201/10371 ,  H05K2201/10409 ,  H05K2201/2018

Abstract: A method and circuit board arrangement for an intrinsically safe portable device includes two or more circuit boards having a frame structure that forms a contiguous boundary around a space between the circuit boards. In the space there are circuit components mounted on both circuit boards, and a connector that connect the two circuit boards. An encapsulant material fills the space bounded by the frame structure between the circuit boards to exclude airborne material from coming into contact with the encapsulated circuit components.

Abstract translation: 用于本质安全的便携式设备的方法和电路板装置包括两个或更多个具有围绕电路板之间的空间形成连续边界的框架结构的电路板。 在这个空间中，有两个电路板上安装的电路元件和连接两个电路板的连接器。 密封剂材料填充由电路板之间的框架结构限定的空间，以排除空气传播材料与封装的电路部件接触。

公开(公告)号：US20150288390A1

公开(公告)日：2015-10-08

申请号：US14664954

申请日：2015-03-23

Applicant: Panasonic Intellectual Property Management Co., Ltd.

Inventor： MAKI NAKAMURA ,  SUGURU FUJITA

IPC: H04B1/03

CPC classification number: H05K1/111 ,  H01L2224/16225 ,  H01L2924/19105 ,  H05K1/0216 ,  H05K1/144 ,  H05K3/3436 ,  H05K2201/043 ,  H05K2201/09381 ,  H05K2201/09418 ,  H05K2201/09427 ,  H05K2201/10098 ,  H05K2201/10734 ,  H05K2203/041 ,  Y02P70/611 ,  Y10T29/4913

Abstract: There is provided a radio module including: a first substrate; a second substrate that has a side which is opposed to the first substrate and on which an electronic component is mounted; a conductive member that connects the first substrate and the second substrate and that transmits a signal between the first substrate and the second; at least one first pad that is disposed in the first substrate and connected to the conductive member; and at least one second pad that is disposed in the second substrate and connected to the conductive member, each of the at least one second pad being opposed to each of the at least one first pad and each of larger than the at least one first pad in area.

Abstract translation: 提供了一种无线电模块，包括：第一基板; 第二基板，其具有与第一基板相对的一侧，并且安装有电子部件; 导电构件，其连接所述第一基板和所述第二基板，并且在所述第一基板和所述第二基板之间传递信号; 至少一个第一衬垫，其设置在所述第一衬底中并连接到所述导电构件; 以及至少一个第二垫，其设置在所述第二基板中并连接到所述导电构件，所述至少一个第二垫中的每一个与所述至少一个第一垫中的每一个相对，并且每个第二垫大于所述至少一个第一垫 在区域。

公开(公告)号：US20150237733A1

公开(公告)日：2015-08-20

申请号：US14700204

申请日：2015-04-30

Applicant: AT & S AUSTRIA TECHNOLOGIE & SYSTEMTECHNIK AKTIENGESELLSCHAFT

Inventor： Johannes Stahr ,  Markus Leitgeb

IPC: H05K1/18 ,  H05K1/02 ,  H05K1/11

CPC classification number: H05K1/185 ,  H05K1/0218 ,  H05K1/0298 ,  H05K1/115 ,  H05K1/14 ,  H05K1/144 ,  H05K1/181 ,  H05K1/186 ,  H05K3/4623 ,  H05K3/4697 ,  H05K2201/041 ,  H05K2201/042 ,  H05K2201/043 ,  H05K2201/045 ,  H05K2201/0723 ,  H05K2201/09036 ,  H05K2201/09072 ,  H05K2201/09618 ,  H05K2201/10 ,  H05K2201/10083 ,  H05K2201/10151 ,  Y10T29/49126 ,  Y10T29/49144

Abstract: A printed circuit board having two completed printed circuit board elements which consists of a plurality of interconnected plies or layers, wherein at least one printed circuit board element has a cutout or depression containing the component to be integrated on one of the printed circuit board elements or in the cutout of the at least one printed circuit board element, and the printed circuit board elements are connected with the component being accommodated in the cutout, as a result of which it is possible to obtain secure and reliable accommodation of the component in the printed circuit board. Furthermore, a printed circuit board of this type also contains an electronic component integrated therein.

Abstract translation: 一种印刷电路板，具有由多个相互连接的层或层构成的两个完整的印刷电路板元件，其中至少一个印刷电路板元件具有切口或凹陷，所述切口或凹陷包含待集成在其中一个印刷电路板元件上的部件或 在所述至少一个印刷电路板元件的切口中，并且所述印刷电路板元件与容纳在所述切口中的所述部件连接，由此可以获得所述部件在所述印刷电路板元件中的可靠和可靠的容纳 电路板。 此外，这种印刷电路板还包含集成在其中的电子部件。