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    콘택 패드들에 접속된 트랜스폰더 안테나를 포함하는 장치를 제조하는 방법 및 그렇게 얻어진 장치
    176.
    发明公开
    콘택 패드들에 접속된 트랜스폰더 안테나를 포함하는 장치를 제조하는 방법 및 그렇게 얻어진 장치 有权
    用于制造包含连接到接触垫的传感器天线的装置的方法和获得的装置

    公开(公告)号：KR1020100009641A

    公开(公告)日：2010-01-28

    申请号：KR1020097026502

    申请日：2008-05-13

    Applicant: 제말토 에스에이

    Inventor： 마르띠낭,쟝-프랑쑤아 ,  로블,로랑스 ,  루쎌,프랑쑤아

    IPC: G06K19/077 ,  H01Q1/24 ,  G06K19/00

    CPC classification number: H01Q1/2225 ,  G06K19/027 ,  G06K19/07749 ,  G06K19/0775 ,  H05K1/00 ,  H05K1/038 ,  H05K3/328 ,  H05K2201/029 ,  H05K2201/10628 ,  H05K2203/0278 ,  H05K2203/0285 ,  Y10T29/49002 ,  Y10T29/49016 ,  Y10T29/49018 ,  Y10T29/49124 ,  Y10T29/4913

    Abstract: The invention relates to a method for producing a device comprising a transponder antenna connected to contact pins, said method comprising the steps of: providing or producing an antenna (3) with terminal connections (7b, 8b) in contact with a substrate, placing the contact pad (5, 6) on the substrate ad connecting the same to the terminal sections of the antenna (7b, 8b), the connection being produced by means of a soldering (38) by introducing energy between the pads (5, 6) and the terminal sections (7b, 8b). The method is characterised in that the pads (5, 6) are placed such as to provide a surface (40) facing an antenna terminal connection section (7b, 8b), said section being arranged on the substrate (2, 2b, 2f) and the soldering energy being directly applied to the pads (5, 6). The invention also relates to the device obtained.

    Abstract translation: 本发明涉及一种用于制造包括连接到接触针的应答器天线的设备的方法，所述方法包括以下步骤：提供或产生具有与衬底接触的端子连接（7b，8b）的天线（3），将天线 接触垫（5,6），其连接到天线（7b，8b）的端子部分的基板上，该连接通过在焊盘（5,6）之间引入能量通过焊接（38）产生， 和端子部（7b，8b）。 所述方法的特征在于，所述垫（5,6）被放置成提供面向天线端子连接部分（7b，8b）的表面（40），所述部分布置在所述基板（2,2b，2f）上， 并且焊接能量直接施加到焊盘（5,6）。 本发明还涉及获得的装置。

    HIGH PERFORMANCE INTERPOSER AND CHIP SOCKET
    178.
    发明公开
    HIGH PERFORMANCE INTERPOSER AND CHIP SOCKET 审中-公开

    公开(公告)号：US20230156917A1

    公开(公告)日：2023-05-18

    申请号：US17983107

    申请日：2022-11-08

    Applicant: Amphenol Corporation

    Inventor： Paul R. Taylor ,  Jim Hileman ,  Trent K. Do

    IPC: H05K1/11 ,  H01L23/498

    CPC classification number: H05K1/113 ,  H01L23/49838 ,  H05K2201/10378 ,  H05K2201/0311 ,  H05K2201/10628 ,  H05K2201/10325

    Abstract: An interposer configured for connecting offset arrays of signal pads on parallel surfaces. Contacts of the interposer have mating portions with multiple beams. One of the beams makes contact with a pad on a first of the surfaces and is deflected when the surfaces are pressed together with the interposer between them. A second of the beams is positioned so that the first beam presses into that second beam as the first beam deflects. The second beam may contact a central location on the first beam. An electrical path through the contact from a pad on the first surface to a pad on the second surface may be shorter when the first beam is pressed into the second beam than through the first beam alone. A shorter path may improve signal integrity. Moreover, the spring force of the contact may be set by the second beam.

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