公开(公告)号：US5384181B1

公开(公告)日：2000-06-13

申请号：US13187093

申请日：1993-10-05

Applicant: WORLD PROPERTIES INC

Inventor： ARTHUR DAVID J ,  SWEI GWO S ,  HORN ALLEN F III ,  KILHENNY BRETT

IPC: C08K9/06 ,  H01B3/44 ,  H01L23/14 ,  H05K1/03 ,  H05K1/05 ,  H05K3/38 ,  H05K3/46 ,  B32B9/00

CPC classification number: H05K1/0373 ,  C08K9/06 ,  H01B3/445 ,  H01L23/145 ,  H01L2924/0002 ,  H05K1/034 ,  H05K1/0366 ,  H05K1/056 ,  H05K3/389 ,  H05K3/4626 ,  H05K2201/015 ,  H05K2201/0195 ,  H05K2201/0209 ,  H05K2201/0239 ,  H05K2201/0251 ,  H05K2201/068 ,  Y10S428/901 ,  Y10T428/24802 ,  Y10T428/252 ,  Y10T428/259 ,  Y10T428/2995 ,  Y10T428/3154 ,  Y10T428/31544 ,  Y10T428/31663 ,  Y10T428/31692 ,  C08L27/12 ,  H01L2924/00

公开(公告)号：US5858884A

公开(公告)日：1999-01-12

申请号：US856548

申请日：1997-05-15

Applicant: Masayuki Sakai ,  Hideo Hatanaka ,  Masahide Tsukamoto ,  Seiichi Nakatani ,  Masayuki Okano ,  Tamao Kojima

Inventor： Masayuki Sakai ,  Hideo Hatanaka ,  Masahide Tsukamoto ,  Seiichi Nakatani ,  Masayuki Okano ,  Tamao Kojima

IPC: B32B15/14 ,  C08J5/04 ,  C09D5/25 ,  D04H1/00 ,  D04H1/42 ,  D04H1/58 ,  D21H13/26 ,  D21H17/52 ,  H05K1/02 ,  H05K1/03 ,  C08J5/24

CPC classification number: H05K1/0366 ,  B32B15/14 ,  C08J5/04 ,  D04H1/00 ,  D04H1/4342 ,  D04H1/4382 ,  D04H1/64 ,  D21H13/26 ,  D21H17/52 ,  H05K1/024 ,  H05K2201/0239 ,  H05K2201/0278 ,  H05K2201/0293 ,  H05K2203/0783 ,  H05K2203/087 ,  H05K2203/097 ,  H05K2203/1105 ,  Y10T442/198 ,  Y10T442/2049 ,  Y10T442/2475 ,  Y10T442/2902 ,  Y10T442/626

Abstract: A nonwoven fabric cloth substrate for printed wiring boards containing aromatic polyamide fibers and having a 0.7-1.0 dynamic elastic modulus ratio (E' (250.degree. C.)/E' (30.degree. C.)) and a 0.05 or less loss tangent (Tan.delta.) peak value at 30.degree.-250.degree. C., and a prepreg and a printed wiring board using the nonwoven fabric cloth substrate.

Abstract translation: 一种包含芳族聚酰胺纤维并且具有0.7-1.0动态弹性模量比（E'（250℃）/ E'（30℃））和0.05或更小的损耗角正切的印刷线路板的无纺布基底 Tan delta）峰值，以及使用该无纺布基材的预浸料坯和印刷线路板。

公开(公告)号：US5614250A

公开(公告)日：1997-03-25

申请号：US468143

申请日：1995-06-06

Applicant: Carl E. Diener ,  Ashit A. Mehta ,  Ralph S. Paonessa ,  Eugene R. Skarvinko ,  David W. Wang

Inventor： Carl E. Diener ,  Ashit A. Mehta ,  Ralph S. Paonessa ,  Eugene R. Skarvinko ,  David W. Wang

IPC: C01B33/18 ,  B32B15/08 ,  C08K3/34 ,  C08K9/00 ,  C08K9/06 ,  C08L27/12 ,  C08L87/00 ,  C09C1/30 ,  C09C3/12 ,  C09D127/12 ,  H05K1/03 ,  B05D3/02 ,  B05D5/12

CPC classification number: H05K1/0373 ,  C08K9/06 ,  C09C1/3081 ,  C09C3/12 ,  C01P2004/51 ,  C01P2004/61 ,  C01P2004/62 ,  C01P2004/80 ,  C01P2006/40 ,  C01P2006/80 ,  C01P2006/90 ,  H05K1/034 ,  H05K2201/015 ,  H05K2201/0209 ,  H05K2201/0239 ,  Y10S428/901 ,  Y10T428/24273 ,  Y10T428/24917 ,  Y10T428/25 ,  Y10T428/252 ,  Y10T428/259 ,  Y10T428/265 ,  Y10T428/266 ,  Y10T428/3154 ,  Y10T428/31544

Abstract: Fillers coated with a fluorosilane coating are provided as well as compositions containing the coated fillers. Compositions are especially suitable for substrates for printed circuit boards and cards.

公开(公告)号：US5556899A

公开(公告)日：1996-09-17

申请号：US346766

申请日：1994-11-30

Applicant: Ali Afzali-Ardakani ,  Juan Ayala-Esquilin ,  Bodil E. Braren ,  Shahrokh Daijavad ,  Elizabeth Foster ,  James L. Hedrick, Jr. ,  Jeffrey C. Hedrick ,  Rodney T. Hodgson ,  Ashit A. Mehta ,  Steven E. Molis ,  Jane M. Shaw ,  Stephen L. Tisdale ,  Alfred Viehbeck

Inventor： Ali Afzali-Ardakani ,  Juan Ayala-Esquilin ,  Bodil E. Braren ,  Shahrokh Daijavad ,  Elizabeth Foster ,  James L. Hedrick, Jr. ,  Jeffrey C. Hedrick ,  Rodney T. Hodgson ,  Ashit A. Mehta ,  Steven E. Molis ,  Jane M. Shaw ,  Stephen L. Tisdale ,  Alfred Viehbeck

IPC: C08J7/00 ,  C08K3/04 ,  C08K9/02 ,  H01B3/30 ,  H01L21/312 ,  H05K1/03 ,  H05K3/10 ,  C08J5/18

CPC classification number: H05K1/0373 ,  C08K3/04 ,  C08K9/02 ,  H05K1/0346 ,  H05K2201/0154 ,  H05K2201/0239 ,  H05K2201/0323 ,  H05K2201/068 ,  H05K3/105 ,  Y10T428/31544

Abstract: Disclosed is a process of effecting a change in the dielectric constant and coefficient of thermal expansion of a polyimide material, by forming a composite based on a dispersion of 2-60 wt. % of fluorinated particulate carbon material and a polyimide or polyimide precursor, and heating the dispersion to about 400.degree. C. at 65.degree.-200.degree. C./second.

Abstract translation: 公开了通过基于2-60重量份的分散体形成复合材料来实现聚酰亚胺材料的介电常数和热膨胀系数的变化的方法。 ％的氟化颗粒碳材料和聚酰亚胺或聚酰亚胺前体，并将分散体在65℃-200℃/秒加热至约400℃。

公开(公告)号：US5354611A

公开(公告)日：1994-10-11

申请号：US71345

申请日：1993-05-28

Applicant: David J. Arthur ,  Gwo S. Swei ,  Phong X. Nguyen

Inventor： David J. Arthur ,  Gwo S. Swei ,  Phong X. Nguyen

IPC: C08K7/28 ,  C08K9/04 ,  H05K1/03 ,  B32B18/00

CPC classification number: H05K1/0373 ,  C08K7/28 ,  C08K9/04 ,  H05K1/034 ,  H05K2201/0116 ,  H05K2201/015 ,  H05K2201/0209 ,  H05K2201/0239 ,  H05K2201/0254 ,  Y10T428/252 ,  Y10T428/259 ,  Y10T428/2982 ,  Y10T428/2995 ,  Y10T428/2996 ,  Y10T428/3154 ,  Y10T428/31544

Abstract: A composite material is disclosed. The material comprises a polymeric matrix and from about 20 volume percent to about 70 volume percent inorganic particles distributed throughout the matrix. Suitable inorganic particles include hollow inorganic microspheres and porous inorganic particles. The inorganic particles are coated with a surface coating. The composite material of the present invention exhibits a dielectric constant of less than about 2.5 and a thermal coefficient of expansion of less than about 70 ppm/.degree.C.

Abstract translation: 公开了一种复合材料。 该材料包括聚合物基质和分布在整个基质中的约20体积％至约70体积％的无机颗粒。 合适的无机颗粒包括中空无机微球和多孔无机颗粒。 无机颗粒用表面涂层涂覆。 本发明的复合材料的介电常数小于约2.5，热膨胀系数小于约70ppm /℃。

公开(公告)号：US5338567A

公开(公告)日：1994-08-16

申请号：US979481

申请日：1992-11-20

Applicant: Thomas S. Kohm

Inventor： Thomas S. Kohm

IPC: C23C18/16 ,  C23C18/20 ,  H05K1/03 ,  H05K3/18 ,  H05K3/42 ,  C23C26/00

CPC classification number: H05K1/0373 ,  C23C18/206 ,  C23C18/30 ,  H05K3/181 ,  H05K2201/0209 ,  H05K2201/0236 ,  H05K2201/0239 ,  H05K2201/0245

Abstract: This invention concerns a method of manufacturing printed wiring boards by electrolessly plating copper on a precatalyzed base material which contains a polymeric resin, woven glass cloth reinforcement and a noble metal catalyst on clay support to precatalyze the base material for electrolessly depositing copper. The improvement comprises providing in the polymeric resin, a phenolic resin component and a silicate filler. The silicate filler is present in an amount between 30 and 100 part per hundred parts of the polymeric resin, and in an amount sufficient to provide a take time for the initiation of electroless copper deposition at least two times faster than a comparable precatalyzed base material without the silicate filler and phenolic resin.

Abstract translation: 本发明涉及一种制造印刷线路板的方法，该方法是通过在含有聚合物树脂，织物玻璃织物增强物和贵金属催化剂的预催化基材上无电镀铜来预先沉积用于无电沉积铜的基底材料的铜。 该改进包括在聚合物树脂中提供酚醛树脂组分和硅酸盐填料。 硅酸盐填料以每100份聚合树脂30-100份的量存在，并且其用量足以提供无电沉积铜的起始时间至少比可比较的预分解基材快两倍，而没有 硅酸盐填料和酚醛树脂。

公开(公告)号：US5312576A

公开(公告)日：1994-05-17

申请号：US704983

申请日：1991-05-24

Applicant: Gwo S. Swei ,  David J. Arthur

Inventor： Gwo S. Swei ,  David J. Arthur

IPC: B29C41/28 ,  B29D7/01 ,  C08J3/00 ,  C08J3/215 ,  C08J9/26 ,  H05K1/03 ,  H05K1/05 ,  H05K3/38 ,  B29C39/00 ,  B32B27/00

CPC classification number: C08J9/26 ,  B29C41/28 ,  B29D7/01 ,  C08J3/005 ,  C08J3/215 ,  H05K1/034 ,  H05K1/0373 ,  B29K2027/18 ,  B29K2105/04 ,  B29K2105/16 ,  B29K2995/0006 ,  C08J2327/12 ,  H05K1/056 ,  H05K2201/015 ,  H05K2201/0209 ,  H05K2201/0212 ,  H05K2201/0215 ,  H05K2201/0239 ,  H05K3/386 ,  Y02P20/582

Abstract: A method for making a particulate filled polymeric matrix composite film includes mixing a polymeric matrix material with a dispersion of particulate filler in a carrier liquid to form a casting composition and adjusting the viscosity of the casting composition to retard separation of the particulate filler from the composition. A layer of the viscosity-adjusted casting composition is cast on a substrate and the layer is consolidated to form the particulate filled polymer matrix composite film. Films made by the method include very thin, e.g. less than 1.0 mil, fluoropolymeric matrix films highly filled with very small diameter, preferably spherical, particles for use as, e.g. dielectric substrate materials in laminar electrical circuits.

Abstract translation: 制备颗粒填充的聚合物基质复合膜的方法包括将聚合物基体材料与颗粒填料的分散体混合在载体液体中以形成流延组合物并调节流延组合物的粘度以阻止颗粒填料与组合物的分离 。 将粘度调节的浇铸组合物的一层浇铸在基材上，并将该层固结以形成填充颗粒的聚合物基质复合膜。 通过该方法制成的膜包括非常薄的，例如 小于1.0密耳，高度填充有非常小直径的氟聚合物基质膜，优选为球形颗粒，用作例如。 层状电路中的电介质基片材料。

公开(公告)号：US5100722A

公开(公告)日：1992-03-31

申请号：US436488

申请日：1989-11-14

Applicant: Michio Nakamura ,  Hajime Takeuchi ,  Masahide Takahashi ,  Yasuki Matsuo ,  Hiromitu Kimura ,  Takumi Itani

Inventor： Michio Nakamura ,  Hajime Takeuchi ,  Masahide Takahashi ,  Yasuki Matsuo ,  Hiromitu Kimura ,  Takumi Itani

IPC: B32B17/04 ,  B32B27/04 ,  C08J5/08 ,  H05K1/03

CPC classification number: B32B17/04 ,  B32B27/04 ,  C08J5/08 ,  H05K1/0366 ,  C08J2327/12 ,  H05K2201/015 ,  H05K2201/0239 ,  Y10T428/3154 ,  Y10T428/31544 ,  Y10T442/3423 ,  Y10T442/3431 ,  Y10T442/475 ,  Y10T442/656

Abstract: A fiber-reinforced resin composite material suitable for printed circuit boards, etc., in which an inorganic fiber material is treated on its surface with a fluorosilane coupling agent and then impregnated with a fluororesin material.

Abstract translation: 一种适用于印刷电路板等的纤维增强树脂复合材料，其中无机纤维材料在其表面上用氟硅烷偶联剂处理，然后用氟树脂材料浸渍。

公开(公告)号：US4997702A

公开(公告)日：1991-03-05

申请号：US475454

申请日：1990-02-06

Applicant: Samuel Gazit ,  Gary W. Adams

Inventor： Samuel Gazit ,  Gary W. Adams

IPC: B32B27/20 ,  H05K1/00 ,  H05K1/03

CPC classification number: H05K1/0373 ,  B32B27/20 ,  H05K1/0366 ,  H05K1/0393 ,  H05K2201/015 ,  H05K2201/0209 ,  H05K2201/0239 ,  H05K2201/0251 ,  H05K2201/0254 ,  H05K2201/0278 ,  H05K2201/0293 ,  H05K2201/057 ,  H05K2201/068 ,  Y10S428/901 ,  Y10T428/24917 ,  Y10T442/2713

Abstract: A printed circuit board composed of an epoxy impregnated nonwoven web substrate laminated to electrically conductive sheets is presented. The printed circuit board is flexible in the sense that it can be bent to any desired multiplanar shape and will retain that shape after installation as required by electronic interconnection systems. The printed circuit board also has improved thermal properties achieved through the addition of up to 70% by weight of low coefficient of thermal expansion (CTE) particulate fillers and/or the use of thermally stable reinforcement fibers in the non-woven web.

Abstract translation: 提出了一种印刷电路板，其由层压在导电片上的环氧树脂浸渍非织造网基材组成。 印刷电路板的灵活性在于它可以弯曲成任何所需的多平面形状，并且在电气互连系统所要求的安装之后将保持该形状。 印刷电路板还具有通过添加高达70重量％的低热膨胀系数（CTE）颗粒填料和/或在无纺布网中使用热稳定的增强纤维而获得的改进的热性能。

公开(公告)号：US4923678A

公开(公告)日：1990-05-08

申请号：US309857

申请日：1989-02-14

Applicant: George M. Benedikt ,  Linwood P. Tenney

Inventor： George M. Benedikt ,  Linwood P. Tenney

IPC: B32B15/14 ,  C08J5/24 ,  H05K1/00 ,  H05K1/03 ,  H05K3/38

CPC classification number: H05K3/389 ,  B32B15/14 ,  C08J5/24 ,  H05K1/0353 ,  H05K1/0366 ,  H05K3/4676 ,  C08J2365/00 ,  H05K1/032 ,  H05K2201/0158 ,  H05K2201/0239 ,  H05K2201/0355 ,  H05K2203/0723 ,  Y10S428/901 ,  Y10T156/10 ,  Y10T428/12229 ,  Y10T428/12493 ,  Y10T428/24917 ,  Y10T428/26 ,  Y10T428/31504 ,  Y10T428/31678 ,  Y10T428/31681 ,  Y10T428/31786 ,  Y10T442/2418 ,  Y10T442/2459

Abstract: This invention provides improved prepregs for producing laminates and improved laminates using such prepregs. Processes for producing the prepregs and the laminates are also provided. Processes for producing the prepreg include the steps of providing a dipping solution or suspension comprising a polynorbornene polymer, a polyolefin polymer derived from C.sub.2 -C.sub.4 monomers, and a solvent followed by impregnating a non-cellulosic cloth with the solution. The solvent is removed from the cloth to form the prepreg. Printed circuit boards are also provided by a process which includes the steps of providing such a prepreg and pretreating the surface of a conductive film with a solution of a silane compound, effective to increase the bond strength between the copper foil and the prepreg, followed by laminating the prepreg to the conductive film.

Abstract translation: 本发明提供用于生产层压板的改进的预浸料和使用这种预浸料的改进的层压板。 还提供了制备预浸料和层压材料的方法。 用于生产预浸料的方法包括以下步骤：提供包含聚降冰片烯聚合物，衍生自C 2 -C 4单体的聚烯烃聚合物和溶剂，然后用该溶液浸渍非纤维素布的浸渍溶液或悬浮液。 将溶剂从布上除去以形成预浸料。 印刷电路板还通过一种方法提供，该方法包括以下步骤：提供这种预浸料，并用硅烷化合物溶液预处理导电膜的表面，有效地增加铜箔和预浸料之间的粘结强度， 将预浸料层压到导电膜上。