公开(公告)号：EP2720520A4

公开(公告)日：2015-05-27

申请号：EP12797274

申请日：2012-05-30

Applicant: KYOCERA CORP

Inventor： NAKAMURA KIYOTAKA ,  OHASHI YOSHIO ,  ABE YUUICHI ,  HIRANO EISUKE ,  SHIKATA KUNIHIDE ,  SEKIGUCHI KEIICHI

IPC: H05K1/11 ,  H01L23/13 ,  H01L23/14 ,  H05K1/09

CPC classification number: H05K1/09 ,  H01L23/15 ,  H01L23/3677 ,  H01L23/49827 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2924/12032 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/13091 ,  H05K1/0206 ,  H05K1/0306 ,  H05K1/115 ,  H05K3/4061 ,  H05K2201/0266 ,  H05K2201/0326 ,  H05K2203/049 ,  H01L2924/00 ,  H01L2924/00014 ,  H01L2924/00012

Abstract: [Problem] To provide a highly-reliable circuit board and an electronic device obtained by mounting electronic components on the circuit board, which have high bonding strength and excellent heat discharge properties, and can be used over a long period as a result of minimizing cavities in a metal wiring layer formed on a through conductor. [Solution] A circuit board (10) is provided with a through conductor (13) comprising a metal in a through hole (12) that penetrates in the thickness direction of a ceramic sintered body (11), and a metal wiring layer (14) that covers and is connected to the surface of the through conductor (13) on at least one main surface side of the ceramic sintered body (11). The through conductor (13) comprises: a first portion (13a) that is positioned on an inner wall side of the through hole (12), from one end to the other end of the through hole (12) in the thickness direction of the ceramic sintered body (11); and a second portion (13b) that adjoins the first portion (13a). The average crystal grain size in the second portion (13b) is larger than the average crystal grain size in the first portion (13a).

Abstract translation: [问题]提供一种高可靠性的电路板和通过将电子部件安装在电路板上而获得的电路板和电子器件，其具有高的接合强度和优异的散热性能，并且由于使空腔最小化，可以长时间使用 在形成在贯通导体上的金属布线层中。 电路板（10）在贯通陶瓷烧结体（11）的厚度方向的贯通孔（12）中设置贯通导体（13），该穿通导体（13）具有金属，金属配线层（14） ），其在陶瓷烧结体（11）的至少一个主表面侧覆盖并连接到贯通导体（13）的表面。 贯通导体（13）包括：第一部分（13a），其位于通孔（12）的内壁侧，从通孔（12）的一端到另一端沿着该通孔的厚度方向 陶瓷烧结体（11）; 和邻接第一部分（13a）的第二部分（13b）。 第二部分（13b）中的平均晶粒尺寸大于第一部分（13a）中的平均晶粒尺寸。

公开(公告)号：EP2720520A1

公开(公告)日：2014-04-16

申请号：EP12797274.3

申请日：2012-05-30

Applicant: Kyocera Corporation

Inventor： NAKAMURA,Kiyotaka ,  OHASHI,Yoshio ,  ABE,Yuuichi ,  HIRANO,Eisuke ,  SHIKATA,Kunihide ,  SEKIGUCHI,Keiichi

IPC: H05K1/11 ,  H01L23/13 ,  H01L23/14 ,  H05K1/09

CPC classification number: H05K1/09 ,  H01L23/15 ,  H01L23/3677 ,  H01L23/49827 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2924/12032 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/13091 ,  H05K1/0206 ,  H05K1/0306 ,  H05K1/115 ,  H05K3/4061 ,  H05K2201/0266 ,  H05K2201/0326 ,  H05K2203/049 ,  H01L2924/00 ,  H01L2924/00014 ,  H01L2924/00012

Abstract: [Problem] To provide a highly-reliable circuit board and an electronic device obtained by mounting electronic components on the circuit board, which have high bonding strength and excellent heat discharge properties, and can be used over a long period as a result of minimizing cavities in a metal wiring layer formed on a through conductor. [Solution] A circuit board (10) is provided with a through conductor (13) comprising a metal in a through hole (12) that penetrates in the thickness direction of a ceramic sintered body (11), and a metal wiring layer (14) that covers and is connected to the surface of the through conductor (13) on at least one main surface side of the ceramic sintered body (11). The through conductor (13) comprises: a first portion (13a) that is positioned on an inner wall side of the through hole (12), from one end to the other end of the through hole (12) in the thickness direction of the ceramic sintered body (11); and a second portion (13b) that adjoins the first portion (13a). The average crystal grain size in the second portion (13b) is larger than the average crystal grain size in the first portion (13a).

Abstract translation: 本发明的目的在于提供一种高可靠性的电路基板以及在电路基板上安装电子部件而得到的电子部件，该电子基板具有高接合强度和优异的散热性，并且能够长时间使用， 在贯通导体上形成的金属布线层中。 电路基板（10）在沿陶瓷烧结体（11）的厚度方向贯通的贯通孔（12）内具备由金属构成的贯通导体（13），金属布线层（14 ），其覆盖陶瓷烧结体（11）的至少一个主面侧的贯通导体（13）的表面并与其连接。 贯通导体（13）具有：第一部分（13a），其从贯通孔（12）的厚度方向的一端到另一端位于贯通孔（12）的内壁侧 陶瓷烧结体（11）; 和邻接第一部分（13a）的第二部分（13b）。 第二部分（13b）中的平均晶粒尺寸大于第一部分（13a）中的平均晶粒尺寸。

公开(公告)号：EP2709208A1

公开(公告)日：2014-03-19

申请号：EP11865870.7

申请日：2011-08-04

Applicant: Shuhou Co., Ltd.

Inventor： MURAOKA, Kouji

IPC: H01Q1/38 ,  H01P11/00 ,  H01Q1/24 ,  H05K3/18 ,  H05K3/24

CPC classification number: H01Q1/38 ,  H01Q1/243 ,  H01Q1/27 ,  H01Q1/36 ,  H01Q1/364 ,  H05K3/18 ,  H05K3/182 ,  H05K3/245 ,  H05K3/246 ,  H05K2201/0266 ,  H05K2203/0709

Abstract: An antenna 10 includes a base print layer 2 printed in a predetermined antenna pattern on a surface of a workpiece 1, and an electroless plating layer 3 disposed on the surface of the base print layer 2. The base print layer 2 is formed of an ink 2a and metal particles 2b. The ink 2a has been printed with a substantially uniform thickness to form an ink layer, in which some of particles of the metal particles 2b are buried. The metal particles having a large diameter are partially protrudent from the ink layer, and part of the ink 2a covering the protrudent portions have been removed.

Abstract translation: 天线10包括印刷在工件1的表面上的预定天线图案的基底印刷层2和设置在基底印刷层2的表面上的化学镀层3.基底印刷层2由墨水 2a和金属颗粒2b。 油墨2a已印刷成基本均匀的厚度，以形成其中一些金属颗粒2b的颗粒被埋入的油墨层。 具有大直径的金属颗粒部分地从油墨层突出，并且已经去除了覆盖突出部分的部分油墨2a。

公开(公告)号：EP2647467A2

公开(公告)日：2013-10-09

申请号：EP13170700.2

申请日：2007-07-03

Applicant: Fuji Electric Holdings Co., Ltd. ,  NIHON HANDA CO., LTD.

Inventor： Yamashita, Mitsuo ,  Goto, Tomoaki ,  Asagi, Takeshi

IPC: B23K35/26 ,  C22C13/00 ,  H05K3/34 ,  B23K1/00 ,  B23K101/42 ,  B23K35/02 ,  C22C1/04 ,  C22C12/00 ,  C22C28/00

CPC classification number: H05K3/341 ,  B23K1/0016 ,  B23K35/0244 ,  B23K35/025 ,  B23K35/262 ,  B23K2201/36 ,  B23K2201/42 ,  C22C1/0483 ,  C22C12/00 ,  C22C13/00 ,  C22C28/00 ,  H01L2924/0132 ,  H01L2924/0133 ,  H05K3/3484 ,  H05K2201/0266 ,  H05K2201/0272 ,  H05K2203/04 ,  H05K2203/12 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01029

Abstract: The present invention aims at providing a high-temperature lead-free solder material which can form a solder joint of improved heat resistance and reliability, and is suitable for application to dual-temperature solder connection, and a method of soldering an electronic part. According to the invention a solder cream is obtained by kneading an Sn-Ag-Cu alloy with a flux, wherein the Sn-Ag-Cu alloy comprises a mixture of a first powder alloy containing 10 to 30% by weight of Ag and 2 to 20% by weight of Cu with a balance consisting of Sn and unavoidable impurities, and a second powder alloy containing smaller compositions (% by weight) of Ag and Cu than the first powder alloy, and having a melting point lower than that of the first powder alloy, the mixture containing a total of not more than 35% by weight of Ag and Cu.

Abstract translation: 本发明的目的是提供一种可形成耐热性和可靠性提高的焊点的高温无铅焊料，适用于双温焊料连接，以及焊接电子部件的方法。 根据本发明，通过将Sn-Ag-Cu合金与助熔剂捏合来获得焊膏，其中Sn-Ag-Cu合金包含含有10〜30重量％Ag的第一粉末合金和2〜 20重量％的余量由Sn和不可避免的杂质组成的Cu，以及比第一粉末合金含有比Ag和Cu的组成（重量％）小的第二粉末合金，并且具有比第一粉末合金低的熔点 粉末合金，该混合物含有不超过35重量％的Ag和Cu。

公开(公告)号：EP2114114B1

公开(公告)日：2013-05-15

申请号：EP09156731.3

申请日：2009-03-30

Applicant: Xerox Corporation

Inventor： Chopra, Naveen ,  Wu, Yiliang ,  Kazmaier, Peter M.

IPC: H05K1/09 ,  H05K3/10 ,  H05K3/12 ,  C09D11/00 ,  H01L21/48

CPC classification number: H05K1/097 ,  C09D11/52 ,  H01L21/4867 ,  H05K3/102 ,  H05K3/105 ,  H05K3/1283 ,  H05K2201/0266 ,  H05K2201/0272 ,  H05K2203/1131 ,  H05K2203/121 ,  H05K2203/125

公开(公告)号：EP2502956A1

公开(公告)日：2012-09-26

申请号：EP10831294.3

申请日：2010-10-29

Applicant: Panasonic Corporation

Inventor： MATSUDA, Takashi ,  KOMORI, Kiyotaka ,  NOZUE, Akiyoshi ,  SUZUE, Takayuki ,  NISHINO, Mitsuyoshi ,  ASAHI, Toshiyuki ,  KITAGAWA, Yoshito ,  TANI, Naoyuki

IPC: C08J5/24 ,  B32B5/28 ,  B32B15/08 ,  C08K3/00 ,  C08L63/00 ,  C08L101/00 ,  H01L33/64 ,  H05K1/03

CPC classification number: H05K1/0373 ,  B32B5/28 ,  B32B15/14 ,  C08G59/38 ,  C08G59/4021 ,  C08G59/621 ,  C08J5/24 ,  H05K1/0366 ,  H05K2201/012 ,  H05K2201/0209 ,  H05K2201/0266 ,  Y10T428/24917 ,  Y10T428/24994 ,  Y10T428/25 ,  Y10T428/252 ,  Y10T428/254 ,  Y10T428/257 ,  Y10T442/20 ,  Y10T442/3455

Abstract: Disclosed is a prepreg obtained by impregnating a woven fabric base with a thermosetting resin composition, wherein the thermosetting resin composition contains 80 to 200 volume parts of an inorganic filler per 100 volume parts of a thermosetting resin, and the inorganic filler contains (A) gibbsite aluminum hydroxide particles having an average particle diameter (D 50 ) of 2 to 15 µm, (B) at least one inorganic component selected from the group consisting of boehmite particles having an average particle diameter (D 50 ) of 2 to 15 µm and inorganic particles that have an average particle diameter (D 50 ) of 2 to 15 µm and that contain crystal water having a release initiation temperature of 400°C or higher or contain no crystal water, and (C) aluminum oxide particles having an average particle diameter (D 50 ) of 1.5 µm or smaller, the compounded ratio (volume ratio) of the gibbsite aluminum hydroxide particles (A), the at least one inorganic component (B) selected from the group consisting of the boehmite particles and the inorganic particles, and the aluminum oxide particles (C) being 1: 0.1 to 2.5 : 0.1 to 1.

Abstract translation: 公开了一种通过用热固性树脂组合物浸渍机织织物基底而获得的预浸料，其中热固性树脂组合物每100体积份热固性树脂含有80-200体积份的无机填料，无机填料含有（A）三水铝矿 平均粒径（D 50）为2〜15μm的氢氧化铝粒子，（B）至少一种选自平均粒径（D 50）为2〜15μm的勃姆石粒子和无机成分的无机成分， 具有平均粒径（D 50）为2〜15μm，含有剥离开始温度为400℃以上或不含结晶水的结晶水的粒子，（C）平均粒径 （D 50）为1.5μm以下时，所述三水铝石型氢氧化铝粒子（A），所述至少一种无机成分（B）的组合比例（体积比） 由勃姆石颗粒和无机颗粒组成，氧化铝颗粒（C）为1:0.1至2.5:0.1:1。

公开(公告)号：EP2114114A1

公开(公告)日：2009-11-04

申请号：EP09156731.3

申请日：2009-03-30

Applicant: Xerox Corporation

Inventor： Chopra, Naveen ,  Wu, Yiliang ,  Kazmaier, Peter M.

IPC: H05K1/09 ,  H05K3/10 ,  H05K3/12

CPC classification number: H05K1/097 ,  C09D11/52 ,  H01L21/4867 ,  H05K3/102 ,  H05K3/105 ,  H05K3/1283 ,  H05K2201/0266 ,  H05K2201/0272 ,  H05K2203/1131 ,  H05K2203/121 ,  H05K2203/125

Abstract: A method of forming conductive features on a substrate from a solution of metal nanoparticles by providing a depositing solution and liquid depositing the depositing solution onto a substrate. The depositing solution is then heated to a temperature below about 140 °C to anneal the first and second nanoparticles and remove any reaction by-products. The depositing solution may be comprised of a mixture of first metal nanoparticles and second metal nanoparticles or a combination of first metal nanoparticles and a soluble second metal nanoparticle precursor. Furthermore, the average diameter of the first metal nanoparticles is about 50 nm to about 100 µm and the average diameter of the second metal nanoparticles is about 0.5 nm to about 20 nm.

Abstract translation: 一种通过提供沉积溶液并将沉积溶液沉积到基底上的从金属纳米颗粒溶液在衬底上形成导电特征的方法。 然后将沉积溶液加热至低于约140℃的温度以退火第一和第二纳米颗粒并除去任何反应副产物。 沉积溶液可以由第一金属纳米颗粒和第二金属纳米颗粒的混合物或第一金属纳米颗粒和可溶的第二金属纳米颗粒前体的组合构成。 此外，第一金属纳米颗粒的平均直径为约50nm至约100μm，并且第二金属纳米颗粒的平均直径为约0.5nm至约20nm。

公开(公告)号：EP1589540A1

公开(公告)日：2005-10-26

申请号：EP04703883.1

申请日：2004-01-21

Applicant: MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD.

Inventor： SUGITA, Yuichiro ,  TAKENAKA, Toshiaki

IPC: H01B1/20 ,  H05K1/11 ,  H05K3/40 ,  H05K1/09

CPC classification number: H05K3/4069 ,  H01B1/22 ,  H05K1/095 ,  H05K2201/0266 ,  H05K2201/0355 ,  H05K2203/1461 ,  Y10T29/49126 ,  Y10T428/2982

Abstract: It is intended to reliably form high-quality via-hole conductor with less variation, and to realize a circuit forming board having excellent connection reliability. It provides a conductive paste comprising primary particles and agglomerate of primary particles, conductive particles of 0.5 to 20 µm in average particle diameter and 0.07 to 1.7 m 2 /g in specific surface area, and a binder based on thermosetting resin, and also provides an inexpensive circuit forming board with high connection reliability by using the paste.

Abstract translation: 它的目的是可靠地形成高品质的通孔导体与较小的变化，并实现具有优异的连接可靠性的电路形成用基板。 它提供了一个导电浆料，其包含一次颗粒和一次颗粒的聚集体，在平均粒径的0.5〜20微米的导电性粒子和0点07在比表面积1.7米<2> / g，并且基于热固性树脂的粘合剂，并且 所以提供便宜的电路，通过使用糊形成具有高的连接可靠性板上。

公开(公告)号：EP0996321A2

公开(公告)日：2000-04-26

申请号：EP99306548.1

申请日：1999-08-19

Applicant: SONY CHEMICALS CORPORATION

Inventor： Yamada, Yukio, Sony Chemicals Corporation ,  Saito, Masao, Sony Chemicals Corporation ,  Shinozaki, Junji, Sony Chemicals Corporation ,  Takeichi, Motohide, c/o Sony Chemicals Corporation

IPC: H05K3/32 ,  H01L21/60 ,  H01R4/04

CPC classification number: H01L24/83 ,  H01L24/29 ,  H01L2224/29101 ,  H01L2224/2919 ,  H01L2224/29399 ,  H01L2224/29499 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/8319 ,  H01L2224/838 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01019 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/07802 ,  H01L2924/0781 ,  H01L2924/14 ,  H01R4/04 ,  H05K3/323 ,  H05K2201/0221 ,  H05K2201/0224 ,  H05K2201/0233 ,  H05K2201/0266 ,  H05K2201/10674 ,  H01L2924/00

Abstract: An anisotropically electroconductive adhesive to be used for establishing electric connection between terminals of, for example, an IC chip and of a circuit pattern, at a low cost with high reliabilities both in the establishment of electric connection and in the insulation upon the connection without suffering from short-circuiting between circuit lines in the circuit and without causing any obstruction on the circuit, even when the terminals or the circuit lines are disposed at close intervals, which adhesive comprises an electrically insulating adhesive matrix and electroconductive particles dispersed in the matrix, wherein the electroconductive particles comprise at least two electroconductive particulate products of different average particle sizes and wherein each particle of both the particulate products is coated with an electrically insulating resin insoluble in the insulating adhesive matrix.

公开(公告)号：EP0508035A1

公开(公告)日：1992-10-14

申请号：EP91870221.8

申请日：1991-12-27

Applicant: Laude, Lucien Diégo

Inventor： Laude, Lucien Diégo

IPC: C23C18/30

CPC classification number: H05K3/102 ,  C23C18/30 ,  H05K1/0306 ,  H05K1/0313 ,  H05K3/181 ,  H05K2201/0266 ,  H05K2201/0347 ,  H05K2203/107

Abstract: L'application du procédé décrit dans l'invention résulte dans la métallisation de surface de matériaux diélectriques. Ce procédé comprend une première étape dans laquelle une poudre métallique, dont la taille des grains est comprise entre 10 et 5000 nm, est déposée,puis incorporée à la surface du matériau diélectrique. Dans la seconde étape du procédé, le matériau diélectrique ainsi imprégné de métal est immergé dans un bain autocatalytique ce qui provoque le recouvrement des zones imprégnées du matériau par une couche du métal contenu dans le bain suivant une épaisseur proportionnelle au temps d'immersion. Le procédé décrit dans l'invention permet de métalliser également des matériaux comme les oxydes, les polymères et les composites contenant ces oxydes et/ou ces polymères. Les caractéristiques des dépôts métalliques sont contrôlées par le type de métal, la taille et la géométrie des grains de poudre métallique d'une part, par le type et la structure des matériaux diélectriques recouverts de ces dépôts, d'autre part.

Abstract translation: 所描述的方法的应用导致介电材料的表面金属化。 该方法包括第一阶段，其中沉积粒度为10至5000nm的金属粉末，然后将其并入电介质材料的表面。 在该方法的第二阶段中，将浸渍有金属的电介质材料浸入自催化浴中，这导致用包含在浴液中的金属层浸渍的材料的覆盖层根据厚度是 与浸泡时间成正比。 所描述的方法还使得可以对包含这些氧化物和/或这些聚合物的氧化物，聚合物和复合材料等材料进行金属化。 金属沉积物的特性一方面由金属的类型和金属粉末的颗粒的尺寸和几何形状进行控制，另一方面由这些覆盖的介电材料的类型和结构进行控制 存款。