Abstract:
An apparatus and method wherein the apparatus comprises a deformable substrate (3); a conductive portion (7);and at least one support (5) configured to couple the conductive portion (7) to the deformable substrate (3) so that the conductive portion (7) is spaced from the deformable substrate (3).
Abstract:
According to one embodiment, an electrical interconnection system (10) includes a pair of printed wiring boards (12a and 12b) formed of a printed wiring board material. Each printed wiring board has multiple surface pads (18a and 18b) formed on a surface of the printed wiring board adjacent its outer edge. The surface of each printed wiring board is operable to be placed adjacent to one another such that an electrical circuit (134) coupled to one printed wiring board (12a) is electrically coupled to another electrical circuit of the other printed wiring board (125) by contact of the surface pads of each printed wiring board with one another.
Abstract:
A connector assembly of complex shape has a connector body which possesses a plurality of distinct surfaces both parallel arid intersecting. Laser directed structuring is used to form patterns of conductive traces on the surfaces of the connector body and raised ribs are formed along the traces and interposed between them to form channels that encompass at least portions of the traces. The raised ribs increase the time in which plating solution can dwell over the laser excited areas and also form abrasion barriers to prevent abrasion fo the conductive traces during the plating thereof.
Abstract:
The invention relates to a method of aligning a flexible foil sheet having a general first foil sheet length direction to form stacked foil sheet layers on a reel having a reel diameter. The method comprises providing multiple alignment markers in the foil sheet, distanced conform the reel diameter and each having an mark length direction transverse to the first foil sheet length direction, to form protrusions and corresponding recesses on opposite faces of the foil sheet; winding the foil sheet on the reel in the first foil sheet length direction of the foil sheet; and co-aligning the alignment markers to have protrusions of one mark matching with a recess of another mark, so as to block relative movement of the stacked foil sheet layers in the first foil sheet length direction. Preferably, the foil sheet layers are provided with device functionality to form a stacked foil sheet layered device.
Abstract:
A method of patterning a flowable material on a surface, the method comprising providing the surface with at least one channel and at least one through- hole with at least two openings, wherein at least one of the openings is located in the surface adjacent to the at least one channel, such that when flowable material is deposited adjacent to another of the at least two openings, the material is directed into the at least one through-hole by the action of capillary forces and emerges at the opening adjacent to the at least one channel whereupon it is further directed along said channel.
Abstract:
Die Erfindung betriffteineelektrische Schaltanordnung mit einem MID-Schaltungsträger und einer Verbindungsschnittstelle,wobei die Verbindungsschnittstelleauf einer Oberfläche des MID-Schaltungsträgers angeordnet ist. Die elektrische Schaltanordnung umfasst ferner mindestens ein elektrisches Kontaktpaar mitmindestens einem Verbindungsschnittstellen-Kontaktelement und mindestens einem auf der Oberfläche vorgesehenen und an Verbindungsschnittstellen-Kontaktelement angeordneten MID-Kontaktelement. Die Erfindung betrifft ferner eine Kontaktelementgruppe mit mindestens einem elektrisches Kontaktelement zur elektrischen Kontaktierung eines MID-Schaltungsträgers, das auf einer Oberfläche eines MID-Schaltungsträgers ausgebildet, mit diesem elektrisch verbunden ist, und sich von der der Oberfläche weg erstreckt. Das mindestens eine Kontaktelement ist miteinem Leitungselement des MID-Schaltungsträgersverbunden.
Abstract:
A molded interconnect device with a high-current trace and methods of making a molded interconnect device with a high-current trace are described. The molded interconnect device comprises a substrate surface and an interconnect pattern. The interconnect pattern is at least one of a rib raised from the substrate surface and a channel protruding into the substrate surface. In a fist embodiment, the molded interconnect device is molded from photosensitive plastic molded in a one-shot molding process. A trace is grown on the portion of the interconnect pattern where an interconnect path has been written, either by a laser or by photolithography. In a second embodiment, the molded interconnect device is molded of plastic and the trace is grown by at least one of a mask and print-and-plate process and a mask and print-and-etch process. The trace forms at least one of an angle and a curve in cross section.