公开(公告)号：US10038264B2

公开(公告)日：2018-07-31

申请号：US15351237

申请日：2016-11-14

Applicant: Microsoft Technology Licensing, LLC

Inventor： David Lukofsky ,  Joseph Christopher Bolling ,  Jeffrey M. Quackenbush ,  Tapani von Rauner

IPC: H01R12/00 ,  H01R12/91 ,  H01R12/78 ,  H01R12/72 ,  H04N13/04

CPC classification number: H01R12/91 ,  H01R12/721 ,  H01R12/78 ,  H04N13/344 ,  H04N2213/001 ,  H04N2213/008 ,  H05K1/0221 ,  H05K1/0295 ,  H05K1/11 ,  H05K3/361 ,  H05K2201/09272 ,  H05K2201/09381 ,  H05K2201/0939

Abstract: A universal coupling is disclosed for electrically and mechanically connecting flexible printed circuit (FPC) components within asymmetric FPC modules. The universal coupling allows a first FPC component to be connected to a second FPC component in two or more different orientations. This allows identical FPC components to be used in two or more asymmetric FPC modules. This in turn allows a reduction in the number of parts and tooling required to fabricate the two or more asymmetric FPC modules, and a simplification of the fabrication process.

公开(公告)号：US09985600B2

公开(公告)日：2018-05-29

申请号：US15088147

申请日：2016-04-01

Applicant: FOXCONN INTERCONNECT TECHNOLOGY LIMITED

Inventor： Yong-Chun Xu ,  Jian-She Hu ,  Chao-Tung Huang ,  Chih-Ching Hsu

IPC: H03H7/09 ,  H01F30/02 ,  H01F27/24 ,  H01F27/28 ,  H05K1/11 ,  H01F27/29 ,  H05K1/02

CPC classification number: H03H7/09 ,  H01F27/24 ,  H01F27/28 ,  H01F27/29 ,  H01F27/292 ,  H01F30/02 ,  H05K1/0231 ,  H05K1/0233 ,  H05K1/0245 ,  H05K1/111 ,  H05K2201/09272 ,  H05K2201/09281 ,  H05K2201/10015 ,  H05K2201/1003

Abstract: A printed circuit board assembly includes a printed circuit board, a number of electronic components mounted thereon, and a number of conductive traces electrically connecting the components to form a number of transmission channels. Each of the channels has first and second transmission routes for transmitting differential signals. Each channel includes a common mode choke, a pair of capacitors, and an autotransformer. The common mode choke includes a first coil series connection with the first transmission route and a second coil series connection with the second transmission route. The capacitors include a first capacitor series connection with the first transmitting route and a second capacitor series connection with the second transmitting route.

公开(公告)号：US09888590B2

公开(公告)日：2018-02-06

申请号：US15519579

申请日：2016-08-19

Applicant: BOE Technology Group Co., Ltd. ,  Chongqing BOE Optoelectronics Technology Co., Ltd.

Inventor： Zhuo Xu ,  Yajie Bai ,  Xiaoyuan Wang ,  Jaikwang Kim

IPC: H05K1/00 ,  H05K5/00 ,  H01R12/70 ,  H01R12/55 ,  H05K1/18

CPC classification number: H05K5/0017 ,  H01R12/55 ,  H01R12/7076 ,  H05K1/11 ,  H05K1/181 ,  H05K2201/09227 ,  H05K2201/09272 ,  H05K2201/10128

Abstract: A printed circuit board, a display panel and a wiring method are provided by embodiments of the disclosure. The printed circuit board includes: a first multichannel circuit connecting terminal; a second multichannel circuit connecting terminal; and a plurality of connecting wires connecting a plurality of second channel connecting pins of the second multichannel circuit connecting terminal with a part of a first channel connecting pins of the first multichannel circuit connecting terminal in one-to-one correspondence, the rest of the first channel connecting pins being spare, where at least one of the plurality of connecting wires has a first portion, which is bent to extend through a spare region, on the printed circuit board, between the spare first channel connecting pins and the second multichannel circuit connecting terminal.

公开(公告)号：US20180024673A1

公开(公告)日：2018-01-25

申请号：US15709767

申请日：2017-09-20

Applicant: LG INNOTEK CO., LTD.

Inventor： Jung Hyuck HAN ,  Yu Lim CHOE ,  Chan Kyu KOO ,  Jun Sik SHIN ,  Joon Hyuk YANG ,  Seung Jin LEE ,  Yu Hong JEON

IPC: G06F3/044 ,  H05K1/02 ,  H05K3/28

CPC classification number: G06F3/044 ,  G06F2203/04112 ,  H05K1/0296 ,  H05K3/28 ,  H05K2201/09245 ,  H05K2201/09272

Abstract: A capacitive touch window includes: a substrate; a cover substrate; and an electrode, wherein a portion of the substrate is flat and another potion thereof is curved, and the electrode includes: a first sensing electrode; a second sensing electrode including second unit sensing electrodes spaced apart from the first sensing electrode; a bridge electrode connecting the second unit sensing electrodes; and an insulating layer between the first sensing electrode and the bridge electrode. The first and second sensing electrodes are disposed on a same surface of the substrate. The bridge electrode includes: a first mesh line having a first width; a second mesh line having a second width; and a first cross area in which the first and second mesh lines cross each other, the first cross area having a third width, wherein the third width is 2 to 5 times the first width and the second width.

公开(公告)号：US09795031B2

公开(公告)日：2017-10-17

申请号：US14763074

申请日：2014-12-03

Applicant: BOE TECHNOLOGY GROUP CO., LTD.

Inventor： Song Song ,  Kazuyoshi Nagayama

IPC: H05K1/02 ,  H05K1/03 ,  H05K1/09 ,  H05K1/11 ,  H05K3/06 ,  G02F1/1345

CPC classification number: H05K1/0393 ,  G02F1/13452 ,  H05K1/0248 ,  H05K1/0296 ,  H05K1/09 ,  H05K1/115 ,  H05K3/06 ,  H05K2201/0391 ,  H05K2201/09227 ,  H05K2201/09245 ,  H05K2201/09263 ,  H05K2201/09272 ,  H05K2201/10128 ,  H05K2201/10136

Abstract: The present disclosure discloses a wiring board used to connect a driving chip and a display panel, a flexible display panel and a display device. Signal output ends on the driving chip and signal input ends on the display panel may be arranged in pairs; and the wiring board may include fanout lines each of which is configured to connect a pair of signal output end and the signal input end. The wiring board may include a substrate; a plurality of segments of first connection lines having first resistivity is arranged on a first surface of the substrate; a plurality of segments of second connection lines having second resistivity is arranged on a second surface of the substrate opposite to the first surface. At least parts of the fanout lines are formed by connecting the first connection lines and the second connection lines.

公开(公告)号：US20170271282A1

公开(公告)日：2017-09-21

申请号：US15448443

申请日：2017-03-02

Applicant: KABUSHIKI KAISHA TOSHIBA

Inventor： Fongru LIN ,  Yoshihiro IIDA

IPC: H01L23/66 ,  H05K1/18 ,  H01L23/00 ,  H01L23/552 ,  H01L23/498

CPC classification number: H01L23/66 ,  H01L23/49531 ,  H01L23/49822 ,  H01L23/49838 ,  H01L23/4985 ,  H01L23/552 ,  H01L24/16 ,  H01L2223/6638 ,  H01L2224/16227 ,  H01L2224/32225 ,  H01L2224/48227 ,  H01L2224/49109 ,  H05K1/0225 ,  H05K1/0245 ,  H05K1/0253 ,  H05K2201/09272 ,  H05K2201/10151 ,  H05K2201/10159 ,  H05K2201/10734

Abstract: A circuit board includes an insulating layer, a ground layer formed on a first surface of the insulating layer and including a plurality of openings arranged in first and second surface directions, each of the openings having a shape of a polygon having five or more sides, and a wiring layer formed on a second surface of the insulating layer opposite to the first surface.

公开(公告)号：US20170264260A1

公开(公告)日：2017-09-14

申请号：US15255410

申请日：2016-09-02

Applicant: Kabushiki Kaisha Toshiba

Inventor： Satoru FUKUCHI

IPC: H05K1/02 ,  H01P3/08 ,  H03H7/42 ,  H05K1/11 ,  H01L23/498 ,  H01L23/66 ,  H04B3/28

CPC classification number: H03H7/427 ,  H01L23/49822 ,  H01L23/49827 ,  H01L23/66 ,  H01L2223/6627 ,  H01L2223/6661 ,  H01P3/081 ,  H05K1/0245 ,  H05K2201/09272 ,  H05K2201/09727

Abstract: According to one embodiment, there is provided a multilayer substrate including a signal layer. The signal layer includes a first line and a second line which form a differential pair. The first line electrically connects a first node and a second node in the signal layer. The second line electrically connects a third node and a fourth node in the signal layer. The interval between the first line and the second line is approximately constant from the first node to the second node. A physical length from the third node to the fourth node in the second line is shorter than a physical length from the first node to the second node in the first line. A width of the second line is thicker than a width of the first line.

公开(公告)号：US09578746B2

公开(公告)日：2017-02-21

申请号：US14695936

申请日：2015-04-24

Applicant: ScienBiziP Consulting (Shen Zhen) Co., Ltd.

Inventor： Hsien-Pei Lung ,  Wu-Zhe Yu

IPC: H05K1/00 ,  H05K1/11 ,  H05K1/02 ,  H05K5/00

CPC classification number: H05K1/115 ,  H05K1/0215 ,  H05K1/116 ,  H05K5/0026 ,  H05K2201/09272 ,  H05K2201/09572

Abstract: A circuit board includes a substrate defining a plurality of ground attaching holes and a plurality of first through-holes. The substrate includes a first surface and a side edge. Wherein, a plurality of parallel and spaced first conductive paths is formed on the first surface around each ground attaching hole. A first arcuate conductive portion is formed at each end of each first conductive path. An angle between each first conductive path and the side edge is 45° or 135°. The first through-holes respectively extend through the first arcuate conductive portions and electrically couple with the first conductive paths.

Abstract translation: 电路板包括限定多个接地安装孔和多个第一通孔的基板。 基板包括第一表面和侧边缘。 其中，在每个接地连接孔周围的第一表面上形成多个平行和间隔的第一导电路径。 第一弧形导电部分形成在每个第一导电路径的每一端。 每个第一导电路径和侧边缘之间的角度为45°或135°。 第一通孔分别延伸穿过第一弧形导电部分并与第一导电路径电耦合。

公开(公告)号：US20160353565A1

公开(公告)日：2016-12-01

申请号：US15161731

申请日：2016-05-23

Applicant: CANON KABUSHIKI KAISHA

Inventor： Junichiro Iri ,  Ryo Sato ,  Kazuhiro Idogawa ,  Chiaki Muraoka ,  Hiromasa Amma ,  Takuya Iwano

IPC: H05K1/02 ,  B41J2/14

CPC classification number: H05K1/028 ,  B41J2/14 ,  B41J2/1752 ,  B41J2/1753 ,  B41J2/17553 ,  H05K1/0296 ,  H05K3/0058 ,  H05K2201/09227 ,  H05K2201/09254 ,  H05K2201/09272 ,  H05K2201/09663 ,  H05K2201/09727 ,  H05K2201/0979

Abstract: A wire pattern is divided into a plurality of portions in order to provide a circuit board for which very reliably bonding can be achieved and a liquid ejection head including the circuit board.

Abstract translation: 线图案被分成多个部分，以便提供可以实现非常可靠地结合的电路板和包括电路板的液体喷射头。

公开(公告)号：US20160323990A1

公开(公告)日：2016-11-03

申请号：US15070659

申请日：2016-03-15

Applicant: FUJITSU LIMITED

Inventor： Takahiro KITAGAWA

IPC: H05K1/02 ,  H05K3/00 ,  H05K1/09

CPC classification number: H05K1/111 ,  H05K1/0216 ,  H05K2201/09272 ,  H05K2201/099 ,  H05K2201/10371 ,  Y02P70/611

Abstract: A printed substrate includes: a substrate; a copper layer formed on the substrate; and a resin formed on the substrate to cover a part of the copper layer, wherein the copper layer includes a first region covered by the resin and a second region in which a shield sheet metal is installed, the shield sheet metal surrounding a predetermined region of the substrate, and wherein an angle formed between an outer edge portion of the copper layer covered by the resin and an outer edge portion of the resin which covers the copper layer at a location at which the outer edge portion of the copper layer and the outer edge portion of the resin intersect each other as viewed in plan is an obtuse angle.

Abstract translation: 印刷基板包括：基板; 形成在所述基板上的铜层; 以及形成在所述基板上以覆盖所述铜层的一部分的树脂，其中所述铜层包括被所述树脂覆盖的第一区域和其中安装有屏蔽金属片的第二区域，所述屏蔽金属片围绕预定区域 并且其中在由所述树脂覆盖的铜层的外边缘部分和覆盖铜层的树脂的外边缘部分之间形成的角度处于铜层的外边缘部分和外层 如图所示，树脂的边缘部分彼此相交是钝角。