Abstract:
Ce procédé d'hybridation consiste : - à munir un premier composant 1 de premiers plots 3 de réception de protubérances, - à munir un deuxième composant 2 de deuxièmes plots 5 de réception de protubérances, - les premiers 3 et deuxièmes 5 plots étant respectivement destinés à être associés deux à deux pour former des paires de plots, - puis, à munir les premiers plots et/ou les deuxièmes plots de protubérances 4 réalisées en un matériau fusible, - puis à reporter l'un sur l'autre les premier et deuxième composants, - puis à porter l'ensemble des premier et deuxième composants et corollairement les protubérances de soudure à une température de soudure pour interconnecter les premiers et deuxièmes plots de chaque paire de plots par soudage des protubérances sur ces plots, - et enfin, à faire refroidir la soudure ainsi obtenue. Parmi les protubérances 4 de matériau fusible équipant les premiers 3 et/ou les deuxièmes 5 plots, sont réalisées au moins trois protubérances 6 de plus grandes dimensions, et notamment de plus grande hauteur, de telle sorte qu'avant élévation de la température jusqu'à atteindre la température d'hybridation, le composant reporté ne repose limitativement que sur ces protubérances.
Abstract:
A printed circuit board (PCB) assembly having a plurality of circuit layers including outer layers and intervening layers with through-vias and micro-vias used to translate a portion of the signal connections of the grid, thereby creating a set of diagonal routing channels between the vias on internal layers of the board and a BGA package mounted on the printed circuit board.
Abstract:
A non-uniform transmission line includes at least one patterned conductive layer 8102, 104), a dielectric layer (103) adjacent to the patterned conductive layer(s) (102, 104), and insulating layer (101, 105) surrounding the patterned conductive layer(s) and the dielectric layer.
Abstract:
On each surface of a dielectric substrate (1b), arranged are a first conductor line pattern (12, 22) having a plurality of first line segments (12a-12c, 22a-22f) and a second conductor line pattern (13, 23) having a plurality of second line segments (13a-13c, 23a-23f). Ends of each first conductor line segment overlap the second conductor line segments, and the first and second line segments are connected via through-holes (14a-14e, 24), thereby forming a single spiral conductor line. Each second conductor line segment for connecting adjacent first conductor line segments has a pair of end parts connected to the first conductor line segments via through-holes and a halfway part having a smaller width.
Abstract:
In a coupling adjusting structure for a double-tuned circuit according to the present invention, first and second coils are configured such that a pair of first conductive patterns formed on a first surface of a printed circuit and a corresponding pair of second conductive patterns formed on a second surface of the printed circuit board are connected via corresponding connecting conductors, thereby making the first and second coils low and thin. Also, one end of the first coil and the corresponding end of the second coil are disposed close to each other, a first ground conductive pattern is disposed at least on the first surface of the printed circuit, and a first jumper connected to the first ground conductive pattern is disposed between the first and second coils so as to adjust an inductive coupling of the double-tuned circuit, thereby achieving a coupling adjusting structure for a double-tuned circuit whose inductive coupling is adjustable.
Abstract:
Um bei der Kontaktierung von zwei Leiterplatten (2,4) eine hohe Positioniergenauigkeit ihrer beiden Kontaktbereiche (8) zueinander zu gewährleisten, sind die beiden Kontaktbereiche (8) zueinander komplementär dreidimensional strukturiert. Bevorzugt ist eine Maske (12) vorgesehen, die Ausnehmungen (14) für Kontaktelemente (10) der beiden Leiterplatten (2,4) aufweist. Diese Positionierung anhand des Leiterbahnmusters und unabhängig von einem Kontaktierungsgehäuse (26) hat den Vorteil, dass die Positioniergenauigkeit von Toleranzen zwischen Leiterbahnmuster und dem Kontaktierungsgehäuse (26) unbeeinflußt ist.
Abstract:
A flexible printed circuitry member includes a generally planar dielectric substrate (22). First and second pseudo-twisted conductors (24, 25) are disposed on opposite sides of the substrate (22) and extend longitudinally in a pattern of twist sections between crossover points whereat the conductors cross over each other separated by the dielectric substrate. The crossover points (29) define a centerline with the first and second conductors (24, 25) reversing each other on opposite sides of the centerline at each crossover point (29). The twist sections between crossover points along the centerline are of randomly differing lengths (P11 - P16, P21 - P26, P31 - P36).
Abstract:
An insulative magnetic layer is disposed between a power source conductor layer and a ground conductor layer of a printed-wiring board. Two pieces of conductors are formed by cutting out a part of the power source conductor layer. Another two pieces of conductors are formed by cutting out a part of the ground conductor layer. The former conductors and the latter conductors are connected by five viaholes. A spiral coil inductor of a spiral form is formed in this way. This inductor has the strengthened inductance owing to the insulative magnetic layer provided therein.