실리콘 나노와이어/탄소나노튜브/징크옥사이드 코어/다중쉘 나노복합체의 제조방법 및 상기 나노복합체를 포함하는 태양전지
    11.
    发明公开
    실리콘 나노와이어/탄소나노튜브/징크옥사이드 코어/다중쉘 나노복합체의 제조방법 및 상기 나노복합체를 포함하는 태양전지 有权
    制备硅纳米线/碳纳米管/氧化锌核/多层纳米复合材料和包含纳米复合材料的太阳能电池的方法

    公开(公告)号:KR1020110040636A

    公开(公告)日:2011-04-20

    申请号:KR1020100033269

    申请日:2010-04-12

    CPC classification number: Y02E10/542 Y02P70/521 B82B3/00 H01L31/04

    Abstract: PURPOSE: A method for manufacturing a silicon nano-wire/carbon-nano-tube/zinc oxide core/multi-shell nano composite and a solar cell including the nano composite are provided to vertically arrange the nano composite on a large-sized substrate. CONSTITUTION: A mono-crystalline silicon substrate undergoes ultraviolet/ozone treatment. The substrate is etched using an etching solution. The etching solution is based on a mixture of HF and AgNO_3. The etched substrate is immersed in a HNO_3 solution in order to eliminate silver dendrite from the substrate. A cleaning process and a drying process are implemented. A silicon substrate, on which silicon nano-wire is vertically arranged, is obtained. The silicon substrate is arranged in a thermal chemical vapor deposition apparatus, and carbon-nano-tube is deposited on the silicon nano-wire in order to obtain a silicon nano-wire/carbon-nano-tube core/shell nano composite.

    Abstract translation: 目的:提供一种制造硅纳米线/碳纳米管/氧化锌核/多壳纳米复合材料的方法和包括纳米复合材料的太阳能电池,以将纳米复合材料垂直布置在大尺寸基板上。 构成:单晶硅衬底进行紫外/臭氧处理。 使用蚀刻溶液蚀刻衬底。 蚀刻溶液基于HF和AgNO_3的混合物。 将蚀刻的衬底浸入HNO 3溶液中以从衬底中除去银枝晶。 实施清洁处理和干燥处理。 获得其上垂直排列有硅纳米线的硅衬底。 将硅衬底布置在热化学气相沉积装置中,并将碳纳米管沉积在硅纳米线上以获得硅纳米线/碳纳米管核/壳纳米复合材料。

    질화물 반도체소자 및 그 제조방법
    12.
    发明公开
    질화물 반도체소자 및 그 제조방법 有权
    III-NITRIDE SEMICONDUCTOR及其制作方法

    公开(公告)号:KR1020090060476A

    公开(公告)日:2009-06-15

    申请号:KR1020070127296

    申请日:2007-12-10

    CPC classification number: H01L21/0254 H01L21/0262 H01L21/76254

    Abstract: A nitride semiconductor device including a buffer layer and a manufacturing method thereof are provided to form a GaN layer without a crack by forming an ion implanted layer into a periodic pattern shape on a surface of a silicon substrate. A silicon substrate(310) includes an ion implanted region(330). A buffer layer(340) is formed on the silicon substrate in which the ion implanted region is formed. A GaN layer(350) is formed on the buffer layer. The ion implanted region has a lattice distortion region formed into a periodic pattern shape and a region in which an ion is not implanted. An ion implanted depth of the ion implanted region is 30nm~1um. The buffer layer is made of InAlGaN.

    Abstract translation: 提供了包括缓冲层的氮化物半导体器件及其制造方法,以通过在硅衬底的表面上形成周期性图案形状的离子注入层来形成没有裂纹的GaN层。 硅衬底(310)包括离子注入区(330)。 在其上形成有离子注入区的硅衬底上形成缓冲层(340)。 在缓冲层上形成GaN层(350)。 离子注入区域具有形成为周期性图案形状的晶格畸变区域和不注入离子的区域。 离子注入区的离子注入深度为30nm〜1um。 缓冲层由InAlGaN制成。

    산화 아연계 박막 구조물의 제조 방법
    14.
    发明公开
    산화 아연계 박막 구조물의 제조 방법 无效
    氧化锌薄层结构的制备方法

    公开(公告)号:KR1020140089037A

    公开(公告)日:2014-07-14

    申请号:KR1020130000092

    申请日:2013-01-02

    Abstract: Provided is a method of manufacturing a zinc oxide-based thin film structure which includes the steps of forming a first zinc oxide-based thin film on a substrate at first temperature in a first chemical vapor deposition process; and forming a second zinc oxide-based thin film on the first zinc oxide-based thin film at second temperature which is lower than the first temperature in a second chemical vapor deposition process, wherein a difference between the second temperature and the first temperature is set to 100°C or less. Therefore, it is possible to manufacture a zinc oxide-based thin film structure having excellent crystalline quality at a relatively low temperature.

    Abstract translation: 本发明提供一种氧化锌系薄膜结构体的制造方法,其特征在于,在第一化学气相沉积工艺中,在第一温度下,在基板上形成第一氧化锌系薄膜的工序; 以及在第二化学气相沉积工艺中在第二温度低于第一温度的第一氧化锌基薄膜上形成第二氧化锌基薄膜,其中第二温度与第一温度之间的差设定 至100℃以下。 因此,可以在相对低的温度下制造具有优异结晶质量的氧化锌基薄膜结构。

    단결정 기판 구조물 및 이의 제조 방법
    15.
    发明授权
    단결정 기판 구조물 및 이의 제조 방법 有权
    单晶衬底结构及制造单晶衬底结构的方法

    公开(公告)号:KR101363760B1

    公开(公告)日:2014-02-18

    申请号:KR1020120117717

    申请日:2012-10-23

    Abstract: A single crystalline substrate structure includes a single crystalline substrate, a gallium nitride layer formed on the single crystalline substrate including a carbonized nitride layer. Therefore, the gallium nitride layer can be formed by using the carbonize nitride layer pattern as a mask and by inducing the lateral growth of the gallium nitride layer.

    Abstract translation: 单晶衬底结构包括单晶衬底,在包含碳化氮化物层的单晶衬底上形成的氮化镓层。 因此,可以通过使用碳化氮化物层图案作为掩模并且通过诱导氮化镓层的横向生长来形成氮化镓层。

    발광다이오드 및 그 제조방법
    16.
    发明授权
    발광다이오드 및 그 제조방법 有权
    发光二极管及其制造方法

    公开(公告)号:KR101096301B1

    公开(公告)日:2011-12-20

    申请号:KR1020090101971

    申请日:2009-10-26

    Abstract: 발광다이오드의 구조 및 이를 제조하는 방법이 개시된다. 발광다이오드는 기판 및 반도체층을 포함하며 상기 기판 및 상기 반도체층과는 상이한 물질로 구성된 광 산란부가 상기 기판과 상기 반도체층 사이에 형성되어 있다. 상기 발광다이오드를 제조하는 방법은 기판을 형성하는 단계, 기판 상부에 포토레지스트를 형성하는 단계, 포토레지스트의 패턴을 형성하는 단계, 포토레지스트의 패턴이 형성된 기판을 열처리 하는 단계, 및 열처리된 기판 상에 반도체층 및 전극을 형성하는 단계를 포함한다.
    발광다이오드, 외부 양자 효율, 광 산란부

    이온주입을 통한 질화물 반도체 형성 방법 및 이를 이용하여 제조한 발광다이오드
    18.
    发明公开
    이온주입을 통한 질화물 반도체 형성 방법 및 이를 이용하여 제조한 발광다이오드 有权
    形成氮化物半导体和发光二极管的方法

    公开(公告)号:KR1020100032513A

    公开(公告)日:2010-03-26

    申请号:KR1020080091436

    申请日:2008-09-18

    Abstract: PURPOSE: A nitride method for forming a semiconductor through an ion implantation and a light emitting diode which it manufactures using this instead of forms the ion implantation region controlling the dose amount for a horizontal deposition method mask on a domain in a form of the line and space. The dislocation density of a gallium nitride film having the stable crystalline is reduced. CONSTITUTION: An ion implantation region(120) of line and space pattern is formed on a surface of a silicon substrate(100). At this time, the ion implant dose quantity controls 1E17 ion/cm excess 5E18 ion/cm this harrow. The ion implantation region is formed into the implant energy of 30 ~ 50keV. A GaN thin film(130) is formed on the silicon substrate front including the InxAlyGa1-x-yN layer. At this time, in the silicon substrate in which the ion implantation region is not formed, the GaN layer is grown horizontally to the ion implantation region and the GaN thin film is formed.

    Abstract translation: 目的:通过离子注入形成半导体的氮化物方法和使用其制造的发光二极管,而不是形成离子注入区域,以离子注入区域形式控制在线形式的域上的水平沉积方法掩模的剂量, 空间。 具有稳定结晶性的氮化镓膜的位错密度降低。 构成:在硅衬底(100)的表面上形成线和空间图案的离子注入区(120)。 此时,离子注入剂量控制1E17离子/ cm超过5E18离子/ cm这种耙子。 离子注入区形成为30〜50keV的注入能量。 在包括In x Al y Ga 1-x-y N层的硅衬底正面上形成GaN薄膜(130)。 此时,在没有形成离子注入区域的硅衬底中,GaN层与离子注入区域水平生长,形成GaN薄膜。

    발광다이오드 및 그 제조방법
    20.
    发明公开
    발광다이오드 및 그 제조방법 有权
    发光二极管及其制造方法

    公开(公告)号:KR1020110045407A

    公开(公告)日:2011-05-04

    申请号:KR1020090101971

    申请日:2009-10-26

    Abstract: PURPOSE: A light emitting diode and manufacturing method thereof are provided to manufacture a light emitting diode with high external quantum efficiency by simple processes, thereby saving manufacturing costs. CONSTITUTION: A semiconductor buffer layer(102) is formed on a substrate(101). A first semiconductor layer(103) is formed on the semiconductor buffer layer. A light emitting area(104) is formed on the first semiconductor layer. A second semiconductor layer(105) is formed on the light emitting area. A transparent electrode(106) is formed on the second semiconductor layer.

    Abstract translation: 目的:提供一种发光二极管及其制造方法,通过简单的工艺制造具有高外量子效率的发光二极管,从而节省制造成本。 构成:在衬底(101)上形成半导体缓冲层(102)。 在半导体缓冲层上形成第一半导体层(103)。 在第一半导体层上形成发光区域(104)。 在发光区域上形成第二半导体层(105)。 在第二半导体层上形成透明电极(106)。

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