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公开(公告)号:KR1020130049747A
公开(公告)日:2013-05-14
申请号:KR1020120123696
申请日:2012-11-02
Applicant: 도쿄엘렉트론가부시키가이샤
IPC: H01L21/02
CPC classification number: H01L21/67046 , H01L21/67173 , H01L21/67178 , H01L21/6719 , H01L21/67213 , H01L21/67253 , H01L21/67748 , H01L21/6875
Abstract: PURPOSE: A substrate processing system, a substrate transferring method, and a computer storage medium are provided to reduce a footprint by decreasing the number of wafer transferring processes. CONSTITUTION: A wafer cleaning unit(141) cleans the rear of a wafer before the wafer is inputted. A wafer inspecting unit(142) inspects whether to expose the wafer before the wafer is inputted to an exposing device. A transferring device(143) transfers the wafer. The wafer cleaning unit and the wafer inspecting unit are formed on the front of an interface station.
Abstract translation: 目的:提供基板处理系统,基板转印方法和计算机存储介质,通过减少晶片转印工艺的数量来减少占用面积。 构成:在晶片输入之前,晶片清洁单元(141)清洁晶片的后部。 晶片检查单元(142)在将晶片输入到曝光装置之前检查是否暴露晶片。 传送装置(143)传送晶片。 晶片清洁单元和晶片检查单元形成在界面站的前面。
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公开(公告)号:KR1020130032274A
公开(公告)日:2013-04-01
申请号:KR1020120105203
申请日:2012-09-21
Applicant: 도쿄엘렉트론가부시키가이샤
IPC: H01L21/677 , B65G49/07 , B25J9/16 , G06F19/00
CPC classification number: H01L21/67766 , H01L21/67155 , H01L21/67178 , H01L21/67769 , H01L21/68707
Abstract: PURPOSE: A substrate processing system, a substrate processing method for the same and a computer storage medium thereof are provided to easily change a configuration by installing a transport block closely to a wafer transferring apparatus. CONSTITUTION: A process station(3) installs processing units in the upper and the lower direction. A cassette mounting table(12) loads a cassette for accommodating wafers. A wafer transfer device(21) is arranged between the process station and the cassette mounting table. A transport block(22) installs transfer units in multi-stages. The wafer transfer device includes a first transfer arm and a second transfer arm.
Abstract translation: 目的:提供一种基板处理系统及其基板处理方法及其计算机存储介质,以通过将传送块紧密地安装在晶片传送装置上来容易地改变构造。 规定:处理站(3)在上下方向安装处理单元。 盒式安装台(12)装载用于容纳晶片的盒。 晶片转移装置(21)设置在处理站和盒安装台之间。 运输箱(22)以多级安装运输单元。 晶片传送装置包括第一传送臂和第二传送臂。
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