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公开(公告)号：KR101927877B1
公开(公告)日：2019-03-12
申请号：KR1020120067411
申请日：2012-06-22
Applicant: 도쿄엘렉트론가부시키가이샤
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公开(公告)号：KR101843960B1
公开(公告)日：2018-03-30
申请号：KR1020110027811
申请日：2011-03-28
Applicant: 도쿄엘렉트론가부시키가이샤
IPC: H01L21/66 , H01L21/3065
CPC classification number: G01B9/02021 , G01B9/02019 , G01B9/02028 , G01B9/02071 , G01B9/0209 , G01B11/06 , G01B11/0675
Abstract: 원하는기회에소모부재의소모량을측정할수 있는소모량측정방법을제공한다. 플라즈마에노출되는상면(25a) 및서셉터(12)에대향하는하면(25b)을가지는포커스링(25)의소모량을측정할때, 서셉터(12)에대향하는하면(57b) 및포커스링(25)에대향하는상면(57a)을가지는기준편(57)을포커스링(25)과열적으로결합하고, 상면(25a) 및하면(25b)에대해수직으로포커스링(25)에저코히어런스광을조사하여포커스링(25) 내를두께방향으로왕복하는저코히어런스광의제 1 광로길이를계측하고, 상면(57a) 및하면(57b)에대해수직으로기준편(57)에저코히어런스광을조사하여기준편(57) 내를두께방향으로왕복하는저코히어런스광의제 2 광로길이를계측하고, 제 1 광로길이및 제 2 광로길이의비율에기초하여포커스링(25)의소모량을산출한다.
Abstract translation: 提供了一种消耗量测量方法，其能够在期望的机会中测量消耗部件的消耗量。 通过使用与基座12相对的表面57b来测量具有暴露于等离子体的上表面25a和面对剥离器12的下表面25b的聚焦环25的消耗量， 基准片57具有上表面部（57a）相反的25），聚焦环25，在垂直于耦合到过热聚焦环25，和上表面（25A）和下部（25b）的jeoko相干 基准片57在jeoko相干光与光照射垂直聚焦环25内第一测量的路径长度，和上表面部（57a）和下部（57B），以和从厚度方向jeoko相干 将光照射到所述基准片57的消耗，jeoko相干的基础上在聚焦环25的光测量的光路长度的第二比率，并且所述第一光路长度与第二光路长度和从在厚度方向上的内侧， 据计算。
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公开(公告)号：KR101744629B1
公开(公告)日：2017-06-08
申请号：KR1020110018891
申请日：2011-03-03
Applicant: 도쿄엘렉트론가부시키가이샤
Inventor： 마츠도타츠오
IPC: G01K11/12 , G01J5/02 , H01L21/324
CPC classification number: G01K11/00
Abstract: 광로길이를설정하기위한번잡한조작이불필요하고, 또한온도측정대상물의제약이적어적용범위가넓은온도측정용프로브를제공한다. 저간섭성광의간섭을이용한온도측정용프로브로서, 온도측정대상물의표면에접촉되어온도측정대상물과열적으로동화되는접촉부재(71)와, 접촉부재(71)에저 간섭성광으로이루어지는측정광(74)을조사하고, 접촉부재(71)의표면으로부터의반사광(75a) 및이면으로부터의반사광(75b)을각각수광하는콜리메이터(72)와, 접촉부재(71) 및콜리메이터(72)와의간격을소정의길이로규정하고또한, 측정광(74) 및반사광(75a, 75b)의광로를측정대상물이놓여진분위기로부터격리하는통 형상부재(73)를가지는온도측정용프로브를제공한다.
Abstract translation: 本发明提供一种温度测量探头，其不需要用于设定光程长度的复杂操作，并且温度测量对象的范围有限且应用范围广。 作为通过使用低干扰SK的干扰温度测量探针，并且与温度测量对象接触部件的表面相接触（71）的运动图像的温度测定的对象和所述热接触构件71，轧边机干扰SK构成的测量光（74 ）的研究，考虑到接触件71之间的距离，反射从所述表面（75A的光）和准直器72的每个光接收的反射光（75B）的后表面，和接触部件71和准直器（72） 以及用于将测量光74和反射光75a和75b的光路与测量对象放置在其中的环境隔离的管状构件73。
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公开(公告)号：KR1020120109672A
公开(公告)日：2012-10-08
申请号：KR1020120029288
申请日：2012-03-22
Applicant: 도쿄엘렉트론가부시키가이샤
CPC classification number: G01K11/12 , G01J5/0007 , G01J5/0044 , G01J5/0821 , G01J2005/583
Abstract: PURPOSE: A temperature measuring device and a temperature measuring method are provided to measure temperature of a temperature measuring object within a plurality of processing chambers at the same time. CONSTITUTION: A temperature measuring device comprises a light source, a first light separation member(120), a plurality of second light separation members(130), a third light separation member(140), a reference light reflecting member(150), an optical passage length converting member(160), a reference light transmitting member(170), measurement light transmitting members(180a,180b,180c,180d), and an optical detector(190). The first light separation member separates the lights from the light source into a plurality of lights for a measurement. The third light separation member separates measurement lights of the second light separation member into n numbers of measurement lights. The reference light reflecting member reflects the reference lights of the second light separation member. The optical passage length converting member varies the length of an optical passage of the reference lights reflected by the reference light reflecting member. The reference light transmitting member transmits the reference lights of the second light separation member to a position irradiating to the reference light reflecting member. The measurement light transmitting member transmits the measurement lights of the third light separation member to a predetermined position. The optical detector measures the interference of the reference lights reflected by the reference reflecting member and the measurement lights reflected by the temperature measuring object. [Reference numerals] (120) 1×N coupler; (130) 2×2 coupler; (140) 1×4 coupler; (150) Reference light transmitting member; (162) Servo motor; (163) Laser interferometer; (165) Motor controller; (166) Cotter driver; (180a~180d) 1st to 4th measurement light transmitting members; (190) Optical detector; (AA,BB,CC) Collimator
Abstract translation: 目的：提供一种温度测量装置和温度测量方法，以同时测量多个处理室内的温度测量对象的温度。 构成：温度测量装置包括光源，第一光分离部件（120），多个第二光分离部件（130），第三光分离部件（140），参考光反射部件（150）， 光路长度变换部件（160），基准光透射部件（170），测量光透射部件（180a，180b，180c，180d）和光检测器（190）。 第一分光构件将光从光源分离成多个用于测量的灯。 第三分光构件将第二分光构件的测量光分离成n个测量光。 参考光反射部件反射第二光分离部件的基准光。 光路长度变换部件使由基准光反射部件反射的基准光的光通路的长度变化。 参考光传输部件将第二光分离部件的基准光透射到照射到基准光反射部件的位置。 测量光透射构件将第三分光构件的测量光发送到预定位置。 光检测器测量由参考反射部件反射的参考光和由温度测量对象反射的测量光的干涉。 （附图标记）（120）1×N耦合器; （130）2×2耦合器; （140）1×4耦合器; （150）参考光传输部件; （162）伺服电机; （163）激光干涉仪; （165）电机控制器; （166）棉花司机; （180a〜180d）第1至第4测量光传输构件; （190）光检测器; （AA，BB，CC）准直器
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公开(公告)号：KR1020110107753A
公开(公告)日：2011-10-04
申请号：KR1020110025945
申请日：2011-03-23
Applicant: 도쿄엘렉트론가부시키가이샤
IPC: H01L21/66 , H01L21/67 , H01L21/683 , H01L21/687
CPC classification number: H01L21/67109 , H01L21/67248 , H01L21/6831 , H01L21/68742 , H01L22/12 , H01L21/02 , H01L21/0273 , H01L21/203 , H01L21/205 , H01L21/302 , H01L21/30621 , H01L21/3065 , H01L21/31116 , H01L21/324 , H01L21/76825 , H01L21/76826 , H01L22/30
Abstract: 챔버 내를 오염시키지 않고 또한 기판 재치대에 여분의 홀을 형성하지 않고 기판 재치대에서 지지하는 웨이퍼 온도를 정확하게 측정할 수 있는 기판 재치대를 제공한다. 웨이퍼(W)를 재치하는 재치면(90a)과, 웨이퍼(W)를 리프트 핀(84)에 의해 재치면(90a)으로부터 들어 올리는 기판 리프팅 유닛(80)과, 리프트 핀(84) 내부를 광로로 하여 저 간섭성 광으로 이루어지는 측정광(88)을 웨이퍼(W)에 조사하고, 웨이퍼(W)의 표면 및 이면으로부터의 반사광을 각각 수광하는 광 조사·수광 유닛(87)을 가지며, 광 조사·수광 유닛(87)은 기판 리프팅 유닛(80)의 베이스 플레이트(86)에 고정되어 있다.
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Patent Agency Ranking
公开(公告)号：KR101889726B1
公开(公告)日：2018-08-20
申请号：KR1020120031448
申请日：2012-03-28
Applicant: 도쿄엘렉트론가부시키가이샤
IPC: H01L21/3065 , H01L21/66
CPC classification number: G01K11/14 , G01K5/48 , H01L21/67248
Abstract: (과제) 마모등에의해표면과이면(裏面)의평행이무너지더라도, 저(低)코히어런스광의간섭을이용한온도측정장치를이용하여정확한온도측정을행할수 있는기판처리장치의처리실내 구성부재를제공한다. (해결수단) 진공분위기에서사용되고그리고온도가측정되는포커스링(25)이, 플라즈마에의한소모분위기에노출되는소모면(25a)과, 소모분위기에노출되지않는비(非)소모면(25b)과, 서로평행한상면(25Ta) 및하면(25Tb)을구비한박육부(薄肉部)(25T)와, 박육부(25T)의상면(25Ta)을피복하는피복부재(25d)를갖고, 박육부(25T)의상면(25Ta)과하면(25Tb)에는, 각각경면(鏡面) 가공이시행되어있다.
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公开(公告)号：KR101851954B1
公开(公告)日：2018-04-25
申请号：KR1020120029288
申请日：2012-03-22
Applicant: 도쿄엘렉트론가부시키가이샤
CPC classification number: G01K11/12 , G01J5/0007 , G01J5/0044 , G01J5/0821 , G01J2005/583
Abstract: (과제) 복수의처리챔버내의온도측정대상물의온도를동시에측정할수 있는온도측정장치및 온도측정방법을제공한다. (해결수단) 광원으로부터의광을복수의측정용의광으로나누기위한제1 광분리수단과, 복수의측정용의광을각각측정광과참조광으로나누기위한복수의제2 광분리수단과, 측정광을 n개의제1∼제n 측정광으로나누기위한제3 광분리수단과, 복수의참조광을각각반사하기위한참조광반사수단과, 참조광반사수단으로부터반사하는참조광의광로길이를변화시키기위한 1개의광로길이변화수단과, 온도측정대상물로부터반사하는제1∼제n 측정광과, 참조광반사수단으로부터반사하는복수의참조광과의간섭을측정하기위한복수의광검출기를구비한온도측정장치.
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公开(公告)号：KR101798607B1
公开(公告)日：2017-11-16
申请号：KR1020110025945
申请日：2011-03-23
Applicant: 도쿄엘렉트론가부시키가이샤
IPC: H01L21/66 , H01L21/67 , H01L21/683 , H01L21/687
CPC classification number: H01L21/67109 , H01L21/67248 , H01L21/6831 , H01L21/68742
Abstract: 챔버내를오염시키지않고또한기판재치대에여분의홀을형성하지않고기판재치대에서지지하는웨이퍼온도를정확하게측정할수 있는기판재치대를제공한다. 웨이퍼(W)를재치하는재치면(90a)과, 웨이퍼(W)를리프트핀(84)에의해재치면(90a)으로부터들어올리는기판리프팅유닛(80)과, 리프트핀(84) 내부를광로로하여저 간섭성광으로이루어지는측정광(88)을웨이퍼(W)에조사하고, 웨이퍼(W)의표면및 이면으로부터의반사광을각각수광하는광 조사·수광유닛(87)을가지며, 광조사·수광유닛(87)은기판리프팅유닛(80)의베이스플레이트(86)에고정되어있다.
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公开(公告)号：KR1020130007451A
公开(公告)日：2013-01-18
申请号：KR1020120067411
申请日：2012-06-22
Applicant: 도쿄엘렉트론가부시키가이샤
Abstract: PURPOSE: A temperature measuring system, a substrate processing device, and a temperature measuring method are provided to properly measure temperature by using optical interference. CONSTITUTION: A temperature measuring system(1) comprises a light source(10), a spectroscope(14), light transmitting tools(11,12), an optical path length calculating unit, and a temperature calculating unit. The light source has frequencies penetrating a measurement object. The spectroscope measures intensity dispersion caused by the frequencies and wavelengths. The light transmitting tools are connected to the light source and spectroscope, projects measurement lights to a first major surface of the measurement object, and simultaneously projects reflected lights from the first major surface and a second major surface to the spectroscope. The optical path length calculating unit performs a Fourier-transform interference intensity dispersion, which is the intensity dispersion of the reflected lights from the first and second major surfaces, thereby calculating the length of the optical path. The temperature calculating unit calculates the temperature of the measurement object on a basis of a relation of the length of the optical path calculated by the optical path length calculating unit, the length of the optical path and the temperature of the measurement object. [Reference numerals] (10) Light source; (14) Spectroscope
Abstract translation: 目的：提供温度测量系统，基板处理装置和温度测量方法，以通过使用光学干涉来适当地测量温度。 构成：温度测量系统（1）包括光源（10），分光镜（14），光传输工具（11,12），光路长度计算单元和温度计算单元。 光源具有穿透测量对象的频率。 分光仪测量由频率和波长引起的强度色散。 光传输工具连接到光源和分光镜，将测量光投射到测量对象的第一主表面，同时将来自第一主表面的反射光和第二主表面投影到分光镜。 光路长度计算单元执行作为来自第一和第二主表面的反射光的强度色散的傅里叶变换干涉强度色散，由此计算光路的长度。 温度计算单元基于由光程长度计算单元计算的光路的长度，光路的长度和测量对象的温度之间的关系来计算测量对象的温度。 （附图标记）（10）光源; （14）分光镜
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公开(公告)号：KR1020120112203A
公开(公告)日：2012-10-11
申请号：KR1020120032829
申请日：2012-03-30
Applicant: 도쿄엘렉트론가부시키가이샤
Inventor： 마츠도타츠오
IPC: H01L21/3065 , H01L21/205
CPC classification number: H01J37/32899 , G05D23/192 , H01J37/32422 , H01J37/32706 , H01J37/32724 , H01J37/3299
Abstract: PURPOSE: A temperature controlling method and a plasma processing system are provided to efficiently control a cooling device and a heating device based on the temperature of a selected processed object. CONSTITUTION: A measurement result of a back side film of a processed object is obtained in an acquiring step. The temperature and a kind of the back side film of the processed object are selected in a selection step. The temperature of the processed object responds to power which is inputted to process the processed object. The temperature of the processed object is controlled based on the temperature of the selected processed object in a control step. A cooling device and a heating device are controlled based on the temperature of the selected processed object in the control step. [Reference numerals] (AA) Temperature (°C); (BB) Time(min/sec)
Abstract translation: 目的：提供温度控制方法和等离子体处理系统，以根据所选择的加工对象的温度有效地控制冷却装置和加热装置。 构成：在获取步骤中获得处理对象的背面胶片的测量结果。 在选择步骤中选择处理对象的背面胶片的温度和种类。 处理对象的温度响应被输入以处理被处理对象的功率。 在控制步骤中，基于所选择的处理对象的温度来控制处理对象的温度。 在控制步骤中，基于所选择的加工对象的温度来控制冷却装置和加热装置。 （标号）（AA）温度（℃）; （BB）时间（分钟/秒）
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