Abstract:
PURPOSE: A liquid processing device and method are provided to uniformly discharge processing liquid to the bottom of a substrate by installing a plurality of first discharge ports from the location corresponding to a center portion of the substrate to the location corresponding to a peripheral portion of the substrate. CONSTITUTION: A substrate holding unit(30) maintains a substrate(W) with a horizontal state. A rotation driving unit(39) rotates the substrate holding unit. A first nozzle(60) is located at the lower side of the substrate maintained by the substrate holding unit. The first nozzle comprises a plurality of first liquid discharge paths and a plurality of first gas discharge paths. A liquid feed tool(70) supplies liquid to the plurality of first liquid discharge paths. A gas feed tool(80) supplies gas to the plurality of first gas discharge paths.
Abstract:
PURPOSE: A liquid processing device and method are provide to effectively wash the bottom of a wafer by crashing fluid spray to the bottom of the wafer without the degradation of energy of the fluid spray. CONSTITUTION: A substrate holding unit(30) maintains a substrate(W) with a horizontal state. A rotation driving unit(39) rotates the substrate holding unit. A first nozzle(60) is located at the lower side of the substrate maintained by the substrate holding unit. The first nozzle comprises a plurality of first liquid discharge paths and a plurality of first gas discharge paths. A liquid feed tool(70) supplies liquid to the plurality of first liquid discharge paths. A gas feed tool(80) supplies gas to the plurality of first gas discharge paths.
Abstract:
PURPOSE: A flow passage switching apparatus, a processing apparatus, a flow passage switching method, processing method and a storage medium are provided to reduce the number of a driving apparatus for changing a flow route by changing the flow route in only a rotary driving unit. CONSTITUTION: In a flow passage switching apparatus, a processing apparatus, a flow passage switching method, processing method and a storage medium, connection ports(51a~51c) are opened along the longitudinal direction of an outer tube(51). The connection ports are connected to the connection flow rate respectively. A rotary container(53) is inserted into the outer tube to be rotatable. A plurality of opening parts(53a~53c) are installed in the plural connection ports of the outer tube respectively. A rotary driving unit rotates the rotary container.
Abstract:
PURPOSE: A liquid treating apparatus and a liquid treating method thereof are provided to prevent the treating liquid from sticking to the other side of the substrate after liquid treatment by preventing the treating liquid from remaining on the lift pin. CONSTITUTION: A retaining plate(30) keeps a substrate(W). A lift pin plate(20) includes a lift pin(22) supporting a substrate from underneath. A rotation driving(39) rotates the retaining plate. The treatment liquid supplying unit supplies the treatment liquid to the other side of the substrate maintained by the supporting plate.
Abstract:
본 발명에 따른 기판 액처리 장치는, 기판 유지대에 유지되어 회전하는 기판으로부터 비산된 처리액을 안내하는 안내 회전컵과, 안내 회전컵에 의해 안내된 처리액을 하방으로 안내하는 안내컵을 포함하고 있다. 안내컵은, 안내컵 본체의 내주단부로부터 하방으로 연장되는 하방 연장부와, 이 내주단부로부터 하방 연장부보다 내주측으로 연장되고, 안내 회전컵 및 하방 연장부와 함께 안내 회전컵이 회전함으로써 선회하는 기체를 하방으로 안내하는 기체 안내 공간을 형성하는 내주측 연장부를 갖고 있다.
Abstract:
도포액을 스핀코팅법에 의해서 기판에 도포하는데 있어서, 기판 이면측으로의 파티클의 부착을 줄여, 이 파티클을 세정하기 위한 용제의 사용량을 억제하는 것이다. 컵(10)내의 스핀척(11)에 유지된 웨이퍼(W)의 둘레가장자리부 이면과 대향하도록, 종단면이 산모양인 도포액의 튀어서 되돌아옴 방지용의 가이드부(2)를 설치하고, 이 가이드부(2)의 안쪽에 연속하여 컵(10)의 아래쪽 외부공간과 구획하는 수평면(22)을 형성하는 이 수평면(22)과 웨이퍼(W)와의 사이의 뒤쪽공간(23)은 웨이퍼(W)의 회전에 의해 분위기가 부압이 되는 공간이며, 상기 수평면(22)에 개구부 (25)를 형성한다. 그리고, 웨이퍼(W)의 회전수에 기초하여 셔터(6)에 의해 개구부 (25)의 개구량을 조정하고, 또한 컵(10)의 바닥부에 접속된 배기로중의 댐퍼의 개도를 제어한다. 기판, 도포, 스핀코팅
Abstract:
PURPOSE: A substrate liquid processing apparatus and a substrate liquid processing method are provided to reduce the size of the substrate liquid processing apparatus by separating processing solutions from the atmosphere in a collecting cup to omit a gas-liquid separating device. CONSTITUTION: A substrate rotating device(23) rotates a griped substrate(2). A processing solution supply device(24) selectively supplies various kinds of processing solutions to the substrate. A collecting cup(56) collects the processing solutions supplied to the substrate. Liquid collecting units(61,62,63) are formed in the collecting cup to collect the processing solutions. Discharge parts(64,65,66) discharge the processing solutions collected from a solution collecting unit. Exhaust parts(70,71) are formed on the upper side of the discharge part.