公开(公告)号：KR1020100036974A

公开(公告)日：2010-04-08

申请号：KR1020090092088

申请日：2009-09-29

Applicant: 도쿄엘렉트론가부시키가이샤

Inventor： 오오따요시하루 ,  가지와라히로노부 ,  다나까시노부

IPC: G03F7/26

CPC classification number: G03F7/16 ,  G03F7/26 ,  G03F7/3057 ,  G03F7/7075 ,  H01L21/6715

Abstract: PURPOSE: A resist coating and developing processing system is provided to efficiently realize the shortening of tact time or total length size by arranging a plurality of treatment units in an order of a process flow. CONSTITUTION: An inline type resist coating and developing processing system(10) for performing a series of processing including resist coating and developing processes on an untreated substrate by connecting a plurality of processing units as a process flow, comprises a proceeding process line and a returning process line. The proceeding process line arranges at least a cleaning part(26), a resist coating part(28), and a first drying/heat treatment part(30) in a longitudinal direction of a system in a process order. The returning process line arranges at least a developing part(92) and a second drying/heat treatment part in a second direction opposite to the first direction.

Abstract translation: 目的：提供一种抗蚀剂涂层和显影处理系统，通过以处理流程的顺序布置多个处理单元，有效地实现了节拍时间或总长度尺寸的缩短。 构成：用于通过连接作为处理流程的多个处理单元在未处理的基板上进行包括抗蚀剂涂覆和显影处理的一系列处理的在线型抗蚀剂涂覆和显影处理系统（10）包括进行的处理线和返回的 生产线。 前进处理线按照处理顺序在系统的纵向方向至少布置清洁部件（26），抗蚀剂涂覆部分（28）和第一干燥/热处理部分（30）。 返回处理线在与第一方向相反的第二方向上至少布置显影部（92）和第二干燥/热处理部。

公开(公告)号：KR1020070065807A

公开(公告)日：2007-06-25

申请号：KR1020060129721

申请日：2006-12-19

Applicant: 도쿄엘렉트론가부시키가이샤

Inventor： 오오따요시하루

IPC: H01L21/027

CPC classification number: G03F7/16 ,  B05B1/005 ,  B05C11/10 ,  H01L21/6715 ,  H01L21/677

Abstract: A coating processing apparatus and a method are provided to let an applying position of each glass substrate equal on a transfer line by harmonizing discharging positions of a first nozzle and a second nozzle. A substrate is transferred along a substrate transfer path. Nozzles(80,81) are installed on the substrate transfer path, and discharge a coating solution onto the substrate transferring on the substrate transfer path. Rotary rolls(100,120) are installed on the substrate transfer path, and perform test discharge of the coating solution of the nozzle. The nozzles are installed on front and rear sides of the substrate transfer path. The rotary rolls are installed on each nozzle.

Abstract translation: 提供一种涂布处理装置和方法，通过协调第一喷嘴和第二喷嘴的排出位置，使每个玻璃基板的施加位置等于传送线。 衬底沿衬底传送路径传送。 喷嘴（80,81）安装在基板传送路径上，并将涂布液排放到在基板传送路径上传送的基板上。 旋转辊（100,120）安装在基板传送路径上，并进行喷嘴的涂布液的测试排出。 喷嘴安装在基板传送路径的前侧和后侧。 旋转辊安装在每个喷嘴上。

公开(公告)号：KR1020120002428A

公开(公告)日：2012-01-05

申请号：KR1020110052622

申请日：2011-06-01

Applicant: 도쿄엘렉트론가부시키가이샤

Inventor： 오오따요시하루 ,  모리야마시게루 ,  마쯔무라유우끼 ,  다나까시게끼

IPC: H01L21/027 ,  G03F7/20

CPC classification number: G03F7/70791 ,  G03F7/70291 ,  H01L27/1288 ,  H01L21/0275 ,  G03F7/70466

Abstract: PURPOSE: A local site exposure apparatus and a local site exposure method and a storage medium are provided to suppress the line width of a wire pattern and the deviation of a pitch by improving the uniformity of a resist remaining film. CONSTITUTION: A transfer roller(20) horizontally sends back a substrate according to a substrate carrier way. A chamber(8) forms an exposure treatment space to a substrate while covering the certain section of a substrate carrier way. A light source(4) is comprised of a plurality of light emitting devices in a line type in a cross direction of the transferring the substrate. A substrate detection sensor(30) detects the substrate which is returned with the transfer roller. A controller(40) controls the drive of the light emitting device by an LED driving unit(9).

Abstract translation: 目的：提供局部曝光装置和局部曝光方法以及存储介质，通过提高抗蚀剂残留膜的均匀性来抑制线图案的线宽和间距的偏差。 构成：转印辊（20）根据衬底载体的方式水平地回送衬底。 腔室（8）在覆盖衬底载体方式的某一部分的同时在衬底上形成曝光处理空间。 光源（4）由转移衬底的交叉方向的线型的多个发光器件构成。 基板检测传感器（30）检测由转印辊返回的基板。 控制器（40）通过LED驱动单元（9）控制发光器件的驱动。

公开(公告)号：KR1020110095134A

公开(公告)日：2011-08-24

申请号：KR1020110003752

申请日：2011-01-14

Applicant: 도쿄엘렉트론가부시키가이샤

Inventor： 모또다기미오 ,  미야자끼후미히로 ,  오오따요시하루 ,  가와우찌다꾸오

IPC: B05C11/10 ,  B05C21/00 ,  B05B1/04 ,  B05B15/02

CPC classification number: B05C11/10 ,  B05B1/044 ,  B05B15/52 ,  B05C21/00

Abstract: PURPOSE: A slit nozzle cleaning apparatus and a coating device including thereof are provided to automatically and effectively clean a slit nozzle, and to improve the quality of a coated layer. CONSTITUTION: A slit nozzle cleaning apparatus comprises the following: a scraping member(74) capable of being inserted and discharged from a slit(32a) of a slit nozzle(32); and a cleaning device supporting the scraping member for inserting the scraping member into the slit for scarping aged and hardened materials. The cleaning device also discharges the scraping member from the slit by moving the scraping member to the predetermined direction.

Abstract translation: 目的：提供一种狭缝喷嘴清洁装置及其包括装置，以自动且有效地清洁狭缝喷嘴，并提高涂层的质量。 构成：狭缝喷嘴清洁装置包括：能够从狭缝喷嘴（32）的狭缝（32a）插入和排出的刮擦构件（74）; 以及支撑刮削构件的清洁装置，用于将刮削构件插入狭缝中，用于刮除老化和硬化材料。 清洁装置还通过将刮削构件移动到预定方向从切口排出刮擦构件。

公开(公告)号：KR1020110068842A

公开(公告)日：2011-06-22

申请号：KR1020100118573

申请日：2010-11-26

Applicant: 도쿄엘렉트론가부시키가이샤

Inventor： 오오따요시하루

IPC: H01L21/677 ,  H01L21/027

CPC classification number: H01L21/67721 ,  G03F1/60 ,  G03F7/70716 ,  G03F7/70975 ,  H01L21/0274

Abstract: PURPOSE: A substrate processing device, substrate processing method, and recording medium storing a program for executing the substrate processing method are provided to uniformly support the entire substrate. CONSTITUTION: A loading stage(150) includes a stage surface installed in a carrying path(34). The loading stage loads a processed substrate on the stage surface. A first rotator can rotate along with an axis expanded from the lower part of the stage surface to the carrying path. A second rotator(170) can rotate along with an axis independently from the first rotator.

Abstract translation: 目的：提供基板处理装置，基板处理方法和存储用于执行基板处理方法的程序的记录介质，以均匀地支撑整个基板。 构成：装载台（150）包括安装在承载路径（34）中的台面。 加载阶段在台面上加载经处理的基板。 第一旋转体可以与从舞台表面的下部扩展到运送路径的轴一起旋转。 第二旋转器（170）可以与独立于第一旋转器的轴一起旋转。

公开(公告)号：KR1020100036975A

公开(公告)日：2010-04-08

申请号：KR1020090092089

申请日：2009-09-29

Applicant: 도쿄엘렉트론가부시키가이샤

Inventor： 오오따요시하루

IPC: H01L21/677

CPC classification number: H01L21/67173 ,  H01L21/67706 ,  H01L21/67715 ,  H01L21/67736

Abstract: PURPOSE: A process system is provided to reduce the length of each process unit and conveyor unit by reducing the distance of a substrate from a previous substrate on a flat conveyor path. CONSTITUTION: A flat transfer path(24) conveys a substrate to be processed based on a process flow. A plurality of parallel process units(48) is arranged under the flat conveyor path. A plurality of partition conveyors are arranged between the end part of the flat transfer path and the entrance of the parallel process units. A moving part for the partition conveyor separately moves the plurality of partition conveyors.

Abstract translation: 目的：提供一种加工系统，通过减少基材与平坦输送机路径上的先前基材的距离来减少每个加工单元和输送机单元的长度。 构成：平面传送路径（24）基于工艺流程传送待处理的衬底。 多个平行处理单元（48）布置在平坦输送路径的下方。 在平坦传送路径的端部和平行处理单元的入口之间布置有多个分隔输送器。 用于隔板传送器的移动部分分开地移动多个隔板输送机。

公开(公告)号：KR1020100027039A

公开(公告)日：2010-03-10

申请号：KR1020090080143

申请日：2009-08-28

Applicant: 도쿄엘렉트론가부시키가이샤

Inventor： 오오따요시하루

IPC: H01L21/00 ,  H01L21/027

CPC classification number: G03F7/168 ,  G03F7/70733 ,  G03F7/70791 ,  G03F7/70841 ,  H01L21/67098 ,  H01L21/67703

Abstract: PURPOSE: A processing system is provided to reduce the whole length of system by arranging a plurality of process units on a round-transferring type process line based on the order of process flow. CONSTITUTION: A forward transferring process line(A) transfers a substrate(G) to a first direction. A backward transferring process line(B) transfers the substrate to a second direction. The second direction is opposed to the first direction. A middle process line(C) is installed a hollow space(15) between the forward transferring process line and the backward transferring process line. The middle process line includes an elevation type transfer unit.

Abstract translation: 目的：提供一种处理系统，以便根据工艺流程的顺序，在圆形转印式工艺生产线上布置多个工艺装置，以减少系统的整个长度。 构成：正向传送工艺线（A）将衬底（G）传送到第一方向。 反向转印处理线（B）将基板转印到第二方向。 第二个方向与第一个方向相反。 中间处理线（C）在正向传送处理线和反向传送处理线之间安装有中空空间（15）。 中间处理线包括高度型传送单元。