Abstract:
A shower head comprises a top plate (10) having a gas port (12), a face plate (20), a first baffle plate (30), a second baffle plate (40) and a gap controller. A shower head for supplying a reactant gas to a process region within a reaction chamber during manufacture of a semiconductor device, comprises: (i) a top plate having a gas port for introducing the reactant gas supplied from an outside source to the reaction chamber; (ii) a face plate disposed opposite the process region, and having through holes; (iii) a first baffle plate having through holes, and disposed between the top plate and the face plate so that it is capable of moving up or down, and has a top surface that defines a first gap (70) for forming a first lateral flow passage of the reactant gas; (iv) a second baffle plate having through holes, and disposed between the first baffle and the face plate so that it is capable of moving up or down, and has a top surface that defines a second gap for forming a second lateral flow passage of the reactant gas between the first and second baffle plates; and (v) a gap controller for determining a width of the first gap and a width of the second gap.
Abstract:
PURPOSE: A method for forming a self-alignment contact hole of a semiconductor device is provided to prevent a bit line from being contacted with conductive material by conserving the original thickness of a nitride silicon layer. CONSTITUTION: After sequentially forming a conductive layer and the first isolating layer made of a nitride silicon layer on a semiconductor substrate(30), a photoresist layer pattern is formed on the resultant structure. An isolating layer pattern(40) is formed by etching the first isolating layer using the photoresist pattern as a mask. At this time, the conductive layer is partially etched at the range of 40-60%. After removing the photoresist layer pattern, a conductive layer pattern made of a titanium nitride layer pattern(42) and a tungsten layer pattern(44), is formed by etching the conductive layer using the isolating layer pattern(40) as a mask. At this time, the original thickness of the isolating layer pattern(40) is conserved because of the pre-etching of the conductive layer. After an insulating spacer(46) is formed at both sidewalls of the isolating and conductive layer pattern, the second isolating layer(48) is formed on the entire surface of the resultant structure. A self-alignment contact hole(50) is formed in the resultant structure for exposing the isolating layer pattern(40).
Abstract:
3차원반도체기억소자및 그제조방법을제공한다. 이소자에따르면, 기판의웰 영역내에공통소오스영역이배치될수 있으며, 공통소오스영역상에적층된게이트패턴들을포함하는적층-구조체가배치될수 있다. 수직형활성패턴들이적층-구조체를관통할수 있다. 수직형활성패턴은그 아래의기판내에형성된리세스영역으로인하여공통소오스영역을관통하는전기적통로(electrical path)를경유하여웰 영역과연결될수 있다.
Abstract:
A non-volatile memory device is provided to minimize a distance between a first covalence cell gate electrode and a ground selection gate electrode and a distance between a second covalence cell gate electrode and a string selection gate electrode, operation failure of the first and second covalence cell gate electrodes, and to improve integration degree of a semiconductor device. A non-volatile memory device includes cell gate electrodes(104), a ground selection gate electrode(108), a string selection gate electrode, and a well region(102). The cell gate electrodes are disposed on a semiconductor substrate parallel with each other at a first interval. The ground selection gate electrode is spaced a first interval apart from a first covalence cell gate electrode among the cell gate electrodes. The string selection gate electrode is spaced a first interval apart from a second covalence cell gate electrode among the cell gate electrodes. The well region is formed on a substrate under the cell gate electrodes, the ground selection gate electrode, and the string selection gate electrode and a substrate between the respectively gate electrodes in which the same impurities are continuously doped.
Abstract:
PURPOSE: A structure of a vertical transistor and a method for forming the same are provided to control the channel length without relying upon a photolithography. CONSTITUTION: A first cylindrical semiconductor pillar(101a) is formed on a semiconductor substrate. A second cylindrical semiconductor pillar(101p) placed in the center of the first semiconductor pillar has higher height and less diameter than the first semiconductor pillar. A gate dielectric(103) is formed on the top of the first semiconductor pillar and around the second semiconductor pillar. A cylindrical gate electrode(105) having the same diameter as the first semiconductor pillar is formed on the top of the first semiconductor pillar and around the second semiconductor pillar. A first cylindrical dielectric film(109) having the same diameter as the gate electrode is formed on the top of the gate electrode and around of the second semiconductor pillar. A silicon oxide film(111) surrounds the first semiconductor pillar, the gate electrode and the first dielectric film.
Abstract:
PURPOSE: A metal oxide semiconductor transistor having three-dimensional channels and a fabricating method thereof are provided to prevent reduction of a contact area between source and drain regions by forming a trench within a semiconductor substrate. CONSTITUTION: An active region is projected from a predetermined region of a semiconductor substrate. An isolation layer(21A) is used for surrounding the active region and has a surface lower than an upper surface of the active region. At least one center trench is used for defining a plurality of channel regions recessed from a center part of the active region and a source/drain region for connecting both ends of the channel regions to each other. A gate electrode(25A) is used for covering sidewalls and upper surfaces of the channel regions across upper parts of the channel regions.
Abstract:
PURPOSE: A shower head of a wafer processing apparatus having an interval control device is provided to control the amount of reaction gas by installing the interval control device between two baffle plates. CONSTITUTION: A top plate(10) has a gas inflow hole(12) for transferring a reaction gas into a process chamber. A face plate(20) faces a process region of the process chamber. A plurality of through-holes are formed in the face plate(20). The first baffle plate(30) and the second baffle plate(40) are installed between the top plate(10) and the face plate(20). An interval control device is formed on an upper face of the first baffle plate(30). The interval control device is formed with the first spacer ring(92). An interval control device including the second spacer ring(94) is formed between the first and the second baffle plate(30,40). The positions of the first and the second baffle plate(30,40) are determined by controlling thickness of the first and the second ring(92,94). A guide baffle plate(50) is installed on the first baffle plate(30).
Abstract:
3차원반도체기억소자및 그제조방법을제공한다. 이소자에따르면, 기판의웰 영역내에공통소오스영역이배치될수 있으며, 공통소오스영역상에적층된게이트패턴들을포함하는적층-구조체가배치될수 있다. 수직형활성패턴들이적층-구조체를관통할수 있다. 수직형활성패턴은그 아래의기판내에형성된리세스영역으로인하여공통소오스영역을관통하는전기적통로(electrical path)를경유하여웰 영역과연결될수 있다.
Abstract:
3차원반도체기억소자및 그제조방법을제공한다. 이소자에따르면, 기판의웰 영역내에공통소오스영역이배치될수 있으며, 공통소오스영역상에적층된게이트패턴들을포함하는적층-구조체가배치될수 있다. 수직형활성패턴들이적층-구조체를관통할수 있다. 수직형활성패턴은그 아래의기판내에형성된리세스영역으로인하여공통소오스영역을관통하는전기적통로(electrical path)를경유하여웰 영역과연결될수 있다.
Abstract:
반도체 패키지는 반도체 칩, 지지기판 및 몰딩 부재를 포함한다. 반도체 칩은 반도체 기판 및 반도체 기판 상에 제1 방향으로 배열된 복수의 셀 트랜지스터들을 포함한다. 지지기판은 상면에 반도체 칩을 고정하며, 온도가 상승함에 따라 휘어져 제1 방향으로 반도체 칩에 인장 응력을 가한다. 제1 방향과 동일한 방향을 따라 지지기판은 상방으로 휘어지거나, 제1 방향과 수직한 제2 방향을 따라 지지기판은 하방으로 휘어질 수 있다. 몰딩 부재는 반도체 칩 및 지지기판을 감싼다.