公开(公告)号：KR101726910B1

公开(公告)日：2017-04-13

申请号：KR1020130135072

申请日：2013-11-07

Applicant: 제일모직주식회사

Inventor： 김혜진 ,  김미선 ,  백택진 ,  송규석 ,  송인재 ,  이진아

IPC: C09J7/00 ,  H01L51/52

CPC classification number: C09J7/10 ,  C09J2203/326 ,  H01L51/524

Abstract: 본발명은유기발광소자충진용접착필름, 상기유기발광소자충진용접착필름의상부에형성된상부이형필름, 및상기유기발광소자충진용접착필름의하부에형성된하부이형필름을포함하고, 상기유기발광소자충진용접착필름과상기상부이형필름은각각하나이상의모서리에곡면이형성된유기발광소자충진용접착시트및 이의제조방법에관한것이다.

Abstract translation: 本发明包括在所述有机发光装置填充的粘合剂膜的底部形成的下剥离膜，该有机光的剥离膜的上方的发光器件，和有机发光形成在填充的粘合剂膜的上部部分，用于有机发光器件填充的粘合剂膜 用于元件填充的粘合膜和上离型膜均具有在其一个或多个边缘处形成的弯曲表面及其制造方法。

公开(公告)号：KR1020150025991A

公开(公告)日：2015-03-11

申请号：KR1020130104242

申请日：2013-08-30

Applicant: 제일모직주식회사

Inventor： 이준우 ,  김혜진 ,  양승용 ,  최재원 ,  김성민 ,  김진만

IPC: C09J7/00 ,  C09J163/00 ,  H01L21/02

CPC classification number: C09J7/00 ,  C09J9/00 ,  C09J163/00 ,  C09J2203/326 ,  H01L21/02

Abstract: The purpose of the present invention is to provide an adhesive composition for a semiconductor and an adhesive film, which can achieve attach void free or cure void free and can inhibit expansion and generation of void according to control of hardening speed. The present invention relates to an adhesive film for a semiconductor comprising an adhesive layer, which includes: a binder resin; a polyfunctional first epoxy resin; a monofunctional second epoxy resin; a hardener; and a hardening accelerator, and to a semiconductor device connected by the film.

Abstract translation: 本发明的目的是提供一种用于半导体和粘合剂膜的粘合剂组合物，其可以实现无空隙或固化无空隙，并且可以根据硬化速度的控制来抑制空隙的膨胀和产生。 本发明涉及一种包含粘合剂层的半导体粘合膜，其包括：粘合剂树脂; 多官能第一环氧树脂; 单官能第二环氧树脂; 硬化剂 和硬化促进剂，以及通过该膜连接的半导体器件。

公开(公告)号：KR1020130073190A

公开(公告)日：2013-07-03

申请号：KR1020110140904

申请日：2011-12-23

Applicant: 제일모직주식회사

Inventor： 송규석 ,  김지호 ,  최재원 ,  김진만 ,  김혜진

IPC: H01L21/48 ,  H01L21/301

CPC classification number: H01L21/6836 ,  C08K3/08 ,  C08K3/22 ,  C09J7/20 ,  C09J2203/326 ,  C09J2205/102 ,  H01L24/27 ,  H01L24/29 ,  H01L24/32 ,  H01L24/83 ,  H01L2224/27436 ,  H01L2224/2929 ,  H01L2224/29339 ,  H01L2224/29344 ,  H01L2224/29347 ,  H01L2224/29355 ,  H01L2224/29386 ,  H01L2224/32225 ,  H01L2224/83191

Abstract: PURPOSE: A dicing die-bonding film and a semiconductor device are provided to improve pick-up process, by suppressing twisting phenomenon of a wafer in the process. CONSTITUTION: A bonding layer is stacked on an adhesive layer. The adhesive layer contains filler of a heavy part. The heavy part is constituted with solid content 100 of the adhesive layer. The filler is constituted with 0.1 to 10. The filler includes silica phosphorus.

Abstract translation: 目的：通过抑制该工艺中晶片的扭转现象，提供切割芯片接合膜和半导体器件以改善拾取过程。 构成：粘合层层叠在粘合剂层上。 粘合剂层含有重部分的填料。 重部分由粘合剂层的固体成分100构成。 填料由0.1至10构成。填料包括二氧化硅磷。

公开(公告)号：KR1020130068889A

公开(公告)日：2013-06-26

申请号：KR1020110136327

申请日：2011-12-16

Applicant: 제일모직주식회사

Inventor： 김혜진 ,  최재원 ,  김지호 ,  김진만 ,  송규석

IPC: H01L21/48

CPC classification number: C09J163/00 ,  C08G59/504 ,  C08G59/56 ,  C08G59/621 ,  H01L24/29 ,  H01L24/32 ,  H01L24/50 ,  H01L2224/2929 ,  H01L2224/29291 ,  H01L2224/29339 ,  H01L2224/29344 ,  H01L2224/29347 ,  H01L2224/29355 ,  H01L2224/29386 ,  H01L2224/2939 ,  H01L2224/29391 ,  H01L2224/29393 ,  H01L2224/32225 ,  H01L2224/83101 ,  H01L2924/12043 ,  H01L2924/181 ,  H01L2924/00

Abstract: PURPOSE: An adhesive film for semiconductors is provided to improve void properties and reliability properties by using an amine hardener and a phenol hardener together with an appropriate proportion. CONSTITUTION: An adhesive film for semiconductors is attached to a chip mounting surface of a wiring substrate. The adhesive film for semiconductors contains an amine hardener and a phenol hardener. A semiconductor chip is mounted on the adhesive film for semiconductors. The ratio(b/a) of a storage modulus(b) in 170°C after 80% hardening and a storage modulus(a) in 40°C before hardening the adhesive film for semiconductors is 1.5 to 3.0. The amine hardener is diamino diphenyl sulfone.

Abstract translation: 目的：提供用于半导体的粘合膜，以通过使用胺固化剂和酚固化剂以适当的比例来改善空隙性能和可靠性。 构成：将半导体用粘接膜贴合在布线基板的芯片安装面上。 半导体用粘合膜含有胺硬化剂和酚类固化剂。 半导体芯片安装在半导体用粘合膜上。 80％硬化后的170℃下的储能模量（b）的比率（b / a）和半导体用粘合膜硬化前的40℃下的储能模量（a）的比率为1.5〜3.0。 胺固化剂是二氨基二苯砜。

公开(公告)号：KR1020120068695A

公开(公告)日：2012-06-27

申请号：KR1020110120484

申请日：2011-11-17

Applicant: 제일모직주식회사

Inventor： 편아람 ,  어동선 ,  송기태 ,  김인환 ,  김혜진

IPC: C09J133/04 ,  C09J163/00 ,  C09J11/06 ,  H01L21/58

CPC classification number: H01L24/29 ,  C08L63/00 ,  C09J133/066 ,  C09J133/18 ,  H01L24/13 ,  H01L24/16 ,  H01L24/32 ,  H01L24/81 ,  H01L24/83 ,  H01L24/92 ,  H01L25/0657 ,  H01L25/50 ,  H01L2224/13111 ,  H01L2224/13147 ,  H01L2224/16146 ,  H01L2224/29101 ,  H01L2224/2919 ,  H01L2224/2929 ,  H01L2224/293 ,  H01L2224/29386 ,  H01L2224/32145 ,  H01L2224/73104 ,  H01L2224/81011 ,  H01L2224/81191 ,  H01L2224/81193 ,  H01L2224/81203 ,  H01L2224/81447 ,  H01L2224/8181 ,  H01L2224/81815 ,  H01L2224/83191 ,  H01L2224/83203 ,  H01L2224/8385 ,  H01L2224/9211 ,  H01L2225/06513 ,  H01L2225/06541 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01012 ,  H01L2924/0102 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01079 ,  H01L2924/01327 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/00014 ,  H01L2224/81 ,  H01L2224/83 ,  H01L2924/00

Abstract: PURPOSE: An adhesive composition for semiconductor is provided to satisfy electric connection reliability between bump chips, to conduct flux process removing an oxide layer of a Cu bump and a solder by adhesive layer between bump chips, and to sufficiently connect a bump and a solder at chip bonding due to heating and compression. CONSTITUTION: An adhesive composition comprises an acryl-based polymer resin, epoxy-based resin, and imidazole compound. The imidazole compound has melting point of 200-270 °C. The composition has melting viscosity of 2 ×10^4 - 15 ×10^4 poise at 150 °C. The equivalent of the epoxy-based resin is about 200-250 g/eq, and the melting viscosity at 150 °C is about 0.01-0.2 Pa·s. the adhesion of the composition is about 15 - 30 kgf/25mm^2. The acrylic polymer resin contains an epoxy group, and the glass transition temperature is about (-30) - 80°C.

Abstract translation: 目的：提供一种用于半导体的粘合剂组合物，以满足凸块之间的电连接可靠性，通过在凸块之间的粘合剂层去除Cu凸块的氧化物层和焊料的通量处理，并充分地连接凸块和焊料 由于加热和压缩而导致的芯片接合。 构成：粘合剂组合物包含丙烯酸类聚合物树脂，环氧类树脂和咪唑化合物。 咪唑化合物的熔点为200-270℃。 该组合物在150℃下的熔融粘度为2×10 ^ 4 -15×10 ^ 4泊。 环氧基树脂的当量为约200-250g / eq，150℃下的熔融粘度为约0.01-0.2Pa·s。 组合物的粘合力为约15-30kgf / 25mm ^ 2。 丙烯酸类聚合物树脂含有环氧基，玻璃化转变温度约为（-30）〜80℃。

公开(公告)号：KR1020140076785A

公开(公告)日：2014-06-23

申请号：KR1020120145220

申请日：2012-12-13

Applicant: 제일모직주식회사

Inventor： 이준우 ,  김성민 ,  김진만 ,  김혜진 ,  위경태 ,  최재원

IPC: C09J7/02 ,  C09J163/00 ,  H01L21/02

CPC classification number: C09J7/22 ,  C09J7/30 ,  C09J163/00 ,  C09J2201/60 ,  C09J2203/326 ,  H01L21/02002 ,  H01L21/6836

Abstract: The present invention relates to an adhesive composition for a semiconductor and an adhesive film including the same, and more specifically, to an adhesive composition for a semiconductor with viscosity of 7000 Pa·s or less at 80 deg. C and 5000 Pa·s or less at 100 deg. C. According to one embodiment of the present invention, the adhesive composition for a semiconductor with a 0-10% of void area is obtained by bonding the film at 100-130 deg. C for 1-60 seconds and hardening the film at 125-150 deg. C for 10-60 minutes.

Abstract translation: 本发明涉及一种半导体用粘合剂组合物及其粘合膜，更具体地说，涉及在80度下粘度为7000Pa·s以下的半导体用粘合剂组合物。 C和5000Pa·s以下。 C.根据本发明的一个实施方案，通过在100-130度粘合该膜，获得具有0-10％空隙面积的半导体用粘合剂组合物。 C，持续1-60秒，并在125-150度硬化该膜。 C 10-60分钟。