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公开(公告)号：KR1020090022722A
公开(公告)日：2009-03-04
申请号：KR1020070088323
申请日：2007-08-31
Applicant: 제일모직주식회사
IPC: C09J133/08 , C09J183/04 , C09J7/02
CPC classification number: C09J133/14 , Y10T428/1471 , C09J7/00 , C09J2203/326
Abstract: An adhesive composition is provided to prevent the sticking by adding silicon modified acrylate imparting releasability and slip property to an adhesive binder and to secure enough pick-up property by lowering the maximum value of releasability. A photo-curable composition for an adhesive layer comprises an embedded adhesive binder, reactive acrylate having a dimethylsiloxane structure to a molecular chain, thermosetting material and photoinitiator. The embedded adhesive binder is added with low-molecular-weight acrylate having a carbon-carbon double bond to a side chain of polymer adhesive resin polymerized with an acrylate monomer. The interactive acrylate has a structure represented by the chemical formula 1. In the chemical formula 1, n is an integer of 5-1000.
Abstract translation: 提供粘合剂组合物以通过添加硅改性丙烯酸酯赋予粘合剂粘合剂赋予脱模性和滑爽性，并且通过降低脱模性的最大值来确保足够的吸收性能来防止粘附。 用于粘合剂层的可光固化组合物包括嵌入粘合剂粘合剂，分子链具有二甲基硅氧烷结构的反应性丙烯酸酯，热固性材料和光引发剂。 向嵌入的粘合剂粘合剂中加入具有碳 - 碳双键的低分子量丙烯酸酯与聚合物粘合剂树脂与丙烯酸酯单体聚合的侧链。 交互式丙烯酸酯具有由化学式1表示的结构。在化学式1中，n为5-1000的整数。
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12.发明授权비닐기를 함유한 아크릴계 점착수지 조성물, 이를 포함하는광경화형 점착조성물 및 이를 포함하는 점착테이프 有权包含乙烯基的丙烯酸酯 - 粘合剂树脂组合物，包含其的可光固化粘合剂组合物和包含它们的胶带
公开(公告)号：KR100885793B1
公开(公告)日：2009-02-26
申请号：KR1020060136216
申请日：2006-12-28
Applicant: 제일모직주식회사
IPC: C09J133/10 , C09J133/08 , C09J133/06
Abstract: 본 발명은 조성물의 성분이 비닐기를 함유한 아크릴계 점착수지 조성물, 이를 포함하는 광경화형 점착조성물 및 이를 포함하는 점착테이프에 관한 것으로, 본 발명에 의한 광경화형 점착조성물은 우수한 박리력을 갖는 아크릴계 점착수지 조성물을 포함하고 있어, 초기 점착력이 우수하고, 낮은 자외선 에너지에서도 광경화 후 우수한 박리성을 가짐으로써, 낮은 박리력이 요구되는 다이싱용 또는 다이싱 다이본딩용 점착 테이프에 유용하게 사용할 수 있다.
아크릴계 점착수지, 아크릴산, 메타크릴레이트, 부가중합, 광경화형 점착조성물, 점착 테이프-
公开(公告)号：KR1020080061198A
公开(公告)日：2008-07-02
申请号：KR1020060136222
申请日：2006-12-28
Applicant: 제일모직주식회사
IPC: C09J175/06 , C09J7/02 , C09J7/00
CPC classification number: C09J167/00 , C09J7/38 , C09J167/02
Abstract: An unsaturated polyester adhesive resin is provided to realize excellent adhesion to a substrate film, excellent peel force and low tackiness after photocuring, and to obtain an adhesive tape useful for dicing or dicing die bonding. An unsaturated polyester adhesive resin comprises an unsaturated acid, a saturated acid and glycol, and has a vinyl group-containing binder portion. The unsaturated acid is used in an amount of 5-50 mol% based on the combined molar weight of the unsaturated acid and saturated acid. The adhesive resin preferably comprises 2-22 wt% of the unsaturated acid, 32-55 wt% of the saturated acid and 42-57 wt% of glycol. The adhesive resin has a weight average molecular weight of 100,000-400,000.
Abstract translation: 提供了一种不饱和聚酯粘合树脂，以实现对基底膜的优异的粘附性，优异的剥离力和光固化后的低粘合性，并且获得用于切割或切割模片接合的粘合带。 不饱和聚酯粘合剂树脂包含不饱和酸，饱和酸和二醇，并且具有含乙烯基的粘合剂部分。 基于不饱和酸和饱和酸的组合摩尔浓度，不饱和酸的用量为5-50mol％。 粘合树脂优选包含2-22重量％的不饱和酸，32-55重量％的饱和酸和42-57重量％的二醇。 粘合树脂的重均分子量为100,000-400,000。
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公开(公告)号：KR100815383B1
公开(公告)日：2008-03-20
申请号：KR1020060136203
申请日：2006-12-28
Applicant: 제일모직주식회사
IPC: C08L101/00 , C08J5/18 , C08F290/06
CPC classification number: H01L21/6836 , H01L24/27 , H01L24/29 , H01L24/83 , H01L2224/2919 , H01L2224/29298 , H01L2224/83191 , H01L2924/01005 , H01L2924/01006 , H01L2924/0665 , H01L2924/181 , H01L2924/00 , H01L2924/3512
Abstract: A photocurable composition for forming an adhesive film is provided to realize excellent pick-up property by virtue of a sufficient drop in the adhesion after UV curing, and to facilitate die bonding on a PCB or lead frame by fixing chips during dicing and easily removing the chips during pick-up. A photocurable composition for forming an adhesive film comprises: (A) 100 parts by weight of a polymer binder resin; 20-150 parts by weight of a UV-curable urethane acrylate oligomer; (C) 5-50 parts by weight of a UV-curable acrylate present in a solid phase at room temperature; (D) 0.1-10 parts by weight of a heat curing agent; and (E) 0.1-5 parts by weight of a photopolymerization initiator based on 100 parts by weight of the UV curable acrylates (B)+(C). The binder polymer resin is at least one resin selected from acrylic, polyester, urethane, silicone and natural rubber resins.
Abstract translation: 提供了一种用于形成粘合剂膜的可光固化组合物，以便通过UV固化后的粘附力充分降低来实现优异的拾取性能，并且通过在切割期间固定芯片便于PCB或引线框架上的裸片接合，并且容易地除去 拾取期间的芯片。 用于形成粘合剂膜的光固化组合物包括：（A）100重量份的聚合物粘合剂树脂; 20-150重量份的可UV固化的氨基甲酸酯丙烯酸酯低聚物; （C）5-50重量份在室温下固相中存在的可UV固化的丙烯酸酯; （D）0.1-10重量份的热固化剂; 和（E）基于100重量份的UV固化丙烯酸酯（B）+（C），0.1-5重量份的光聚合引发剂。 粘合剂聚合物树脂是选自丙烯酸，聚酯，聚氨酯，硅酮和天然橡胶树脂中的至少一种树脂。
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公开(公告)号：KR1020090081103A
公开(公告)日：2009-07-28
申请号：KR1020080006993
申请日：2008-01-23
Applicant: 제일모직주식회사
IPC: C09J133/08 , H01L21/48 , H01L21/50
CPC classification number: C09J9/00 , C09J2203/326 , C09J2427/006 , H01L21/48 , H01L21/50
Abstract: A dicing tape for the semiconductor packaging is provided to inhibit the migration of a plasticizer and an additive of a PVC film, thereby improving the pick-up in the semiconductor packing process, room temperature stability and durability. A dicing tape(1) for the semiconductor packaging comprises a base film(5), an adhesive layer(3) and a release film(2), wherein a curing resin layer(4) having a storage modulus of 4.0x10^4 dyne/cm^2 or more is formed between the base film and the adhesive layer. The base film is a poly(vinyl chloride) film. The curing resin layer is formed by curing a curing resin layer composition with UV rays, heat or radioactive rays.
Abstract translation: 提供了用于半导体封装的切割胶带，以抑制增塑剂和PVC膜的添加剂的迁移，从而改善半导体填充过程中的拾取，室温稳定性和耐久性。 用于半导体封装的切割胶带（1）包括基膜（5），粘合剂层（3）和脱模膜（2），其中具有4.0×10 ^ 4达因的储能模量的固化树脂层（4） / cm 2以上形成在基膜和粘合剂层之间。 基膜是聚（氯乙烯）膜。 固化树脂层通过固化具有紫外线，热或放射线的固化树脂层组合物而形成。
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Patent Agency Ranking
公开(公告)号：KR1020080062642A
公开(公告)日：2008-07-03
申请号：KR1020060138677
申请日：2006-12-29
Applicant: 제일모직주식회사
IPC: C09J133/08 , C09J133/06 , C09J7/02 , C09J7/00
CPC classification number: C09J133/06 , C09J7/00 , C09J7/385 , C09J2203/326 , C09J2433/00
Abstract: An adhesive, adhesive composition containing the adhesive, and a dicing film formed by using the composition are provided to improve pick up property, UV transmissivity, elasticity and surface energy aging change. An adhesive is represented by the formula 1 and is prepared by the addition reaction of an acrylic copolymer binder obtained by copolymerizing at least one monomer selected from the group consisting of an acrylate having at least one hydroxyl group, an acrylate having at least one carboxyl group, a functional monomer, a soft acrylic monomer and a hard acrylic monomer, at least one kind of radiation curing acrylate having an epoxy group, and a radiation curing acrylate having at least one kind of isocyanate group, wherein R1 is at least one selected from 2-hydroxyethyl (meth)acrylate, hydroxybutyl acrylate, hydroxypropyl (meth)acrylate and vinyl caprolactam; R2 is at least one selected from 2-hydroxyethyl (meth)acrylate, hydroxybutyl acrylate, hydroxypropyl (meth)acrylate and vinyl caprolactam; and R3 is at least one selected from dimethylaminoethyl methacrylate, t-butylaminoethyl methacrylate, diethylaminoethyl methacrylate, acrylamide and glycidyl methacrylate.
Abstract translation: 提供含有粘合剂的粘合剂，粘合剂组合物和通过使用该组合物形成的切割膜以改善拾取性能，UV透射率，弹性和表面能老化变化。 粘合剂由式1表示，并且通过将至少一种选自具有至少一个羟基的丙烯酸酯，至少一个羧基的丙烯酸酯，至少一个羧基的丙烯酸酯共聚合得到的丙烯酸共聚物粘合剂的加成反应来制备 功能性单体，软质丙烯酸类单体和硬质丙烯酸类单体，至少一种具有环氧基的辐射固化丙烯酸酯和具有至少一种异氰酸酯基团的辐射固化丙烯酸酯，其中R1是选自以下的至少一种： （甲基）丙烯酸2-羟乙酯，丙烯酸羟丁酯，（甲基）丙烯酸羟丙酯和乙烯基己内酰胺; R2是选自（甲基）丙烯酸2-羟乙酯，丙烯酸羟丁酯，（甲基）丙烯酸羟丙酯和乙烯基己内酰胺中的至少一种; 并且R 3是选自甲基丙烯酸二甲基氨基乙酯，甲基丙烯酸叔丁基氨基乙酯，甲基丙烯酸二乙基氨基乙酯，丙烯酰胺和甲基丙烯酸缩水甘油酯中的至少一种。
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公开(公告)号：KR1020090131222A
公开(公告)日：2009-12-28
申请号：KR1020080057089
申请日：2008-06-17
Applicant: 제일모직주식회사
IPC: C09J5/08 , C09D133/08
CPC classification number: C09J5/08 , C09J11/06 , C09J133/00 , C09J2203/326 , C09J2205/31
Abstract: PURPOSE: A photocurable pressure-sensitive adhesive composition is provided to ensure excellent adhesive force with a ring frame, wafer or die bonding film, good pickup property under a photocurable condition that energy quantity is not constant. CONSTITUTION: A photocurable pressure-sensitive adhesive composition comprises 100.0 parts by weight of an acrylic pressure-sensitive adhesive binder solid containing a vinyl group; 1-30 parts by weight of an esterified quinonediazide; 0.5-5 parts by weight of a thermosetting material; and 0.1-3 parts by weight of a photopolymerizable initiator. The dicing film comprises a base film(100) and a photocurable pressure-sensitive adhesive layer formed on the upper side of the base film.
Abstract translation: 目的：提供可光固化的压敏粘合剂组合物，以确保环形框架，晶片或芯片接合薄膜具有优异的粘合力，在能量不恒定的光固化条件下具有良好的拾取性能。 构成：可光固化的压敏粘合剂组合物包含100.0重量份的含乙烯基的丙烯酸类压敏粘合剂粘合剂固体; 1-30重量份的酯化醌二叠氮化物; 0.5-5重量份的热固性材料; 和0.1-3重量份的光聚合引发剂。 切割膜包括基膜（100）和形成在基膜上侧的光固化性粘合剂层。
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公开(公告)号：KR100907982B1
公开(公告)日：2009-07-16
申请号：KR1020060134916
申请日：2006-12-27
Applicant: 제일모직주식회사
IPC: C09J133/08 , C09J133/06 , C09J7/02 , C09J5/00
CPC classification number: H01L24/27 , H01L21/6836 , H01L24/29 , H01L2224/2919 , H01L2224/29298 , H01L2224/83101 , H01L2224/83191 , H01L2924/01005 , H01L2924/01006 , H01L2924/0665 , H01L2924/1461 , H01L2924/00 , H01L2924/3512
Abstract: 본 발명은 기재층, 점착필름, 접착층이 순차로 적층된 다이싱 다이 본딩 필름에 있어서, 점착필름(4)을 형성하는 조성물이 (A)고분자 바인더 수지, (B)저분자의 UV경화형 아크릴레이트, (C)열경화제, 및 (D)광중합 개시제를 포함하고, 점착필름의 표면 구조가 바다-섬 (해도(Sea-Island)) 구조를 가지고, 섬 영역의 평균 크기가 1 내지 10마이크론인 다이싱 다이 본드 필름에 관한 것이다. 본 발명에 의한 다이싱 다이본딩 필름은 칩 크기가 10mm*10mm 이상 크기의 칩에서도 픽업성이 매우 우수하다.
웨이퍼, 점착 테이프, 해도구조, 다이싱, 다이 본딩, 우레탄 아크릴레이트,Abstract translation: 提供一种用于形成粘合膜的组合物，以防止当用于切割模片粘合膜中时丙烯酸粘合剂和UV可固化丙烯酸酯转移到粘合剂层中，并且即使在大于10的大片中也实现高拾取性 在UV照射后10mm×10mm。 一种用于形成粘合剂膜的组合物，其包含：（A）100重量份的聚合物粘合剂树脂; （B）20-150重量份的低分子量UV可固化丙烯酸酯; （C）0.1-10重量份的热固化剂; 和（D）基于100重量份的可UV固化的丙烯酸酯0.1-5重量份的光聚合引发剂。 由该组合物形成的粘合剂膜具有海岛表面结构，其中该岛区域的平均尺寸为1-10微米。
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公开(公告)号：KR1020090056312A
公开(公告)日：2009-06-03
申请号：KR1020070123409
申请日：2007-11-30
Applicant: 제일모직주식회사
IPC: C09J133/08 , C09J133/00 , C09J7/02 , C09J7/00
CPC classification number: C09J11/08 , C09J7/385 , C09J133/00 , C09J133/08
Abstract: A photo-curable pressure sensitive adhesive composition is provided to ensure excellent adhesive power and pick-up performance by introducing liquid polyisoperene rubber, and to be applied to dicing adhesive tape including an adhesive film layer for dicing and die bonding. A photo-curable pressure sensitive adhesive composition comprises a photo-curable acrylic adhesion binder 45~55 parts by weight including liquid polyisoperene rubber represented by chemical formula 1; a photoinitiator 0.2~1.0 parts by weight; a thermosetting material 1~5 parts by weight; and 35~50 parts by weight. In chemical formula 1, R is a C4~C9 alkyl group or hydroxyl group; n is an integer of 400~700. The molecular weight of the photo-curable acrylic adhesion binder is 150,000~700,000.
Abstract translation: 提供光固化型压敏粘合剂组合物以通过引入液体聚异戊二烯橡胶来确保优异的粘合力和吸收性能，并且应用于包括用于切割和芯片粘合的粘合剂膜层的切割粘合带。 光固化压敏粘合剂组合物包含45〜55重量份的可光固化丙烯酸粘合粘合剂，包括由化学式1表示的液体聚异戊二烯橡胶; 光引发剂0.2〜1.0重量份; 热固性材料1〜5重量份; 和35〜50重量份。 在化学式1中，R为C 4〜C 9烷基或羟基; n为400〜700的整数。 光固化丙烯酸粘合粘合剂的分子量为15万〜70万。
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公开(公告)号：KR1020090025516A
公开(公告)日：2009-03-11
申请号：KR1020070090433
申请日：2007-09-06
Applicant: 제일모직주식회사
IPC: C09J133/08 , C09J133/10 , C09J7/02 , C09J7/00
CPC classification number: C09J7/00 , C09J4/00 , C09J133/08 , C09J2203/326
Abstract: A photocurable composition for forming an adhesive film is provided to ensure excellent pick-up property due to the reduction of adhesion strength after UV curing and to obtain a dicing die bonding film with one dicing process and die bonding process of a supporting member. A photocurable composition for forming an adhesive film comprises (A) binder resin having adhesion property 100.0 parts by weight, (B) UV-curable urethane acrylate oligomer 20-150 parts by weight, (C) trimethylolpropane-tri(meth)acrylate UV-curable acrylate 3-50 parts by weight and (D) thermosetting agent 0.1-10 parts by weight. The photopolymerization initiator(C) is included in the amount of 0.1-5 parts by weight per UV-curable acrylate(B+C) 100 parts by weight. The polymer binder resin is acrylic resin and comprises a polar functional group selected from the group consisting of -OH, epoxy group and amine group.
Abstract translation: 提供了一种用于形成粘合剂膜的可光固化组合物，以确保由于UV固化后的粘附强度的降低而导致的优异的拾取性能，并且通过一个切割工艺和支撑构件的芯片粘合工艺获得切割芯片接合膜。 用于形成粘合剂膜的可光固化组合物包含（A）粘合性为100.0重量份的粘合剂树脂，（B）20-150重量份的UV可固化氨酯丙烯酸酯低聚物，（C）三羟甲基丙烷 - 三（甲基）丙烯酸酯UV- 可固化丙烯酸酯3-50重量份和（D）热硬化剂0.1-10重量份。 光聚合引发剂（C）的含量相对于100重量份的UV固化性丙烯酸酯（B + C）为0.1-5重量份。 聚合物粘合剂树脂是丙烯酸树脂，并且包含选自-OH，环氧基和胺基的极性官能团。
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