Abstract:
고주파 안테나(112)와, 고주파 안테나에 접속된 고주파 전원(160)과, 피처리체를 설치하는 서셉터(106)와, 고주파 안테나와 서셉터의 사이에 설치된 유전체 커버(174)와, 고주파 안테나와 유전체의 사이에 설치된 도전체(170)와, 도전체에 접속된 접지 회로(180)와, 접지 회로 중에 설치된 인덕턴스가 가변적인 인덕터(302)와, 커패시턴스가 가변적인 커패시터(304)를 구비한 플라즈마 처리 장치(100)의 인덕턴스 또는 커패시턴스를 조정함으로써, 유전체 커버(174)로의 이물의 부착 속도와 유전체 커버(174)의 스패터 속도가 거의 동등해져, 이 결과 유전체 커버(174)로의 이물의 부착을 방지할 수 있다.
Abstract:
A cable wiring structure and a substrate transfer mechanism are provided to suppress a load applied to each of filaments of a cable and predict easily a shape and a track of each of the filaments. A casing(110) includes a cable wiring space(116). A rotary member is rotatably arranged to observe the cable wiring space of the casing. A flat cable is formed by integrating and bonding a plurality of band-shaped filaments with each other. Each of the filaments is arranged in a vertical direction and is formed in the rotary member to be stored in the cable wiring space. One end of the flat cable is attached to a position apart from the center of the rotary member. The other end of the flat cable is attached to the casing. A wiring diameter of the flat cable is increased toward the cable wiring space.
Abstract:
A transfer chamber, a substrate processing apparatus, and a method of detecting a defect of a substrate are provided to optically detect a defect on a substrate by placing optical sensors near an opening through which the substrate is loaded and unloaded. A transfer chamber(20) is located in proximity to a process chamber for processing a rectangular substrate(S) and includes a transfer device for transferring the substrate to the process chamber. The transfer chamber further includes an opening(22d) through which the substrate transferred by the transfer device is loaded and unloaded, and a pair of optical sensors(70) arranged near the opening at an interval narrower than the width of the substrate.