11.
    发明专利
    未知

    公开(公告)号:DE19702424A1

    公开(公告)日:1998-07-30

    申请号:DE19702424

    申请日:1997-01-24

    Applicant: BASF AG

    Abstract: The invention concerns a method of inscribing by means of high-energy radiation mouldings based on thermoplastic polymers A) or mixtures of these polymers with up to 70 wt %, relative to the total weight of the components, of further additives and processing aids. The invention is characterized in that a vinylaromatic polymer B) is used as additive for improving inscribability, this polymer having been modified by the incorporation of at least one functional group selected from the series comprising carbonyl, carboxylic acid, acid anhydride, acid amide, acid imide, carboxylic acid ester, carboxylate, amino, hydroxyl, epoxy, oxazolin, urethane, urea, lactam or benzyl halide groups.

    13.
    发明专利
    未知

    公开(公告)号:DE19543161A1

    公开(公告)日:1997-05-22

    申请号:DE19543161

    申请日:1995-11-18

    Applicant: BASF AG

    Abstract: The production of branched polyamides (I) comprises: (i) mixing (A) 10-99.7 wt% molten polyamide prepolymer with a viscosity number (VN) of 40-90 ml/g with (B) 0.3-6 wt% poly- carboxylic acid with 3-10 free COOH groups and (C) 0-80 wt% other additives and processing aids; followed by (ii) solid-phase post- condensation. Also claimed are thermoplastic moulding materials obtained by this process. Preferably after solid-phase post-condensation, the polyamide has a VN of at least 100 ml/g. Component (B) contains 3 or 4 free COOH groups; preferred (B) is benzene-1,3,5- tricarboxylic or -1,2,4,5-tetracarboxylic acid, biphenyl- -3,5,3',5'-tetracarboxylic acid and/or naphthalene-1,3,5,7- tetracarboxylic acid. The amount of (B) used is 0.4-5.8 wt%. Component (A) consists of polyamide (PA) 66, PA 6/6T and/or PA 66/6T.

    14.
    发明专利
    未知

    公开(公告)号:DE19513848A1

    公开(公告)日:1996-10-17

    申请号:DE19513848

    申请日:1995-04-12

    Applicant: BASF AG

    Abstract: Thermoplastic moulding materials (I) contg. (A) 1-99 wt% partly aromatic copolyamide contg. (a1) 30-44 mole% terephthalic acid (TPA) units, (a2) 6-25 mole% isophthalic acid (IPA) units, (a3) 43-49.5 mole% hexamethylenediamine (HMDA) units and (a4) 0.5-7 mole% units derived from 6-30C cyclic aliphatic diamines; (B) 1-99 wt% polyether-imide; (C) 0-30 wt% polymeric component with OH gps.; (D) 0-60 wt% fibrous and/or particulate fillers; (E) 0-40 wt% impact modifying rubber; and (F) 0-40 wt% conventional additives, etc.. Also claimed are fibres, films and moulded prods. obtd. from (I).

    16.
    发明专利
    未知

    公开(公告)号:DE19501998A1

    公开(公告)日:1996-07-25

    申请号:DE19501998

    申请日:1995-01-24

    Applicant: BASF AG

    Abstract: A thermoplastic moulding material (I) contains: (A) 5-94 wt.% of a partly aromatic, partly crystalline copolyamide derived from: (a1) 30-44 mole% terephthalic acid (TPA) units; (a2) 6-20 mole% isophthalic acid (IPA) units; (a3) 43-49.5 mole% hexamethylenediamine (HMDA) units; and (a4) 0.5-7 mole% units derived from 6-30C cyclic aliphatic diamines; (B) 5-94 wt.% ABS, ASA or SAN polymer and/or a polymer of (1-18C alkyl) (meth)acrylate; (C) 1-30 wt.% of a coupling agent contg. 0.1-10 wt.% functional monomers (w.r.t. 100 wt.% C.); (D) 0-30 wt.% of a rubber-elastic polymer; (E) 0-45 wt.% of a fibrous and/or particulate filler; and (F) 0-30 wt.% of conventional additives and processing aids. Also claimed are moulded prods. obtd. from (I).

    17.
    发明专利
    未知

    公开(公告)号:DE4444378A1

    公开(公告)日:1996-06-20

    申请号:DE4444378

    申请日:1994-12-14

    Applicant: BASF AG

    Abstract: Thermoplastic moulding materials (I) contain (A) 1-98.5 wt.% partly aromatic copolyamide, (B) 1-98.5 wt.% polymethacrylimide, (C) 0.5-30 wt.% polymeric component with OH gps., (D) 0-60 wt.% fibrous and/or particulate filler(s), (E) 0-40 wt.% impact-modifying rubber and (F) 0-40 wt.% conventional additives etc. Also claimed are fibres, film and mouldings made from (I).

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