15.
    发明专利
    未知

    公开(公告)号:DE19830555A1

    公开(公告)日:2000-01-13

    申请号:DE19830555

    申请日:1998-07-08

    Applicant: BASF AG

    Abstract: Aqueous preparations containing: (i) a film-forming copolymer with monomer units derived from ureas, thioureas or imidazolidin-2-ones with unsaturated substituents; and (ii) a compound with 2 or more aldehyde groups are used for coating polyurethane (PU)-based substrates. The use of aqueous preparations for coating PU-based substrates is claimed. These preparations contain: (i) dispersed film-forming polymer(s) (A) derived from unsaturated monomers (M) comprising monomer(s) (M1) of formula (I) and comonomer(s) (M2); and (ii) compound(s) (B) with two or more aldehyde groups, in which: R , R = H or 1-5C alkyl, or R + R may form a 2-4C alkylene group, optionally substituted with 1 or 2 1-5C alkyl, 1-4C alkoxy and/or hydroxyl groups; X = oxygen or sulfur; R = a 2-20C mono-unsaturated residue. Independent claims are also included for: (a) a process for coating water-repellent PU-based substrates by applying these preparations to the substrate; (b) aqueous preparations containing 10-50 wt.% polymer (A), 0.05-5 wt.% compound(s) (B) (based on A), 10-70 wt.% inorganic fillers and/or pigments, 0.1-20 wt.% conventional additives etc. and water to 100 wt.%, in which (A) is a copolymer of 70-95 wt% n-butyl and/or 2-ethylhexyl acrylate, 5-25 wt.% styrene, methyl methacrylate and/or tert.-butyl methacrylate, 0.1-5 wt.% monomer(s) M1 and 0.1-5 wt.% monomer(s) M3.

    16.
    发明专利
    未知

    公开(公告)号:DE19824928A1

    公开(公告)日:1999-12-09

    申请号:DE19824928

    申请日:1998-06-04

    Applicant: BASF AG

    Abstract: Aqueous, filler containing compositions comprises: (1) a dispersion of polymer with a glass transition temperature (Tg) -10 degrees C; and (2) a solution of ≤ 50 wt.% abietic acid based resin with a Tg = 0-90 degrees C dissolved in a liquid resin with a Tg -10 degrees C. Aqueous compositions comprises: (A) 10-35 wt.% dispersed polymer with Tg -10 degrees C; (B) 5-22 wt.% liquid (at 23 degrees C/1 bar) resin with a Tg -10 degrees C, in which sufficient abietic acid (AA) can be dissolved at 23 degrees C and 1 bar to give a solution of ≤ 50 wt.% AA; (C) 5-22 wt.% resin with Tg = 0-90 degrees C, based on optionally modified abietic acid; and (D) 21-80 wt.% filler (wt.% based on all components except water). An Independent claims is also included for production of the composition by making a solution of resins (B) and (C), and then adding this solution together with the other components to an aqueous dispersion of polymer (A).

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