公开(公告)号：EP2789377A3

公开(公告)日：2015-01-21

申请号：EP14161350.5

申请日：2014-03-24

Applicant: Delphi Technologies, Inc.

Inventor： Ihms, David, W. ,  Myers, Bruce A.

IPC: B01D53/14 ,  B01D53/92 ,  F01N3/08

CPC classification number: B01D53/1475 ,  B01D53/1493 ,  B01D53/92 ,  B01D2252/2053 ,  B01D2252/502 ,  B01D2257/504 ,  F01N3/0828 ,  F01N3/0857 ,  F01N2240/02 ,  F01N2240/18 ,  F01N2370/00 ,  F01N2570/00 ,  F01N2570/10 ,  Y02A50/2342 ,  Y02C10/06 ,  Y02T10/20

Abstract: A carbon dioxide storage means stores the carbon dioxide released in a heat exchanger (18). The heat exchanger (18) cools the exhaust gas (16) emitted by the internal combustion engine, and includes a thermal electric generator (teg (54)) configured to couple thermally the exhaust gas chamber (50) to the absorber fluid chamber (52) in a manner effective to heat the CO2 absorbent fluid (24) by heat from the engine exhaust to release CO2 gas from the CO2 absorbent fluid (24) and generate electricity in response to a temperature difference therebetween. The CO2 absorbent fluid (24) is one of: a) an aliphatic di-functional nitrile (e.g. pimelonitrile); and b) an oligomeric poly-acrylonitrile (PAN).

公开(公告)号：EP2789822A1

公开(公告)日：2014-10-15

申请号：EP14163084.8

申请日：2014-04-01

Applicant: Delphi Technologies, Inc.

Inventor： Brandenburg, Scott D. ,  Eltom, Khalid M. ,  Myers, Bruce A. ,  Eesley, Gary L. ,  Moor, Bruce

IPC: F01N5/02 ,  F01N13/16

CPC classification number: H01L35/30 ,  F01N5/025 ,  F01N2240/02 ,  Y02T10/16

Abstract: An assembly (10) for coupling thermally a thermoelectric generator (TEG (12)) to an exhaust manifold of an internal combustion engine. The exhaust manifold forms a first heat exchanger (14) configured to couple thermally heat from exhaust gas (16) to an outer surface (22) of the first heat exchanger (14). The outer surface (22) is preferably formed of stainless steel. A first dielectric layer (24) is formed by firing a thick-film dielectric material onto the stainless steel of the first heat exchanger (14). A first conductor layer (26) is formed by firing a conductive thick-film onto the first dielectric layer (24). A first paste layer (32) of silver (Ag) based sintering paste is interposed between the first conductor layer (26) and a first contact (30) of the TEG (12). The first contact (30) is sintered to the first conductor layer (26) when the assembly (10) is suitably arranged and suitably heated.

Abstract translation: 一种用于将热电发电机（TEG（12））热耦合至内燃机的排气歧管的组件（10）。 排气歧管形成第一热交换器（14），该第一热交换器构造成将来自排气（16）的热热量耦合到第一热交换器（14）的外表面（22）。 外表面（22）优选由不锈钢形成。 通过在第一热交换器（14）的不锈钢上烧制厚膜电介质材料来形成第一电介质层（24）。 通过在第一介电层（24）上烧制导电厚膜来形成第一导体层（26）。 在第一导体层（26）和TEG（12）的第一触点（30）之间插入银（Ag）基烧结浆料的第一浆料层（32）。 当组件（10）被合适地布置并适当地加热时，第一触点（30）被烧结到第一导体层（26）。

公开(公告)号：EP2323470B1

公开(公告)日：2013-05-15

申请号：EP10186911.3

申请日：2010-10-07

Applicant: Delphi Technologies, Inc.

Inventor： Oman, Todd P. ,  Tieman, Craig A. ,  Sultan, Michel F. ,  Partin, Dale L. ,  Myers, Bruce A.

IPC: H05K7/20

CPC classification number: H05K7/20854

公开(公告)号：EP2323470A3

公开(公告)日：2012-04-25

申请号：EP10186911.3

申请日：2010-10-07

Applicant: Delphi Technologies, Inc.

Inventor： Oman, Todd P. ,  Tieman, Craig A. ,  Sultan, Michel F. ,  Partin, Dale L. ,  Myers, Bruce A.

IPC: H05K7/20

CPC classification number: H05K7/20854

Abstract: A thermal-protection apparatus (10) disposed in a vehicle cabin or storage compartment includes a housing (16) enveloping a chamber (26) in which a thermally-sensitive consumer electronic device (18) is received, a thermoelectric module (20) mounted in a wall (16b) of the housing (16), and a remote electronic controller (12) and power source (14) coupled to the housing (16) via an electrical cable (24) for activating the thermoelectric module (20), and optionally the consumer electronic device (18), in a manner to prevent the temperature in the chamber (26) from exceeding a prescribed maximum operating temperature of the consumer electronic device (18) or falling below a prescribed minimum operating temperature of the consumer electronic device (18).

公开(公告)号：EP1463104A3

公开(公告)日：2011-05-18

申请号：EP04075831.0

申请日：2004-03-15

Applicant: Delphi Technologies, Inc.

Inventor： Brandenburg, Scott D. ,  Degenkolb, Thomas A. ,  Myers, Bruce A.

IPC: H01L21/56 ,  H01L23/31

CPC classification number: H05K3/284 ,  H01L23/3121 ,  H01L23/4334 ,  H01L24/45 ,  H01L24/48 ,  H01L2224/05599 ,  H01L2224/45124 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2224/85399 ,  H01L2924/00014 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/1815 ,  H01R13/504 ,  H01R13/665 ,  H01R43/24 ,  H05K3/0058 ,  Y10T29/49121 ,  Y10T29/4913 ,  Y10T29/49144 ,  Y10T29/49146 ,  H01L2924/00012 ,  H01L2924/00015 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2924/00

Abstract: An overmolded electronic package (100, 200, 300, 400, 500) includes a circuit-carrying substrate (24) and a connector housing (14) or shroud (14') interconnected via a suitable interconnection arrangement (20, 32, 34; 20' 32, 320). Some embodiments may include a backplate (12) affixed to the substrate (24) and, in some cases, also to the connector housing (14) or shroud (14'). In some embodiments, the connector housing (14) or shroud (14') may be affixed to the substrate (12), and in any case the entire subassembly of components is overmolded with a rigidly formable molding compound (110) to bond together all components of the subassembly and form the overmolded electronic package (100, 200, 300, 400, 500). The subassembly of components with the exception of the backplate (12) may alternatively be overmolded with the molding compound (110), and a backplate (12) thereafter affixed to the subassembly via a compliant bonding medium (402).

公开(公告)号：EP1681765B1

公开(公告)日：2009-12-02

申请号：EP05078000.6

申请日：2005-12-27

Applicant: Delphi Technologies, Inc.

Inventor： Myers, Bruce A.

IPC: H03G3/30

CPC classification number: H03G3/3005 ,  H04S7/00 ,  H04S2400/13

公开(公告)号：EP1732130A3

公开(公告)日：2008-12-03

申请号：EP06076112.9

申请日：2006-05-26

Applicant: Delphi Technologies, Inc.

Inventor： Brandenburg, Scott D. ,  Myers, Bruce A.

IPC: H01L23/367 ,  H01L23/42 ,  H01L23/36 ,  H01L25/10

CPC classification number: H01L23/3675 ,  H01L23/36 ,  H01L23/3677 ,  H01L24/48 ,  H01L25/105 ,  H01L2224/32188 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/14 ,  H01L2924/1532 ,  H01L2924/16152 ,  H01L2924/181 ,  H05K1/0204 ,  H05K3/0061 ,  H05K2201/09054 ,  H05K2201/10689 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

Abstract: A circuit assembly (10,110,210,310,410) containing a surface mount (SM) IC package (14) wire bonded to a substrate (12) and configured to conduct heat from the package (14) into a heat sink (18) through a heat-conducting member (16) instead of the substrate (12). The package (14) contains an IC device (20) with input/output pads (22) on a surface (32) thereof that are connected with leads (38) to conductors on the substrate (12). The heat sink (18) is located adjacent the package (14) so as not to be separated from the package (14) by the substrate (12). The heat-conducting member (16) is positioned adjacent the surface (34) of the device (20) opposite its input/output pads (22), and is bonded to the device (20) and heat sink (18) to provide a heat path between the package (14) and heat sink (18) that does not pass through the substrate (12).

公开(公告)号：EP1681765A3

公开(公告)日：2007-01-03

申请号：EP05078000.6

申请日：2005-12-27

Applicant: Delphi Technologies, Inc.

Inventor： Myers, Bruce A.

IPC: H03G3/30

CPC classification number: H03G3/3005 ,  H04S7/00 ,  H04S2400/13

Abstract: An audio volume control system (10) including a plurality of audio signal sources (12) each configured to generate an audio signal (14), and a controller (16) configured to retrieve a stored volume setting for each audio signal source (12) and control the output volume level of an output device (18) in response to the stored volume setting.

Abstract translation: 一种包括多个音频信号源（12）的音频音量控制系统（10），每个音频信号源被配置为产生音频信号（14），以及控制器（16），被配置为检索每个音频信号源（12）的存储的音量设置， 并且响应于存储的音量设置来控制输出设备（18）的输出音量电平。

公开(公告)号：EP1609838A2

公开(公告)日：2005-12-28

申请号：EP05076406.7

申请日：2005-06-16

Applicant: Delphi Technologies, Inc.

Inventor： Myers, Bruce A. ,  Chaudhuri. Arun K.

IPC: C09K5/06 ,  C09K5/14 ,  H01L23/373

CPC classification number: H01L23/4275 ,  C09K5/063 ,  C09K5/14 ,  H01L23/3737 ,  H01L2924/0002 ,  Y02P20/13 ,  Y10T428/25 ,  H01L2924/00

Abstract: The present invention provides a high performance polymer-base material (10, 20, 30) capable of dissipating transient thermal energy generated by an electronic module, such as a heat-generating power device. The methods of the present invention involve adding a suitable thinner to reduce the viscosity and increase the volume of a polymer-base matrix material (12) so that a large amount of thermal absorbing particles (14, 22, 25) may be added. The final cured product may have a filler content of more than 80 weight %. Further, the present invention provides a new and reduced cost formulation of a polymer-base thermal transient suppression material (30) containing organic wax particles.

Abstract translation: 本发明提供一种能够消散由诸如发热功率器件的电子模块产生的瞬态热能的高性能聚合物基材料（10,20,30）。 本发明的方法包括加入合适的稀释剂以降低聚合物基质基体材料（12）的粘度和增加体积，从而可以加入大量的热吸收颗粒（14,22,25）。 最终的固化产物可以具有大于80重量％的填料含量。 此外，本发明提供了含有有机蜡颗粒的聚合物基热瞬变抑制材料（30）的新的和降低的成本制剂。

公开(公告)号：EP1336992A3

公开(公告)日：2005-06-22

申请号：EP03075211.7

申请日：2003-01-23

Applicant: Delphi Technologies, Inc.

Inventor： Myers, Bruce A. ,  Chaudhuri, Arun K. ,  Burns, Jeffrey H.

IPC: H01L23/427 ,  H01L23/29

CPC classification number: H01L23/295 ,  H01L23/29 ,  H01L23/3733 ,  H01L23/4275 ,  H01L2924/0002 ,  Y10T428/2991 ,  Y10T428/2998 ,  Y10T428/31663 ,  H01L2924/00

Abstract: An encapsulation material (10,20,30) suitable for dissipating heat generated by an electronic module (40,50), such as by directly contacting a heat-generating power device (42) or contacting a heat sink (56) of a heat-generating power device (52). The encapsulation material (10,20,30) comprises phase change particles (14) dispersed in a gel material (12). The phase change particles (14) preferably comprise a solder alloy encapsulated by a dielectric coating (16) so the phase change particles (14) are electrically insulated from each other. The encapsulation material (10,20,30) may further comprise dielectric particles (22) dispersed in the gel material (12) for the purpose of increasing the thermal conductivity of the encapsulation material (10,20,30). Alternatively or in addition, the dielectric coating (16) on the phase change particles (14) may comprise dielectric particles (32) that are dispersed in a dielectric matrix, again with the preferred effect of increasing the thermal conductivity of the encapsulation material (10,20,30).