公开(公告)号：US20240033876A1

公开(公告)日：2024-02-01

申请号：US18352325

申请日：2023-07-14

Applicant: EBARA CORPORATION

Inventor： Shumpei MIURA ,  Kenichi SUZUKI ,  Itsuki KOBATA ,  Yasuyuki MOTOSHIMA ,  Ban ITO ,  Seungho YUN

IPC: B24B37/015 ,  B24B37/34

CPC classification number: B24B37/015 ,  B24B37/34

Abstract: A polishing apparatus is disclosed, which is capable of heating and maintaining a temperature distribution of a polishing pad at a predetermined temperature distribution with a simple structure. The polishing apparatus has a pad-temperature regulating apparatus for regulating a temperature of a polishing surface, and the pad-temperature regulating apparatus includes a heating-fluid nozzle arranged above and spaced apart from the polishing surface. The heating-fluid nozzle includes: a nozzle body; a slit formed along a longitudinal direction of the nozzle body for ejecting a heating fluid toward the polishing surface; a header tube which is formed within the nozzle body and into which the heating fluid is supplied; a buffer tube which is formed within the nozzle body and communicates with the slit, and a plurality of branch tubes for coupling the header tube to the buffer tube.

公开(公告)号：US20210229235A1

公开(公告)日：2021-07-29

申请号：US17229106

申请日：2021-04-13

Applicant: EBARA CORPORATION

Inventor： Tadakazu SONE ,  Yasuyuki MOTOSHIMA ,  Toru MARUYAMA ,  Katsutoshi ONO ,  Yoichi SHIOKAWA

IPC: B24B37/015 ,  B24B37/10 ,  B24B37/34 ,  B24B55/02 ,  B24B37/04

Abstract: An apparatus for polishing a substrate includes a rotatable polishing table supporting a polishing pad, a substrate holder configured to hold the substrate and press the substrate against a polishing surface of the polishing pad on the rotating polishing table so as to polish the substrate, and a pad-temperature detector configured to measure a temperature of the polishing surface of the polishing pad. The apparatus also includes a pad-temperature regulator configured to contact the polishing surface to regulate the temperature of the polishing surface, and a temperature controller configured to control the temperature of the polishing surface by controlling the pad-temperature regulator based on information on the temperature of the polishing surface detected by the pad-temperature detector.

公开(公告)号：US20190193237A1

公开(公告)日：2019-06-27

申请号：US16226441

申请日：2018-12-19

Applicant: EBARA CORPORATION

Inventor： Yasuyuki MOTOSHIMA

IPC: B24B37/015 ,  B24B37/04 ,  B24B37/10 ,  B24B37/34 ,  B24B55/02

CPC classification number: B24B37/015 ,  B24B37/042 ,  B24B37/10 ,  B24B37/34 ,  B24B55/02

Abstract: A pad temperature adjustment apparatus for adjusting the temperature of a polishing pad of a polishing apparatus, including: a heat conduction part for conducting heat between the heat conduction part and the polishing pad; an arm that extends from the heat conduction part, wherein a distal end of the arm is formed in a tapered shape; an arm mount for installing the arm, wherein an arm guide having a tapered groove shape corresponding to the shape of the arm is formed in the arm mount; and a falling prevention member for preventing the arm from falling out of the arm guide.

公开(公告)号：US20170361420A1

公开(公告)日：2017-12-21

申请号：US15696926

申请日：2017-09-06

Applicant: EBARA CORPORATION

Inventor： Toru MARUYAMA ,  Hisanori MATSUO ,  Yasuyuki MOTOSHIMA

IPC: B24B37/015 ,  B24B49/14 ,  G01J5/02 ,  G01J5/00

CPC classification number: B24B37/015 ,  B24B49/14 ,  B24B55/02 ,  G01J5/025 ,  G01J2005/0085

Abstract: A polishing method and a polishing apparatus which can increase a polishing rate and can control a polishing profile of a substrate being polished by adjusting a surface temperature of a polishing pad are disclosed. The polishing method for polishing a substrate by pressing the substrate against a polishing pad on a polishing table includes a pad temperature adjustment step of adjusting a surface temperature of the polishing pad, and a polishing step of polishing the substrate by pressing the substrate against the polishing pad having the adjusted surface temperature. In the pad temperature adjustment step, the surface temperature of a part of an area of the polishing pad, the area being to be brought in contact with the substrate, is adjusted during the polishing step so that the rate of temperature change of a temperature profile in a radial direction of the surface of the polishing pad becomes constant in the radial direction of the polishing pad.

公开(公告)号：US20170239778A1

公开(公告)日：2017-08-24

申请号：US15436559

申请日：2017-02-17

Applicant: Ebara Corporation

Inventor： Toru MARUYAMA ,  Hisanori MATSUO ,  Yasuyuki MOTOSHIMA ,  Yohei ETO ,  Mitsunori KOMATSU

IPC: B24B37/015 ,  B24B37/20

CPC classification number: B24B37/015 ,  B24B37/20

Abstract: There is disclosed an apparatus which can maintain a surface temperature of a polishing pad at a desired target temperature. The apparatus for regulating a surface temperature of a polishing pad, includes: a pad contact member which is contactable with a surface of the polishing pad and which has a heating flow passage and a cooling flow passage formed therein; a heating-liquid supply pipe coupled to the heating flow passage; a cooling-liquid supply pipe coupled to the cooling flow passage; a first flow control valve attached to the heating-liquid supply pipe; a second flow control valve attached to the cooling-liquid supply pipe; a pad-temperature measuring device configured to measure a surface temperature of the polishing pad; and a valve controller configured to operate the first flow control valve and the second flow control valve based on the surface temperature of the polishing pad.

公开(公告)号：US20150224621A1

公开(公告)日：2015-08-13

申请号：US14696908

申请日：2015-04-27

Applicant: EBARA CORPORATION

Inventor： Yasuyuki MOTOSHIMA ,  Toru MARUYAMA ,  Hisanori MATSUO

IPC: B24B37/015 ,  B24B49/14 ,  B24B53/017 ,  B24B37/34

CPC classification number: B24B37/015 ,  B24B37/34 ,  B24B49/14 ,  B24B53/017 ,  B24B55/02

Abstract: A polishing apparatus polishes a surface of a substrate by pressing the substrate against a polishing pad on a polishing table. The polishing apparatus is configured to control a temperature of the polishing surface of the polishing pad by blowing a gas on the polishing pad during polishing. The polishing apparatus includes a pad temperature control mechanism having at least one gas ejection nozzle for ejecting a gas toward the polishing pad and configured to blow the gas onto the polishing pad to control a temperature of the polishing pad, and an atomizer having at least one nozzle for ejecting a liquid or a mixed fluid of a gas and a liquid and configured to blow the liquid or the mixed fluid onto the polishing pad to remove foreign matters on the polishing pad. The pad temperature control mechanism and the atomizer are formed into an integral unit.

Abstract translation: 抛光装置通过将基板压靠在研磨台上的抛光垫上来抛光基板的表面。 抛光装置被配置为通过在抛光期间在抛光垫上吹入气体来控制抛光垫的抛光表面的温度。 抛光装置包括：衬垫温度控制机构，其具有至少一个气体喷射喷嘴，用于向抛光垫喷射气体，并且构造成将气体吹送到抛光垫上以控制抛光垫的温度;以及雾化器，其具有至少一个 用于喷射气体和液体的液体或混合流体的喷嘴，用于将液体或混合流体吹送到抛光垫上以去除抛光垫上的异物。 焊盘温度控制机构和雾化器形成为一体的单元。

公开(公告)号：US20240351163A1

公开(公告)日：2024-10-24

申请号：US18634676

申请日：2024-04-12

Applicant: EBARA CORPORATION

Inventor： Masayoshi ITO ,  Seungho YUN ,  Yukihiro KANG ,  Yasuyuki MOTOSHIMA ,  Shumpei MIURA ,  Kenichi SUZUKI

IPC: B24B49/14 ,  B24B49/04 ,  B24B49/16

CPC classification number: B24B49/14 ,  B24B49/04 ,  B24B49/16

Abstract: A polishing method capable of appropriately controlling a temperature of a polishing surface of a polishing pad during polishing of a workpiece is disclosed. The polishing method includes detecting a surface condition of a sample while polishing the sample on a polishing surface of a polishing pad; creating time-series data representing temporal change in the surface condition of the sample; determining a point in time at which the surface condition of the sample has distinctively changed based on the time-series data; determining a temperature control time based on the determined point in time; and controlling a temperature of the polishing surface of the polishing pad based on the temperature control time, while polishing a workpiece on the polishing surface of the polishing pad.

公开(公告)号：US20220305617A1

公开(公告)日：2022-09-29

申请号：US17692038

申请日：2022-03-10

Applicant: EBARA CORPORATION

Inventor： Keisuke KAMIKI ,  Toru MARUYAMA ,  Yasuyuki MOTOSHIMA

IPC: B24B55/02 ,  B24B37/04 ,  B24B37/015 ,  B24B37/34

Abstract: A pad-temperature regulating apparatus is disclosed, which includes a heat exchanger capable of being cleaned in a limited space. A pad-temperature regulating apparatus includes a heat exchanger configured to contact a polishing pad to exchange heat with the polishing pad, a moving mechanism configured to move the heat exchanger between a temperature regulating position where the heat exchanger can exchange heat with the polishing pad, and a retreat position located on a side of the polishing pad, and a cleaning mechanism configured to clean the heat exchanger moved to the retreat position. The heat exchanger has an approximate triangular shape in a horizontal cross-section, and a longest side of the heat exchanger faces the polishing pad when the heat exchanger is moved to the retreat position.

公开(公告)号：US20210114164A1

公开(公告)日：2021-04-22

申请号：US17065787

申请日：2020-10-08

Applicant: EBARA CORPORATION

Inventor： Masashi KABASAWA ,  Yasuyuki MOTOSHIMA ,  Hisanori MATSUO ,  Keisuke KAMIKI

IPC: B24B37/015 ,  B24B37/013 ,  B24B37/20

Abstract: There is disclosed a polishing apparatus which can regulate a surface temperature of the polishing pad without causing a defect such as a scratch on a substrate such as a wafer. The polishing apparatus includes: a non-contact type pad-temperature regulating device; a pad-temperature measuring device. The pad-temperature measuring device is arranged adjacent to the pad-temperature regulating device and on a downstream side of the pad-temperature regulating device in a rotation direction of a polishing table.

公开(公告)号：US20190164769A1

公开(公告)日：2019-05-30

申请号：US16313442

申请日：2017-06-26

Applicant: EBARA CORPORATION

Inventor： Shinji KAJITA ,  Hisajiro NAKANO ,  Tomoatsu ISHIBASHI ,  Koichi FUKAYA ,  Yasuyuki MOTOSHIMA ,  Yohei ETO ,  Fumitoshi OIKAWA

IPC: H01L21/304 ,  H01L21/02 ,  H01L21/67 ,  H01L21/687

Abstract: An apparatus for cleaning a substrate has a holding unit 60 that holds a substrate W; a rotated unit 30 connected to the holding unit 60; a rotating unit 35 that is provided on a peripheral outer side of the rotated unit 30 and rotates the rotated unit 30; and a cleaning unit 10, 20 that physically cleans the substrate W held by the holding unit 60.