SEMICONDUCTOR DEVICE AND A METHOD OF MANUFACTURING THEREOF

    公开(公告)号:US20200227371A1

    公开(公告)日:2020-07-16

    申请号:US16836441

    申请日:2020-03-31

    Abstract: A light-emitting module includes a common carrier; a plurality of semiconductor devices formed on the common carrier, and each of the plurality of semiconductor devices including three semiconductor dies; a carrier including a connecting surface; a third bonding pad and a fourth bonding pad formed on the connecting surface; and a connecting layer. One of the three semiconductor dies includes a stacking structure; a first bonding pad; and a second bonding pad with a shortest distance less than 150 microns between the first bonding pad. The connecting layer includes a first conductive part including a first conductive material having a first shape; and a blocking part covering the first conductive part and including a second conductive material having a second shape with a diameter in a cross-sectional view. The first shape has a height greater than the diameter.

    LIGHT EMITTING DEVICE AND METHOD OF FORMING THE SAME

    公开(公告)号:US20190157498A1

    公开(公告)日:2019-05-23

    申请号:US16254342

    申请日:2019-01-22

    Abstract: A light-emitting device includes a transparent substrate, a transparent adhesive layer on the transparent substrate, a first transparent conductive layer on the transparent adhesive layer, a multi-layer epitaxial structure and a first electrode on the transparent conductive layer, and a second electrode on the multi-layer epitaxial structure. The multi-layer epitaxial structure includes a light-emitting layer. The transparent substrate has a first surface facing the transparent adhesive layer and a second surface opposite to the first surface, wherein the area of the second surface is larger than that of the light-emitting layer, and the area ratio thereof is not less than 1.6.

    LIGHTING APPARATUSES AND LED MODULES FOR BOTH ILLUMINATION AND OPTICAL COMMUNICATION

    公开(公告)号:US20170287888A1

    公开(公告)日:2017-10-05

    申请号:US15493430

    申请日:2017-04-21

    Abstract: An LED module has a controller with a modulator and illumination driver, and first and second LED chains. The first LED chain is connected to the modulator, has a first group of LED cells, and emits a first light under a pulse mode current input from the modulator. The first light has a digital data over a signal carrier. The second LED chain is connected to the illumination driver, has a second group of LED cells, and emits a second light under a constant current input from the illumination driver. There are fewer LED cells in the first group than the second group. The illumination driver is independent from the modulator in controlling emission of the first light. Alternatively, the LED module has a controller, an LED chain connected to the modulator, a first group of LED cells, and a second group of LED cells directly connected to the first group of LED cells. The first group of LED cells operates under a pulse mode current input from the modulator and emits a first light having a digital data over a signal carrier. The second group of LED cells emits a second light under a constant current input from the illumination driver.

    INTERGRATED LIGHTING APPARATUS AND METHOD OF MANUFACTURING THE SAME
    18.
    发明申请
    INTERGRATED LIGHTING APPARATUS AND METHOD OF MANUFACTURING THE SAME 有权
    互动照明装置及其制造方法

    公开(公告)号:US20140361319A1

    公开(公告)日:2014-12-11

    申请号:US14466284

    申请日:2014-08-22

    Abstract: An integrated lighting apparatus comprises a first control device including a semiconductor substrate, an integrated circuit block formed above a first portion of the semiconductor substrate, and a plurality of power pads formed above the integrated circuit block; a first light emitting device formed above a second portion of the semiconductor substrate; and a through plug passing through the semiconductor substrate for electrically connecting the first control device and the first light emitting device.

    Abstract translation: 集成照明装置包括:第一控制装置,包括半导体衬底,形成在半导体衬底的第一部分上方的集成电路块;以及形成在集成电路块之上的多个电源焊盘; 形成在所述半导体衬底的第二部分上方的第一发光器件; 以及穿过所述半导体基板的贯穿插头,用于电连接所述第一控制装置和所述第一发光装置。

    MANUFACTURING METHOD OF LIGHT-EMITTING DEVICE AND LIGHT MIXING DEVICE
    19.
    发明申请
    MANUFACTURING METHOD OF LIGHT-EMITTING DEVICE AND LIGHT MIXING DEVICE 有权
    发光装置和光混合装置的制造方法

    公开(公告)号:US20140034988A1

    公开(公告)日:2014-02-06

    申请号:US14047778

    申请日:2013-10-07

    Abstract: Disclosed is a light-emitting device comprising: a carrier; a light-emitting element disposed on the carrier; a first light guide layer covering the light-emitting element; a second light guide layer covering the first light guide layer; a low refractive index layer between the first light guide layer and the second light guide layer to reflect the light from the second light guide layer; and a wavelength conversion layer covering the second light guide layer; wherein the low refractive index layer has a refractive index smaller than one of the refractive indices of first light guide layer and the second light guide layer.

    Abstract translation: 公开了一种发光装置,包括:载体; 设置在所述载体上的发光元件; 覆盖所述发光元件的第一导光层; 覆盖所述第一导光层的第二导光层; 第一导光层和第二导光层之间的低折射率层,以反射来自第二导光层的光; 以及覆盖所述第二导光层的波长转换层; 其中所述低折射率层的折射率小于所述第一导光层和所述第二导光层的折射率之一。

    LIGHT-EMITTING DEVICE
    20.
    发明申请
    LIGHT-EMITTING DEVICE 有权
    发光装置

    公开(公告)号:US20130341667A1

    公开(公告)日:2013-12-26

    申请号:US14011502

    申请日:2013-08-27

    Abstract: A light-emitting device includes a semiconductor light-emitting stack; a current injected portion formed on the semiconductor light-emitting stack; an extension portion having a first branch radiating from the current injected portion and a second branch extending from the first branch; an electrical contact structure between the second branch and the semiconductor light-emitting stack and having a first width; and a current blocking structure located right beneath the electrical contact structure and having a second width larger than the first width.

    Abstract translation: 发光装置包括半导体发光叠层; 形成在半导体发光叠层上的电流注入部分; 具有从所述电流注入部分辐射的第一分支的延伸部分和从所述第一分支延伸的第二分支; 所述第二分支和所述半导体发光叠层之间的电接触结构具有第一宽度; 以及位于电接触结构正下方并且具有大于第一宽度的第二宽度的电流阻挡结构。

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