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公开(公告)号:USD818974S1
公开(公告)日:2018-05-29
申请号:US29570832
申请日:2016-07-12
Applicant: EPISTAR CORPORATION
Designer: Hui-Fang Kao , Tzu-Chieh Hsu , Yao-Ning Chan , Yi-Ming Chen
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公开(公告)号:US09337394B2
公开(公告)日:2016-05-10
申请号:US14554488
申请日:2014-11-26
Applicant: Epistar Corporation
Inventor: Yi-Ming Chen , Chun-Yu Lin , Tsung-Hsien Yang , Tzu-Chieh Hsu , Kun-De Lin , Yao-Ning Chan , Chih-Chiang Lu
CPC classification number: H01L33/382 , H01L33/08 , H01L33/22 , H01L33/46
Abstract: A semiconductor light-emitting device comprises a semiconductor stack comprising a side, a first surface and a second surface opposite to the first surface, wherein the semiconductor stack further comprises a conductive via extending from the first surface to the second surface; a transparent conductive layer formed on the second surface; a first pad portion and a second pad portion formed on the first surface and electrically connected to the semiconductor stack; and an insulating layer formed between the first pad portion and the semiconductor stack and between the second pad portion and the semiconductor stack.
Abstract translation: 半导体发光器件包括半导体叠层,其包括侧面,第一表面和与第一表面相对的第二表面,其中半导体堆叠还包括从第一表面延伸到第二表面的导电通孔; 形成在所述第二表面上的透明导电层; 第一焊盘部分和第二焊盘部分,形成在第一表面上并电连接到半导体堆叠; 以及形成在第一焊盘部分和半导体堆叠之间以及在第二焊盘部分和半导体堆叠之间的绝缘层。
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公开(公告)号:USD1062026S1
公开(公告)日:2025-02-11
申请号:US29858208
申请日:2022-10-28
Applicant: EPISTAR CORPORATION
Designer: Hui-Fang Kao , Yao-Ning Chan , Yi-Tang Lai , Yun-Chung Chou , Shih-Chang Lee , Chen Ou
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公开(公告)号:USD944218S1
公开(公告)日:2022-02-22
申请号:US29798333
申请日:2021-07-07
Applicant: EPISTAR CORPORATION
Designer: Hui-Fang Kao , Yao-Ning Chan , Hao-Chun Liang , Shih-Chang Lee
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公开(公告)号:USD928104S1
公开(公告)日:2021-08-17
申请号:US29679564
申请日:2019-02-07
Applicant: EPISTAR CORPORATION
Designer: Hui-Fang Kao , Yao-Ning Chan , Hao-Chun Liang , Shih-Chang Lee
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公开(公告)号:USD894850S1
公开(公告)日:2020-09-01
申请号:US29673162
申请日:2018-12-12
Applicant: EPISTAR CORPORATION
Designer: Chun-Fu Tsai , Yao-Ning Chan , Yi-Tang Lai , Yi-Ming Chen , Shih-Chang Lee
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公开(公告)号:US10461223B2
公开(公告)日:2019-10-29
申请号:US16128604
申请日:2018-09-12
Applicant: EPISTAR CORPORATION
Inventor: Yung-Fu Chang , Hsin-Chan Chung , Hung-Ta Cheng , Wen-Luh Liao , Shih-Chang Lee , Chih-Chiang Lu , Yi-Ming Chen , Yao-Ning Chan , Chun-Fu Tsai
Abstract: A semiconductor device includes a semiconductor stack comprising a surface, and an electrode structure comprises an electrode pad formed on the surface, and the electrode structure further comprises a first extending electrode, a second extending electrode and a third extending electrode connecting to the electrode pad. The first extending electrode is closer to a periphery of the surface than the third extending electrode is, and the second extending electrode is between the first extending electrode and the third extending electrode. From a top view of the semiconductor device, the first extending electrode, the second extending electrode and the third extending electrode respectively include a first curve having a first angle θ1, a second curve having a second angle θ2 and a third curve having a third angle θ3, wherein θ3>θ2>θ1 .
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公开(公告)号:USD1040117S1
公开(公告)日:2024-08-27
申请号:US29915273
申请日:2023-10-27
Applicant: EPISTAR CORPORATION
Designer: Yao-Ning Chan , Tzu-Yun Feng , Yun-Ya Chang
Abstract: FIG. 1 is a perspective view of a light-emitting diode device showing our new design;
FIG. 2 is a front elevational view thereof;
FIG. 3 is a rear elevational view thereof;
FIG. 4 is a left side elevational view thereof;
FIG. 5 is a right side elevational view thereof;
FIG. 6 is a top plan view thereof; and,
FIG. 7 is a bottom plan view thereof.
The broken line showing is for the purpose of illustrating environmental structure only and forms no part of the claimed design.-
公开(公告)号:US12002906B2
公开(公告)日:2024-06-04
申请号:US17406521
申请日:2021-08-19
Applicant: EPISTAR CORPORATION
Inventor: Hao-Chun Liang , Wei-Shan Yeoh , Yao-Ning Chan , Yi-Ming Chen , Shih-Chang Lee
IPC: H01L33/44 , H01L31/02 , H01L31/0216 , H01L31/0352 , H01L33/20 , H01L33/46 , H01L33/62 , H01L31/0224 , H01L33/38
CPC classification number: H01L33/44 , H01L31/02005 , H01L31/02161 , H01L31/035272 , H01L33/20 , H01L33/46 , H01L33/62 , H01L31/022408 , H01L33/38
Abstract: The present disclosure provides a semiconductor device and a semiconductor component. The semiconductor device includes an active structure, a ring-shaped semiconductor contact layer, a first electrode, and an insulating layer. The active structure has a first-conductivity-type semiconductor layer, a second-conductivity-type semiconductor layer, and an active layer located between the first-conductivity-type semiconductor layer and the second-conductivity-type semiconductor layer. The ring-shaped semiconductor contact layer is located on the second-conductivity-type semiconductor layer and having a first inner sidewall and a first outer sidewall. The first electrode has an upper surface and covers the ring-shaped semiconductor contact layer. The insulating layer covers the first electrode and the active structure and has a second inner sidewall and a second outer sidewall. The first inner sidewall is not flush with the second inner sidewall in a vertical direction.
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公开(公告)号:USD972769S1
公开(公告)日:2022-12-13
申请号:US29776714
申请日:2021-03-31
Applicant: EPISTAR CORPORATION
Designer: Hui-Fang Kao , Yao-Ning Chan , Yi-Tang Lai , Yun-Chung Chou , Shih-Chang Lee , Chen Ou
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