中科微点-全球专利检索

  1. Login
  2. Sign Up

Search Results

35 records (took 0.03 seconds)

    STRETCHABLE PRINTED ELECTRONIC SHEETS TO ELECTRICALLY CONNECT UNEVEN TWO DIMENSIONAL AND THREE DIMENSIONAL SURFACES
    11.
    发明申请
    STRETCHABLE PRINTED ELECTRONIC SHEETS TO ELECTRICALLY CONNECT UNEVEN TWO DIMENSIONAL AND THREE DIMENSIONAL SURFACES 有权
    可拉紧打印的电子表，以电连接两个尺寸和三维表面

    公开(公告)号：US20160157363A1

    公开(公告)日：2016-06-02

    申请号：US14558357

    申请日：2014-12-02

    Applicant: FLEXTRONICS AP, LLC

    Inventor： Anwar Mohammed ,  Weifeng Liu ,  Murad Kurwa

    IPC: H05K3/46 ,  H05K1/02 ,  H05K3/12

    CPC classification number: H05K1/0283 ,  B29C65/72 ,  B29L2031/3425 ,  H05K1/028 ,  H05K1/0284 ,  H05K1/0296 ,  H05K1/092 ,  H05K3/0058 ,  H05K3/125 ,  H05K3/20 ,  H05K2201/0133 ,  H05K2201/0323

    Abstract: A method and apparatus for forming a conductor on an uneven two-dimensional (2-D) or three-dimensional (3-D) surface is described. An amount of conductive material needed to form a conductor between two points on a surface of an object is determined. The determined amount of conductive material is deposited on a substrate. The substrate with the deposited conductive material is applied to the object to form a conductor between the two points on the surface of the object. The conductive material and substrate may be stretchable. The conductive material may be deposited by an inkjet printer or an embedded 3-D printer. The substrate with the deposited conductive material may be applied to the object by laminating the substrate with the deposited conductive material to the object.

    Abstract translation: 描述了在不均匀的二维（2-D）或三维（3-D）表面上形成导体的方法和装置。 确定在物体表面上的两个点之间形成导体所需的导电材料的量。 将确定量的导电材料沉积在基底上。 将具有沉积的导电材料的基板施加到物体上以在物体的表面上的两个点之间形成导体。 导电材料和基底可以是可拉伸的。 导电材料可以由喷墨打印机或嵌入式三维打印机进行沉积。 具有沉积的导电材料的衬底可以通过将衬底与沉积的导电材料层压到物体上而被施加到物体。

    Method of making copper pillar with solder cap
    16.
    发明授权
    Method of making copper pillar with solder cap 有权

    公开(公告)号：US09674952B1

    公开(公告)日：2017-06-06

    申请号：US14482977

    申请日：2014-09-10

    Applicant: Flextronics AP, LLC

    Inventor： Weifeng Liu ,  Anwar Mohammed ,  Zhen Feng

    IPC: H05K1/09 ,  H05K1/11 ,  H05K3/40

    CPC classification number: H05K1/092 ,  H05K3/125 ,  H05K3/247 ,  H05K3/4007

    Abstract: An electrical interconnect includes a copper pillar and solder cap. The copper pillar and solder cap are formed onto a contact pad or an under bump metallurgy (UBM). In some applications, the contact pad or UBM is part of an electronic component, such as a semiconductor chip. In other cases, the contact pad is part of laminated substrate, such as a printed circuit board (PCB), or a ceramic substrate. The copper pillar and the solder cap are printed using an ink printer, such as an aerosol ink jet printer. A post heat treatment solidifies the interconnection between the contact pad or UBM, the copper pillar and the solder cap.

    Stretchable conductor design and methods of making
    17.
    发明授权
    Stretchable conductor design and methods of making 有权
    伸缩导体的设计和制作方法

    公开(公告)号：US09554465B1

    公开(公告)日：2017-01-24

    申请号：US14593849

    申请日：2015-01-09

    Applicant: Flextronics AP, LLC

    Inventor： Weifeng Liu ,  Anwar Mohammed ,  Dick Pang ,  Murad Kurwa

    IPC: H05K1/09 ,  H05K1/02 ,  H05K1/03

    CPC classification number: H05K1/092 ,  H05K1/0283 ,  H05K1/03 ,  H05K1/0393 ,  H05K1/147 ,  H05K1/183 ,  H05K3/285 ,  H05K2201/0133 ,  H05K2201/0162 ,  H05K2201/09218 ,  H05K2201/09227 ,  H05K2201/09263 ,  H05K2201/09281

    Abstract: A stretchable interconnect includes a plurality of electrically conductive traces formed as a complex pattern on an elastic substrate. The form of the electrically conductive traces is such that when the elastic substrate is in a relaxed, or non-stretched, state each of the electrically conductive traces forms a tortuous path, such as a waveform, along the elastic substrate. The tortuous path of the electrically conductive traces provides slack such that as the elastic substrate is stretched the slack is taken up. Once released, the elastic substrate moves from the stretched position to the relaxed, non-stretched position, and slack is reintroduced into the electrically conductive traces in the form of the original tortuous path.

    Abstract translation: 可拉伸互连件包括在弹性基底上形成为复合图案的多个导电迹线。 导电迹线的形式使得当弹性基底处于松弛或非拉伸状态时，每个导电迹线沿着弹性基底形成诸如波形的曲折路径。 导电迹线的弯曲路径提供松弛，使得当弹性基底被拉伸时松弛松弛。 一旦释放，弹性基板从拉伸位置移动到松弛的非拉伸位置，并且以原始曲折路径的形式将松弛重新引入导电迹线。

    Stretchable metal wire assembly using elastic tube
    18.
    发明授权
    Stretchable metal wire assembly using elastic tube 有权
    伸缩金属丝组件使用弹性管

    公开(公告)号：US09378864B1

    公开(公告)日：2016-06-28

    申请号：US14191170

    申请日：2014-02-26

    Applicant: Flextronics AP, LLC

    Inventor： Weifeng Liu ,  Anwar Mohammed ,  Murad Kurwa

    IPC: H01B7/04 ,  H01B7/06 ,  H02G9/06

    CPC classification number: H01B7/04 ,  H01B7/06 ,  H01L23/49811 ,  H01L23/5387 ,  H01L2924/0002 ,  H01R4/58 ,  H01R13/22 ,  H01R13/28 ,  H01L2924/00

    Abstract: A stretchable metal wire assembly includes a metal wire positioned within an elastic tube. The form of the metal wire is such that when the elastic tube is in a relaxed, or non-stretched, state the metal wire forms a tortuous path, such as a waveform, along the elastic tube. The tortuous path of the metal wire provides slack such that as the elastic tube is stretched the slack is taken up. Once released, the elastic tube moves from the stretched position to the relaxed, non-stretched position, and slack is reintroduced into the metal wire in the form of the original tortuous path. The metal wire functions as an electrical conductor, thereby providing a device having an extendable length electrical conducting element. In some applications, the metal wire is electrically coupled at each end to an electrical interconnect component.

    Abstract translation: 一种可拉伸的金属丝组件包括一个位于弹性管内的金属线。 金属丝的形式使得当弹性管处于松弛或非拉伸状态时，金属丝沿着弹性管形成诸如波形的曲折路径。 金属线的弯曲路径提供松弛，使得当弹性管被拉伸时，松弛被吸收。 一旦释放，弹性管从拉伸位置移动到松弛的非拉伸位置，并且以原始曲折路径的形式将松弛重新引入金属丝。 金属线用作电导体，从而提供具有可延伸长度导电元件的装置。 在一些应用中，金属线在每一端电耦合到电互连部件。

    Electronic circuit slidable interconnect
    19.
    发明授权
    Electronic circuit slidable interconnect 有权
    电子电路可滑动互连

    公开(公告)号：US09231327B1

    公开(公告)日：2016-01-05

    申请号：US14145801

    申请日：2013-12-31

    Applicant: Flextronics AP, LLC

    Inventor： Weifeng Liu ,  Anwar Mohammed ,  Murad Kurwa

    IPC: H01R13/28 ,  H01R25/00 ,  H01R13/22

    CPC classification number: H01B7/04 ,  H01B7/06 ,  H01L23/49811 ,  H01L23/5387 ,  H01L2924/0002 ,  H01R4/58 ,  H01R13/22 ,  H01R13/28 ,  H01L2924/00

    Abstract: An electronic circuit interconnect apparatus that includes two zipper tracks configured to zip together thereby causing a first circuit to electrically couple with a second circuit. Specifically, each of the zipper tracks include a plurality of teeth, one or more of which are electrically coupled to the first circuit or the second circuit. As a result, when the teeth coupled to the first circuit are zipped to the teeth coupled to the second circuit it causes the first and second circuits to be electrically coupled.

    Abstract translation: 一种电子电路互连装置，其包括两个拉链轨道，所述拉链轨道配置成拉链在一起，从而使第一电路与第二电路电耦合。 具体地，每个拉链轨道包括多个齿，其中一个或多个电耦合到第一电路或第二电路。 结果，当耦合到第一电路的齿被拉链到与第二电路耦合的齿时，它使第一和第二电路电耦合。

Patent Agency Ranking