公开(公告)号：DE602005002683T2

公开(公告)日：2008-07-17

申请号：DE602005002683

申请日：2005-06-07

Applicant: GEN ELECTRIC

Inventor： BERKCAN ERTUGRUL ,  KAPUSTA CHRISTOPHER JAMES ,  CLAYDON GLENN SCOTT ,  ZRIBI ANIS ,  MEYER LAURA JEAN ,  TIAN WEI-CHENG

IPC: G01R33/028 ,  G01R15/20

Abstract: A micro-electromechanical system, MEMS, current sensor is described as including a first conductor, a magnetic field shaping component (5) for shaping a magnetic field (20) produced by a current (I) in the first conductor, and a MEMS-based magnetic field sensing component (25) including a magneto-MEMS component (30) for sensing the shaped magnetic field and, in response thereto, providing an indication (80) of the current in the first conductor. A method for sensing a current using MEMS is also described as including shaping a magnetic field produced with a current in a first conductor, sensing the shaped magnetic field with a MEMS-based magnetic field sensing component having a magneto-MEMS component magnetic field sensing circuit, and providing an indication of the current in the first conductor.

公开(公告)号：CA2939742A1

公开(公告)日：2017-02-28

申请号：CA2939742

申请日：2016-08-18

Applicant: GEN ELECTRIC

Inventor： KAPUSTA CHRISTOPHER JAMES ,  AIMI MARCO FRANCESCO

IPC: H01L49/00 ,  G01D5/48 ,  G01L3/06 ,  H01L23/29

Abstract: In one embodiment, a bonded quartz wafer package includes a first quartz wafer including at least one quartz-based device, a second quartz wafer disposed above the first quartz wafer, and a liquid crystal polymer (LCP) bonding layer disposed in between the first and second quartz wafers that bonds the first and second quartz wafers together.

公开(公告)号：DE60321702D1

公开(公告)日：2008-07-31

申请号：DE60321702

申请日：2003-10-20

Applicant: GEN ELECTRIC

Inventor： SAIA RICHARD JOSEPH ,  GORCZYCA THOMAS BERT ,  KAPUSTA CHRISTOPHER JAMES ,  BALCH ERNEST WAYNE ,  CLAYDON GLENN SCOTT ,  DASGUPTA SAHMITA ,  DELGADO ELADIO CLEMENTE

IPC: G02B6/43 ,  G02B6/12 ,  G02B6/122 ,  G02B6/138 ,  G02B6/42

Abstract: An optoelectronic package is fabricated by a method which includes: positioning an optical device within a window of a substrate active-side up and below a top substrate surface; filling the window with an optical polymer material; planarizing surfaces of the optical polymer material and the substrate; patterning waveguide material over the optical polymer material and the substrate to form an optical interconnection path; and to form a mirror to reflect light from the optical device to the interconnection path; and forming a via to expose a bond pad of the optical device.

公开(公告)号：DE602005002683D1

公开(公告)日：2007-11-15

申请号：DE602005002683

申请日：2005-06-07

Applicant: GEN ELECTRIC

Inventor： BERKCAN ERTUGRUL ,  KAPUSTA CHRISTOPHER JAMES ,  CLAYDON GLENN SCOTT ,  ZRIBI ANIS ,  MEYER LAURA JEAN ,  TIAN WEI-CHENG

IPC: G01R33/028 ,  G01R15/20

Abstract: A micro-electromechanical system, MEMS, current sensor is described as including a first conductor, a magnetic field shaping component (5) for shaping a magnetic field (20) produced by a current (I) in the first conductor, and a MEMS-based magnetic field sensing component (25) including a magneto-MEMS component (30) for sensing the shaped magnetic field and, in response thereto, providing an indication (80) of the current in the first conductor. A method for sensing a current using MEMS is also described as including shaping a magnetic field produced with a current in a first conductor, sensing the shaped magnetic field with a MEMS-based magnetic field sensing component having a magneto-MEMS component magnetic field sensing circuit, and providing an indication of the current in the first conductor.

公开(公告)号：AU2003284300A1

公开(公告)日：2004-05-13

申请号：AU2003284300

申请日：2003-10-20

Applicant: GEN ELECTRIC

Inventor： SAIA RICHARD JOSEPH ,  GORCZYCA THOMAS BERT ,  KAPUSTA CHRISTOPHER JAMES ,  BALCH ERNEST WAYNE ,  CLAYDON GLENN SCOTT ,  DASGUPTA SAHMITA ,  DELGADO ELADIO CLEMENTE

IPC: G02B6/12 ,  G02B6/122 ,  G02B6/138 ,  G02B6/42 ,  G02B6/00

Abstract: An optoelectronic package is fabricated by a method which includes: positioning an optical device within a window of a substrate active-side up and below a top substrate surface; filling the window with an optical polymer material; planarizing surfaces of the optical polymer material and the substrate; patterning waveguide material over the optical polymer material and the substrate to form an optical interconnection path; and to form a mirror to reflect light from the optical device to the interconnection path; and forming a via to expose a bond pad of the optical device.

公开(公告)号：SG11201703295RA

公开(公告)日：2017-05-30

申请号：SG11201703295R

申请日：2015-10-27

Applicant: GEN ELECTRIC

Inventor： KAPUSTA CHRISTOPHER JAMES ,  AIMI MARCO FRANCESCO

IPC: G01R33/28 ,  G01R33/20

Abstract: A non-magnetic hermetic package includes walls that surround an open cavity, with a generally planar non-magnetic and metallic seal ring disposed in a continuous loop around upper edges of the walls; a sensitive component that is bonded within the cavity; and a non-magnetic lid that is sealed to the seal ring to close the cavity by a metallic seal.

公开(公告)号：CA2570880A1

公开(公告)日：2007-06-09

申请号：CA2570880

申请日：2006-12-08

Applicant: GEN ELECTRIC

Inventor： DUROCHER KEVIN MATTHEW ,  KAPUSTA CHRISTOPHER JAMES ,  GOODWIN STACEY JOY ,  BALCH ERNEST WAYNE

IPC: B23K26/36 ,  C23C14/34 ,  F28F3/12 ,  H01L23/34

Abstract: METHOD OF MAKING AN ELECTRONIC DEVICE COOLING SYSTEM A method of making an electronic device cooling system includes forming a thermally conductive layer (88) on an inner surface of the substrate (12) an d laser ablating the thermally conductive layer (88) to form microchannels.

公开(公告)号：FR2848062A1

公开(公告)日：2004-06-04

申请号：FR0313130

申请日：2003-11-07

Applicant: GEN ELECTRIC

Inventor： DUROCHER KEVIN MATTHEW ,  KAPUSTA CHRISTOPHER JAMES ,  ARIK MEHMET ,  SAIA RICHARD JOSEPH ,  MOELEKER PIET

IPC: H05K1/00 ,  H05K3/00 ,  H05K3/28 ,  H05K3/38 ,  H05K3/10 ,  H01L21/98 ,  H05K3/22

公开(公告)号：AU2003284300A8

公开(公告)日：2004-05-13

申请号：AU2003284300

申请日：2003-10-20

Applicant: GEN ELECTRIC

Inventor： SAIA RICHARD JOSEPH ,  BALCH ERNEST WAYNE ,  DASGUPTA SAHMITA ,  GORCZYCA THOMAS BERT ,  DELGADO ELADIO CLEMENTE ,  KAPUSTA CHRISTOPHER JAMES ,  CLAYDON GLENN SCOTT

IPC: G02B6/12 ,  G02B6/122 ,  G02B6/138 ,  G02B6/42 ,  G02B6/43

Abstract: An optoelectronic package is fabricated by a method which includes: positioning an optical device within a window of a substrate active-side up and below a top substrate surface; filling the window with an optical polymer material; planarizing surfaces of the optical polymer material and the substrate; patterning waveguide material over the optical polymer material and the substrate to form an optical interconnection path; and to form a mirror to reflect light from the optical device to the interconnection path; and forming a via to expose a bond pad of the optical device.