公开(公告)号：WO2020106295A1

公开(公告)日：2020-05-28

申请号：PCT/US2018/062302

申请日：2018-11-21

Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.

Inventor： CHEN, Chien-Hua ,  CUMBIE, Michael W. ,  CHOY, Si-lam J.

IPC: B41J2/175 ,  B41J2/145

Abstract: A curved fluid ejection device may include a plurality of fluid ejection dies overmolded with at least one layer of epoxy mold compound (EMC). Each of the fluid ejection dies and the EMC include a coefficient of thermal expansion (CTE). The combination of the CTE of the fluid ejection dies and the CTE of the at least one layer of EMC defines a curve within the curved fluid ejection device.

公开(公告)号：WO2019203780A1

公开(公告)日：2019-10-24

申请号：PCT/US2018/027690

申请日：2018-04-15

Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.

Inventor： FULLER, Anthony M. ,  CUMBIE, Michael W. ,  CHEN, Chien-Hua

IPC: H01L23/544

Abstract: A circuit die may include an outermost circuit layer having electrical transmission routing and an alignment target overlying the outermost circuit layer.

公开(公告)号：WO2019103744A1

公开(公告)日：2019-05-31

申请号：PCT/US2017/063107

申请日：2017-11-22

Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.

Inventor： HIGGINS, Adam ,  GOVYADINOV, Alexander ,  CUMBIE, Michael W.

IPC: B01L7/00 ,  B01L3/00 ,  C12Q1/68

Abstract: The present disclosure is drawn to temperature-cycling microfluidic devices. In one example, a temperature-cycling microfluidic device can include a driver chip having a top surface and a heat exchange substrate having a top surface coplanar with the top surface of the driver chip. A fluid chamber can be located on the top surface of the driver chip. A first and second microfluidic loop can have fluid driving ends and fluid outlet ends connected to the fluid chamber and can include portions thereof located on the top surface of the heat exchange substrate. A first and second fluid actuator can be on the driver chip. The first and second fluid actuators can be associated with the fluid driving ends of the first and second microfluidic loops, respectively, to circulate fluid through the first and second microfluidic loops.

公开(公告)号：WO2019103743A1

公开(公告)日：2019-05-31

申请号：PCT/US2017/063102

申请日：2017-11-22

Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.

Inventor： WHITE, Rachel M. ,  CUMBIE, Michael W. ,  DAALKHAIJAV, Uranbileg

IPC: B01L3/00 ,  B81B1/00 ,  G01N33/49

Abstract: The present disclosure is drawn to microfluidic devices for blood coagulation. The microfluidic device can include a substrate, a lid mounted to the substrate, and a microchip mounted to the substrate. The lid and substrate can form a discrete microfluidic chamber between structures including an interior surface of the lid and a portion of the substrate. The lid can also include an inlet and a vent positioned relative to one another to facilitate loading of a fluid to the discrete microfluidic chamber via capillary action. A portion of the microchip can include a blood coagulation component positioned within the discrete microfluidic chamber.

公开(公告)号：WO2019103729A1

公开(公告)日：2019-05-31

申请号：PCT/US2017/062925

申请日：2017-11-22

Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.

Inventor： ELY, Hilary ,  HIGGINS, Adam ,  WHITE, Rachel M. ,  TORNIAINEN, Erik D. ,  WOODFORD, Tod ,  CUMBIE, Michael W. ,  CHEN, Chien-Hua

IPC: B81B1/00 ,  B81B7/00 ,  G01N33/48

Abstract: The present disclosure is drawn to microfluidic devices. A microfluidic device can include a substrate, a lid mounted to the substrate, and a microchip mounted to the substrate. The lid mounted to the substrate can form a discrete microfluidic chamber between structures including an interior surface of the lid and a portion of the substrate. The lid can include an inlet and a vent positioned relative to one another to facilitate loading of fluid to the discrete microfluidic chamber via capillary action. A portion of the microchip can be positioned within the discrete microfluidic chamber.

公开(公告)号：WO2019089031A1

公开(公告)日：2019-05-09

申请号：PCT/US2017/059748

申请日：2017-11-02

Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.

Inventor： CHOY, Si-lam ,  CUMBIE, Michael W.

IPC: B41J2/045 ,  B41J2/175

CPC classification number: B41J2/17553 ,  B41J2/175 ,  B41J2/17513 ,  B41J2/1752 ,  B41J29/023 ,  B41J29/13

Abstract: A fluid ejection assembly includes a fluid ejection die, and a body supporting the fluid ejection die, with the body having a fluid chamber communicated with the fluid ejection die and including a receptacle to receive a removable fluid supply, with the receptacle having a fluid port communicated with the fluid chamber through the body.

公开(公告)号：WO2019045675A1

公开(公告)日：2019-03-07

申请号：PCT/US2017/048856

申请日：2017-08-28

Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.

Inventor： NIELSEN, Jeffrey A. ,  CUMBIE, Michael W. ,  CHEN, Chien-Hua

IPC: B41J2/01 ,  B41J2/175 ,  B01L3/00 ,  B81B3/00

Abstract: An apparatus includes a print head coupled to a substrate to dispense fluid from the substrate in response to a command. A reservoir coupled to the substrate transports the fluid to the print head. A preloaded storage container mounted on the reservoir stores the fluid and provides the fluid to the reservoir in response to pressure applied to the container.

公开(公告)号：WO2018194665A1

公开(公告)日：2018-10-25

申请号：PCT/US2017/028891

申请日：2017-04-21

Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.

Inventor： SHKOLNIKOV, Viktor ,  CUMBIE, Michael W. ,  CHEN, Chien-Hua

IPC: B01L3/00 ,  G01N1/00 ,  B81B7/02

Abstract: A microfluidic device is provided that includes a substrate and microfluidic sub-chips embedded in the substrate. An electric field is applied between an adjacent pair microfluidic sub-chips to move a fluid droplet from one of the adjacent pair of microfluidic sub-chips to another of the adjacent pair microfluidic sub-chips.

公开(公告)号：WO2018169514A1

公开(公告)日：2018-09-20

申请号：PCT/US2017/022237

申请日：2017-03-14

Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.

Inventor： CHEN, Chien-Hua ,  BOUCHER, William R. ,  CUMBIE, Michael W.

IPC: G01F23/24 ,  G01F23/26 ,  G01F23/284 ,  G01F23/22 ,  B41J2/175

Abstract: A liquid level sensor circuit for measuring a liquid level in the reservoir comprising two electrodes extending into the reservoir along at least part of a height of the reservoir down to a base of the reservoir, wherein the liquid level sensor circuit is arranged to have increased sensitivity near the base.

公开(公告)号：WO2018013136A1

公开(公告)日：2018-01-18

申请号：PCT/US2016/042542

申请日：2016-07-15

Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.

Inventor： CHEN, Chien-Hua ,  CUMBIE, Michael W. ,  MOUREY, Devin Alexander

IPC: G01N33/48 ,  B01D29/01 ,  B81B1/00

CPC classification number: B01L3/502753 ,  B01D29/01 ,  B01D29/012 ,  B01D29/03 ,  B01D29/56 ,  B01L3/502707 ,  B01L2200/0631 ,  B01L2300/0645 ,  B01L2300/0681 ,  B01L2300/0883 ,  B01L2300/0887 ,  B01L2400/0415 ,  B81B1/006 ,  B81B2201/10 ,  B81B2203/0338 ,  B81B2203/0353 ,  B81C1/00119 ,  B81C2201/0125 ,  B81C2201/013 ,  B81C2203/03

Abstract: A method may include etching a number of holes into a carrier wafer layer to form a plurality of filters in the carrier wafer layer, pattering a chamber layer over a first side of the carrier wafer layer to form chambers above each filter formed in the carrier wafer layer, forming a layer over the chamber layer, grinding a second side of the carrier wafer layer to expose the number of holes etched into the carrier wafer layer, and bonding a molded substrate to the carrier wafer layer opposite the chamber layer.

Abstract translation: 一种方法可以包括将多个孔蚀刻到载体晶圆层中以在载体晶圆层中形成多个滤波器，在载体晶圆层的第一侧上方形成腔体层以形成腔室 在形成于载体晶圆层中的每个滤波器上方，在腔体层上方形成层，研磨载体晶圆层的第二侧以暴露蚀刻到载体晶圆层中的多个孔，并且将模制衬底接合到载体晶圆层 与腔室层相对。