Abstract:
PROBLEM TO BE SOLVED: To provide a film and hard spacer type pellicle structure, where the area of X-ray mask is increased, the film and fitting material of an X-ray mask is enlarged in range, and precision in manufacture is improved. SOLUTION: An oxide layer is patterned on bulk spacer materials 12 and 13, having a thickness equal to the gap between an X-ray mask 1 and the oxide which is to be patterned. The oxide on the bulk spacer materials 12 and 13 prevents conversion of a part of wafer that functions as a spacer to the etching characteristics which differ from the bulk spacer materials 12 and 13 via the exposed surface of the wafer of bulk spacer materials 12 and 13. The wafer of exposed bulk spacer materials 12 and 13 functions as a spacer and is converted into a depth which protects the edge part. Then the oxide is removed. A film is made to adhere to the entire surface of the bulk spacer materials 12 and 13. The bulk wafer is removed as far as the converted part by utilizing the different etching characteristics which is provided.
Abstract:
Electronic devices having patterned electrically conductive polymers providing electrical connection thereto and methods of fabrication thereof are described. Liquid crystal display cells are described having at least one of the electrodes providing a bias across the liquid crystal material formed from a patterned electrically conductive polymer. Thin film transistors having patterned electrically conductive polymers as source drain and gate electrodes are described. Light emitting diodes having anode and coated regions formed from patterned electrically conductive polymers are described. Methods of patterning using a resist mask; patterning using a patterned metal layer; patterning the metal layer using a resist; and patterning the electrically conductive polymer directly to form electrodes and anode and cathode regions are described.
Abstract:
Inventive silsesquioxane polymers are provided, and resist compositions that contain such silsesquioxane polymers are provided in which at least a portion of the silsesquioxane polymer contains fluorinated moieties, and at least a portion of the silisesquioxane polymer contains pendant solubility inhibiting acid-labile moieties that have low activation energy for acid-catalyzed cleaving, and the presence of high optical density moieties are minimized or avoided. The inventive polymer also contains pendant polar moieties that promote alkaline solubility of the resist in aqueous alkaline solutions. The inventive polymers are particularly useful in positive resist compositions. The invention encompasses methods of using such resist compositions in forming a patterned structure on a substrate, and particularly multilayer (e.g. bilayer) photolithographic methods, which methods are capable of producing high resolution images at wavelengths such as 193nm and 157nm.
Abstract:
The resist compositions having an acid sensitive imaging polymer and a radiation sensitive acid generator component comprising: (i) a first radiation sensitive acid generator selected from the group consisting of dissolution-inhibiting acid generators, and (ii) a second radiation sensitive acid generator selected from the group consisting of unprotected acidic group-functionalized acid generators and acid labile group-protected acidic group-functionalized radiation sensitive acid generators; enables formation of high sensitivity resists suitable for use in EPL, EUV, soft x-ray, and other low energy intensity lithographic imaging applications. The resist compositions may be useful in other lithographic processes as well.
Abstract:
PROBLEM TO BE SOLVED: To provide silsesquioxane polymers and photoresist compositions that contain such silsesquioxane polymers. SOLUTION: At least a portion of the silsesquioxane polymer contains fluorinated moieties, and at least a portion of the silsesquioxane polymer contains pendant solubility inhibiting cyclic ketal acid-labile moieties that have low activation energy for acid-catalyzed cleaving. The inventive polymer also contains pendant polar moieties that promote alkaline solubility of the resist in aqueous alkaline solutions. The inventive polymers are particularly useful in positive photoresist compositions. The invention encompasses methods of using such photoresist compositions in forming a patterned structure on a substrate, and particularly multilayer (e.g., bilayer) photolithographic methods, which methods are capable of producing high resolution images at wavelengths such as 193 nm and 157 nm. COPYRIGHT: (C)2005,JPO&NCIPI
Abstract:
PROBLEM TO BE SOLVED: To provide a lithographic structure with plural layers including an RCHX layer containing a material of the formula R:C:H:X (where R is one selected from the group comprising Si, Ge, B, Sn, Fe, Ti and a mixture of these and X is absent or one selected from the group comprising O, N, S and F) as at least one layer and with a layer of an energy active material, a method for producing the structure and a method for utilizing the structure. SOLUTION: The RCHX layer is formed by vapor deposition, the energy active material is patterned to form a pattern and this pattern is transferred to the RCHX layer. The RCHX layer is useful as a hard mask layer, an antireflection layer and a hard mask/antireflection layer.
Abstract:
PROBLEM TO BE SOLVED: To provide a conductive polymer composition having a controlled pH, a structural body containing it and its manufacturing method. SOLUTION: This structural body has a surface and multiple layers on the surface; at least one of the multiple layers is formed from an energy sensitive material, at least one of other layers is formed from a conductive polymer, and this conductive polymer contains an acid functional group and has a predetermined pH. The pH is controlled by an additive agent mixed into the conductive polymer or a constituent of the conductive polymer. The conductive polymer is preferably the top layer. The structural body can avoid the influence of charge due to electron beams on a resist in fabricating microelectronics and is useful for lithography. This composition is also useful for application examples such as static discharge, electromagnetic interference shielding, corrosion prevention, electroplating and wiring.
Abstract:
PROBLEM TO BE SOLVED: To provide an electric charge-vanishing polymer film and a method for bringing the film to be electric charge-vanishing in the situation. SOLUTION: This electric charge-vanishing film can be used as resists for nondestructive SEM measurements, electron beam lithographies and ESD- protecting coatings for electronic parts/products. The method for bringing the polymer film to be electric charge-vanishing consists of a process for laying a polymer having ionic functional groups on the surface and a process for treating the surface with a first chemical substance to bring the ionic functional groups to an ionized state. The surface can be brought back to a nonionized state by exposing the ionized surface to charged beams or electrostatic charges, then exposing the ionized surface to a second chemical substance.
Abstract:
PROBLEM TO BE SOLVED: To provide a resist composition comprising an acid-sensitive imaging polymer and a radiation-sensitive acid generator component. SOLUTION: The resist composition contains (i) a first radiation-sensitive acid generator selected from the group consisting of dissolution inhibiting acid generators and (ii) a second radiation-sensitive acid generator selected from the group consisting of unprotected acidic group-functionalized acid generators and acid labile group protected acidic group-functionalized radiation-sensitive acid generators, and enables formation of a highly sensitive resist suitable for use in EPL or EUV, soft X-ray and another low energy intensity lithographic imaging applications. The resist composition is useful in other lithography processes as well. COPYRIGHT: (C)2007,JPO&INPIT
Abstract:
PROBLEM TO BE SOLVED: To provide a chemically unamplified new negative type gradiation photoresist having high resolution and high sensitivity and developable in water or in an aqueous solution. SOLUTION: Based on the rearrangement of a carbon-oxygen bond in pendant ester group of the polymer, the (photo)resist crosslinks polymer chains and does not require the addition of a supplemental photocatalyst, a photoinitiator or a crosslinking agent.