Abstract:
The resist compositions having an acid sensitive imaging polymer and a radiation sensitive acid generator component comprising: (i) a first radiation sensitive acid generator selected from the group consisting of dissolution-inhibiting acid generators, and (ii) a second radiation sensitive acid generator selected from the group consisting of unprotected acidic group-functionalized acid generators and acid labile group-protected acidic group-functionalized radiation sensitive acid generators; enables formation of high sensitivity resists suitable for use in EPL, EUV, soft x-ray, and other low energy intensity lithographic imaging applications. The resist compositions may be useful in other lithographic processes as well.
Abstract:
Resist compositions having good footing properties even on difficult substrates are obtained by using a combination of base additives including a room temperature solid base, and a liquid low vapor pressure base. The compositions are especially useful on metal substrates such as chromium-containing layers commonly used in mask-making.
Abstract:
PROBLEM TO BE SOLVED: To provide a chemical amplification resist exhibiting improved preservability of a resist coating and almost or completely free from the effect of vacuum in use by incorporating an aq. base-soluble polymer or copolymer having polar functional groups, a part of which is protected with specified cycloaliphatic ketal substituents. SOLUTION: The chemical amplification resist contains an aq. base-soluble polymer or copolymer having polar functional groups, some of which are protected with cycloaliphatic ketal substituents represented by the formula RO-X-as acid decomposable protective groups, an acid generating agent, a solvent for the base-soluble polymer or copolymer, a base and, optionally, a surfactant. In the formula, X is an about 3-12C optionally substd. cycloaliphatic functional group and R is about 1-12C linear or branched alkyl or the like. COPYRIGHT: (C)1999,JPO
Abstract:
PROBLEM TO BE SOLVED: To obtain a resist composition, having responsiveness to imaging irradiation and enhanced resistance to reactive ion etching by incorporating a radiation sensitive polymer and an organometallic compound of a specified metal. SOLUTION: This resist composition contains a radiation responsive polymer and an organometallic compound of a metal selected from among the group comprising yttrium, aluminum, iron, titanium, zirconium, hafnium and a mixture of these. The organometallic compound is, e.g. yttrium trishexafluoroacetylacetonate or yttrium tris(2,2,6,6-tetramethyl)-3,5-heptanedioate and the amount of the organometallic compound used is about 0.1-25 wt.% of the weight of the radiation sensitive polymer. The organometallic compound may be used in combination with various resist polymers including a chemically amplified resist and a non-chemically amplified resist.
Abstract:
Resist compositions having good footing properties even on difficult substrates are obtained by using a combination of base additives including a room temperature solid base, and a liquid low vapor pressure base. The compositions are especially useful on metal substrates such as chromium-containing layers commonly used in mask-making.
Abstract:
The resist compositions having an acid sensitive imaging polymer and a radiation sensitive acid generator component comprising: (i) a first radiation sensitive acid generator selected from the group consisting of dissolution-inhibiting acid generators, and (ii) a second radiation sensitive acid generator selected from the group consisting of unprotected acidic group-functionalized acid generators and acid labile group-protected acidic group-functionalized radiation sensitive acid generators; enables formation of high sensitivity resists suitable for use in EPL, EUV, soft x-ray, and other low energy intensity lithographic imaging applications. The resist compositions may be useful in other lithographic processes as well.
Abstract:
PROBLEM TO BE SOLVED: To provide a resist composition comprising an acid-sensitive imaging polymer and a radiation-sensitive acid generator component. SOLUTION: The resist composition contains (i) a first radiation-sensitive acid generator selected from the group consisting of dissolution inhibiting acid generators and (ii) a second radiation-sensitive acid generator selected from the group consisting of unprotected acidic group-functionalized acid generators and acid labile group protected acidic group-functionalized radiation-sensitive acid generators, and enables formation of a highly sensitive resist suitable for use in EPL or EUV, soft X-ray and another low energy intensity lithographic imaging applications. The resist composition is useful in other lithography processes as well. COPYRIGHT: (C)2007,JPO&INPIT
Abstract:
PROBLEM TO BE SOLVED: To prevent interaction between a photoresist layer and an immersion fluid in a immersion lithography system and to prevent contaminants in the immersion fluid from contaminating an integrated circuit being fabricated. SOLUTION: The method for forming an image in a photoresist layer includes: a step of providing a substrate; a step (S12) of forming a photoresist layer over the substrate; a step (S16) of forming a contamination gettering topcoat layer over the photoresist layer, the contamination gettering topcoat layer including contains one or more polymers and one or more cation complexing agents; a step of exposing the photoresist layer to actinic radiation; and a step of removing an exposed region of the photoresist layer or an unexposed region of the photoresist layer. The contamination gettering topcoat layer includes one or more polymers, one or more cation complexing agents, and a casting solvent. COPYRIGHT: (C)2007,JPO&INPIT
Abstract:
PROBLEM TO BE SOLVED: To provide a chemically unamplified new negative type gradiation photoresist having high resolution and high sensitivity and developable in water or in an aqueous solution. SOLUTION: Based on the rearrangement of a carbon-oxygen bond in pendant ester group of the polymer, the (photo)resist crosslinks polymer chains and does not require the addition of a supplemental photocatalyst, a photoinitiator or a crosslinking agent.