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公开(公告)号：GB2402100A
公开(公告)日：2004-12-01
申请号：GB0417609
申请日：2001-05-03
Applicant: IBM
Inventor： CHAN BENSON , FORTIER PAUL F , GUINDON FRANCOIS M , JOHNSON GLEN W , LETOURNEAU MARTIAL A , SHERMAN JOHN H , TETREAULT REAL
Abstract: To mould an overmould 18 onto the surface of a substrate 19, the substrate is provided with two concave recesses 86 which interengage with pins 88 upstanding from the base 80 of a mould. The radius of curvature of the recesses 86 is greater than the radius of curvature of the pins 88 so that the recesses engage with the pins along a line of contact which allows accurate alignment of the substrate with the base of the mould. The recesses are biased to engage with the pins by the action of a tapered surface 89 of a plunger 90 as a top mould (92, Fig 13) is positioned over the base, and resin is then injected into the mould cavity through an inlet comprising a first sub-assembly 26 of electrical components on the substrate 19 and an optoelectronic receiver 20 and transmitter 22 mounted as a second subassembly 36 which engages with the overmould. The second sub-assembly has two pins which are a press fit respectively in a moulded slot hole 43 having two opposing sides and a moulded trilobe hole 44 having three sidewalls in a platform 38 of the overmould to locate the second sub-assembly accurately. The sub-assemblies 26, 36 are subsequently secured together by adhesive.
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公开(公告)号：GB2370012A
公开(公告)日：2002-06-19
申请号：GB0110833
申请日：2001-05-03
Applicant: IBM
Inventor： CHAN BENSON , FORTIER PAUL F , GUINDON FRANCOIS M , JOHNSON GLEN W , LETOURNEAU MARTIAL A , SHERMAN JOHN H , TETREAULT REAL
Abstract: To mould an overmould 18 onto the surface of a substrate 19, the substrate is provided with two concave recesses 86 which interengage with pins 88 upstanding from the base 80 of a mould. The radius of curvature of the recesses 86 is greater than the radius of curvature of the pins 88 so that the recesses engage with the pins along a line of contact which allows accurate alignment of the substrate with the base of the mould. The recesses are biassed to engage with the pins by the action of a tapered surface 89 of a plunger 90 as a top mould 92 is positioned over the base, and resin is then injected into the mould cavity through an inlet passage 97 and a gate 98. The overmould 18 is part of an optoelectronic transceiver module comprising a first sub-assembly 26 of electrical components on the substrate 19 and an optoelectronic receiver 20 and transmitter 22 mounted as a second sub-assembly 36 which engages with the overmould. The second sub-assembly has two pins which are a press fit respectively in a moulded slot hole 43 having two opposing sides and a moulded trilobe hole 44 having three sidewalls in a platform 38 of the overmould to locate the second sub-assembly accurately. The sub-assemblies 26, 36 are subsequently secured together by adhesive. Leads from the sub-assembly 36 are then secured to pads 60,61 in a cavity 58 in the overmould.
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公开(公告)号：DE10065034A1
公开(公告)日：2001-08-09
申请号：DE10065034
申请日：2000-12-23
Applicant: IBM
Inventor： CHAN BENSON , COHEN MITCHELL S , FORTIER PAUL F , FREITAG LADD W , HALL RICHARD R , JOHNSON GLEN W , LIN HOW TZU , SHERMAN JOHN H
Abstract: The module is operatively connected to a host card, and includes a laminate for carrying optoelectronic components, an amplifier chip and a flexible circuit for receiving the amplified electrical signals from the amplifier chip. An optoelectronic chip is electrically connected to the flexible circuit and receives the amplified electrical signals generated by the amplifier chip, and produces optical signals in response. Independent claims are included for an optoelectronic sub-module, a compact module article, a transmitting optoelectric sub-module, an electronic compact sub-module, and a method of coupling a fibre-optical cable to a converter chip.
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