-
公开(公告)号:AU2003301975A1
公开(公告)日:2004-06-03
申请号:AU2003301975
申请日:2003-11-07
Applicant: IBM
Inventor: POGGE BERNHARD , DESPONT MICHEL , DRECHSLER UTE , PRASAD CHANDRIKA , VETTIGER PETER , YU ROY
IPC: B81C3/00 , H01L21/768
Abstract: A vertically integrated structure includes a micro-electromechanical system (MEMS) and a chip for delivering signals to the MEMS. The structure includes a metal stud connecting a surface of the chip and the MEMS; the MEMS has an anchor portion having a conducting pad on an underside thereof contacting the metal stud. The MEMS is spaced from the chip by a distance corresponding to a height of the metal stud, and the MEMS includes a doped region in contact with the conducting pad. In particular, the MEMS may include a cantilever structure, with the end portion including a tip extending in the vertical direction. A support structure (e.g. of polyimide) may surround the metal stud and contact both the underside of the MEMS and the surface of the chip. A temporary carrier plate is used to facilitate handling of the MEMS and alignment to the chip.
-
公开(公告)号:GB2489186A
公开(公告)日:2012-09-19
申请号:GB201213155
申请日:2011-03-29
Applicant: IBM
Inventor: DESPONT MICHEL
IPC: H01H59/00
Abstract: The present invention provides an integrated electro -mechanical actuator and a manufacturing method for manufacturing such an integrated electro-mechanical actuator. The integrated electro-mechanical actuator comprises an electrostatic actuator gap between actuator electrodes and an electrical contact gap between contact electrodes. An inclination with an inclination angle is provided between the actuator electrodes and the contact electrodes. The thickness of this electrical contact gap is equal to the thickness of a sacrificial layer which is etched away in a manufacturing process.
-
公开(公告)号:AT514049T
公开(公告)日:2011-07-15
申请号:AT02781555
申请日:2002-11-21
Applicant: IBM
Inventor: CROSS GRAHAM , DESPONT MICHEL , DUERIG URS , GENOLET GREGOIRE , SCHLITTLER RETO , VETTIGER PETER
Abstract: A method for forming a microstructures is described. The method comprises: depositing a seed material on a substrate; growing a nanotube from the seed material; depositing microstructure material on the substrate to embed the nanotube in the microstructure material; and, detaching the substrate to release the microstructure. The resulting mictostructure comprises a body portion and a nanotube embedded in the body portion.
-
公开(公告)号:DE69820380T2
公开(公告)日:2004-05-27
申请号:DE69820380
申请日:1998-10-15
Applicant: SEIKO INSTR INC , IBM
Inventor: DESPONT MICHEL , TAKAHASHI HIROSHI , SHIMIZU NOBUHIRO , SHIRAKAWABE YOSHIHARU , ICHIHARA SUSUMU
IPC: G01B7/34 , G01B21/30 , G01L9/00 , G01N27/00 , G01L1/18 , G01N37/00 , G01P15/08 , G01Q20/04 , G01Q60/38 , G01Q70/10 , G01Q70/16 , H01L29/82 , H01L29/84
Abstract: A semiconductor strain sensor in which a shottky junction is formed at the base or root of a semiconductor probe so as to detect strain of the semiconductor probe as a change of the diode characteristic of the shottky junction. A probe 10 of the strain sensor comprises an arm portion 10a, a supporting portion 10b, an exploring needle 10c, and a sensor portion 9 which detects strain. At the sensor portion, a shottky junction 50 is formed on the surface of the semiconductor so as to convert strain in the arm portion 10a to an electric signal.
-
公开(公告)号:AU2003253213A1
公开(公告)日:2004-03-19
申请号:AU2003253213
申请日:2003-08-22
Applicant: IBM
Inventor: BINNIG GERD K , DESPONT MICHEL , LANTZ MARK A , VETTIGER PETER
Abstract: A transducer for detecting movement of an article mounted for movement in a plane, the transducer comprising: a heater facing the plane of movement of the article and having a temperature dependent resistance; and, an edge defined in the article between regions of different thermal conductivity; wherein, as the article describes the movement, the edge moves relative to the heater producing a corresponding variation in heat loss from the heater and a corresponding variation in resistance of the heater.
-
公开(公告)号:DE69815781D1
公开(公告)日:2003-07-31
申请号:DE69815781
申请日:1998-09-30
Applicant: SEIKO INSTR INC , IBM
Inventor: TAKAHASHI HIROSHI , SHIMIZU MOBUHIRO , SHIRAKAWABE YOSHIHARU , DESPONT MICHEL
-
公开(公告)号:GB2518185A
公开(公告)日:2015-03-18
申请号:GB201316262
申请日:2013-09-12
Applicant: IBM
Inventor: DESPONT MICHEL , DUERIG URS T , GROGG DANIEL , KNOLL ARMIN W , KOREN ELAD
Abstract: An electromechanical switch comprises a first electrode 11 comprising layers 21 of a first 2D layered material exhibiting a first surface, and a second electrode 12 comprising layers 22 of a second 2D layered material exhibiting a second surface vis-Ã -vis or face to face with the first surface. Each of the 2D materials is electrically conducting and an actuator actuates one of the electrodes to modify a distance between the surfaces, to modify electrical conductivity transverse to the surfaces and enable current modulation between the electrodes. The electrodes may comprise a drain and a source and the actuator a gate electrode (fig 1,13). The surfaces may move parallel to each other, actuation modifying an overlap between them or move transversely with actuation modifying a transverse distance (fig 1, d). An active region comprising one of the surfaces may be surrounded by and level with an inactive region of insulating material (fig 10B, S5) such as hexagonal boron nitride. An actuatable electrode may pivot, flex, rotate and/or slide and comprise an anchored beam. Source and drain electrodes may be side-by-side and parallel to each other and bridged by a third electrode (fig 13, 122) that can rotate (fig 15). The 2D layer may comprise graphene, graphite, BN, MoS2, WS2, MoSe2, NbSe2 NbS2, NbTe2, TaS2, TaTe2 or TiSe2. Actuation may be electrostatic, piezoelectric, magnetic, by thermal deformation, or by material stress. The switch may be micro-electromechanical or nano-electromechanical.
-
公开(公告)号:DE60230673D1
公开(公告)日:2009-02-12
申请号:DE60230673
申请日:2002-06-07
Applicant: IBM
Inventor: DESPONT MICHEL , DRECHSLER UTE , ROTHUIZEN HUGO E , VETTIGER PETER , WIDMER ROLAND W
Abstract: A microsystem switch ( 1, 20, 25, 30, 33 ) has a support ( 2 ) defining a recess ( 3 ), and a flexible bridge ( 6 ) is mounted on the support ( 2 ) bridging the recess ( 3 ). The bridge ( 6 ) is shaped so as to hold selectively a concave stable state, in which the bridge bulges into the recess ( 3 ), and a convex stable state in which the bridge bulges out of the recess ( 3 ). The switch includes an actuator ( 8, 9; 26, 27 ) for effecting flexing of the bridge ( 6 ) between the stable states, and a switching element ( 7, 31, 34 ) is mounted on the bridge ( 6 ) such that movement of the bridge between the stable states moves the switching element between an on position and an off position. According to another design, a microsystem switch ( 40, 55 ) has a support ( 41 ) defining a recess ( 42 ), and an elongate torsion member ( 44 ) is mounted on the support ( 41 ) bridging the recess ( 42 ). A flexible bridge ( 43, 56 ) is mounted on the support ( 41 ) bridging the recess ( 42 ) in a direction substantially perpendicular to the torsion member ( 44 ). The bridge ( 43, 56 ) is connected to the torsion member ( 44 ) at the cross-point thereof so that a first section of the bridge extends between the cross-point and one side of the recess ( 42 ) and a second section of the bridge extends between the cross-point and the opposite side of the recess ( 42 ). The bridge ( 43, 56 ) is shaped so as to hold selectively a first stable state, in which the first section of the bridge bulges into the recess and the second section of the bridge bulges out of the recess, and a second stable state in which this configuration is reversed. A switching element ( 45 ) is mounted at the cross-point of the bridge ( 43, 56 ) and torsion member ( 44 ), and an actuator ( 46 a, 46 b; 58 a, 58 b) is again provided for effecting flexing of the bridge ( 43, 56 ) between the stable states. Here, movement of the bridge ( 43, 56 ) between the stable states effects twisting of the torsion member ( 44 ) and rotation of the switching element ( 45 ) between an on position and an off position. Switching devices incorporating these switches, and switching apparatus comprising arrays of such switching devices, are also provided.
-
公开(公告)号:DE69820380D1
公开(公告)日:2004-01-22
申请号:DE69820380
申请日:1998-10-15
Applicant: SEIKO INSTR INC , IBM
Inventor: DESPONT MICHEL , TAKAHASHI HIROSHI , SHIMIZU NOBUHIRO , SHIRAKAWABE YOSHIHARU , ICHIHARA SUSUMU
IPC: G01B7/34 , G01B21/30 , G01L9/00 , G01N27/00 , G01L1/18 , G01N37/00 , G01P15/08 , G01Q20/04 , G01Q60/38 , G01Q70/10 , G01Q70/16 , H01L29/82 , H01L29/84
Abstract: A semiconductor strain sensor in which a shottky junction is formed at the base or root of a semiconductor probe so as to detect strain of the semiconductor probe as a change of the diode characteristic of the shottky junction. A probe 10 of the strain sensor comprises an arm portion 10a, a supporting portion 10b, an exploring needle 10c, and a sensor portion 9 which detects strain. At the sensor portion, a shottky junction 50 is formed on the surface of the semiconductor so as to convert strain in the arm portion 10a to an electric signal.
-
公开(公告)号:AU2002309106A1
公开(公告)日:2003-02-24
申请号:AU2002309106
申请日:2002-06-07
Applicant: IBM
Inventor: ROTHUIZEN HUGO E , DESPONT MICHEL , DRECHSLER UTE , VETTIGER PETER , WIDMER ROLAND W
Abstract: A microsystem switch ( 1, 20, 25, 30, 33 ) has a support ( 2 ) defining a recess ( 3 ), and a flexible bridge ( 6 ) is mounted on the support ( 2 ) bridging the recess ( 3 ). The bridge ( 6 ) is shaped so as to hold selectively a concave stable state, in which the bridge bulges into the recess ( 3 ), and a convex stable state in which the bridge bulges out of the recess ( 3 ). The switch includes an actuator ( 8, 9; 26, 27 ) for effecting flexing of the bridge ( 6 ) between the stable states, and a switching element ( 7, 31, 34 ) is mounted on the bridge ( 6 ) such that movement of the bridge between the stable states moves the switching element between an on position and an off position. According to another design, a microsystem switch ( 40, 55 ) has a support ( 41 ) defining a recess ( 42 ), and an elongate torsion member ( 44 ) is mounted on the support ( 41 ) bridging the recess ( 42 ). A flexible bridge ( 43, 56 ) is mounted on the support ( 41 ) bridging the recess ( 42 ) in a direction substantially perpendicular to the torsion member ( 44 ). The bridge ( 43, 56 ) is connected to the torsion member ( 44 ) at the cross-point thereof so that a first section of the bridge extends between the cross-point and one side of the recess ( 42 ) and a second section of the bridge extends between the cross-point and the opposite side of the recess ( 42 ). The bridge ( 43, 56 ) is shaped so as to hold selectively a first stable state, in which the first section of the bridge bulges into the recess and the second section of the bridge bulges out of the recess, and a second stable state in which this configuration is reversed. A switching element ( 45 ) is mounted at the cross-point of the bridge ( 43, 56 ) and torsion member ( 44 ), and an actuator ( 46 a, 46 b; 58 a, 58 b) is again provided for effecting flexing of the bridge ( 43, 56 ) between the stable states. Here, movement of the bridge ( 43, 56 ) between the stable states effects twisting of the torsion member ( 44 ) and rotation of the switching element ( 45 ) between an on position and an off position. Switching devices incorporating these switches, and switching apparatus comprising arrays of such switching devices, are also provided.
-
-
-
-
-
-
-
-
-