公开(公告)号：AU2002347506A1

公开(公告)日：2003-07-09

申请号：AU2002347506

申请日：2002-11-26

Applicant: IBM

Inventor： BEIERLEIN TILMAN A ,  CRONE BRIAN ,  DRECHSLER UTE ,  GERMANN ROLAND W ,  KARG SIEGFRIED F ,  MUELLER PETER ,  RIEL HEIKE ,  RIESS WALTER ,  RUHSTALLER BEAT ,  SEIDLER PAUL ,  WIDMER ROLAND W ,  ALVARADO SANTOS F

IPC: H01L51/50 ,  H01L51/52 ,  H05B33/10 ,  H05B33/22 ,  H01L51/20

Abstract: The present invention discloses an electrode structure for electronic and opto-electronic devices. Such a device comprises a first electrode substantially having a conductive layer ( 204 ), a nonmetal layer ( 206 ) formed on the conductive layer, a fluorocarbon layer ( 208 ) formed on the nonmetal layer, a structure ( 210 ) formed on the structure. The electrode may further comprise a buffer layer ( 205 ) between the conductive layer and the nonmetal layer.

公开(公告)号：MX2011009404A

公开(公告)日：2011-09-27

申请号：MX2011009404

申请日：2010-05-07

Applicant: IBM

Inventor： DELAMARCHE EMMANUEL ,  DRECHSLER UTE ,  LOVCHIK ROBERT

IPC: B01J19/00 ,  B01L3/00 ,  B01L3/02

Abstract: La invención se refiere a un cabezal (100) de sonda de microfluidos de múltiples capas (MFP). El cabezal comprende típicamente una primera (110) y una segunda (120) capas que dan una hacia a la otra, y al menos un orificio (188) de tubería, que se extiende desde la primera capa (110). La primera capa comprende una o más vías (112), por lo que se habilita la comunicación para fluidos a través de la primera capa hacia la segunda capa. La segunda capa comprende al menos un microcanal (124) que transmite comunicación para fluidos a una abertura (122) Este cabezal de MFP de múltiples capas es más fácil de fabricar que los cabezales producidos con construcción unitaria. En particular, se puede grabar ventajosamente un microcanal con una ranura (124) al nivel de la entrecara entre las dos capas. El cabezal de MFP se puede interconectar adicionalmente con tubería usando, por ejemplo, un adaptador normal para el orificio de tubería. La invención tiene potencial sustancial para modelar, por ejemplo patrones continuos y discontinuos de biomoléculas en superficies así como de procesamiento directo de materiales protectores de un modo sin contacto.

公开(公告)号：DE60230673D1

公开(公告)日：2009-02-12

申请号：DE60230673

申请日：2002-06-07

Applicant: IBM

Inventor： DESPONT MICHEL ,  DRECHSLER UTE ,  ROTHUIZEN HUGO E ,  VETTIGER PETER ,  WIDMER ROLAND W

IPC: G02B6/35 ,  G02B26/08 ,  B81B3/00 ,  G02B6/122 ,  G11C23/00 ,  H01H1/00 ,  H01H61/02

Abstract: A microsystem switch ( 1, 20, 25, 30, 33 ) has a support ( 2 ) defining a recess ( 3 ), and a flexible bridge ( 6 ) is mounted on the support ( 2 ) bridging the recess ( 3 ). The bridge ( 6 ) is shaped so as to hold selectively a concave stable state, in which the bridge bulges into the recess ( 3 ), and a convex stable state in which the bridge bulges out of the recess ( 3 ). The switch includes an actuator ( 8, 9; 26, 27 ) for effecting flexing of the bridge ( 6 ) between the stable states, and a switching element ( 7, 31, 34 ) is mounted on the bridge ( 6 ) such that movement of the bridge between the stable states moves the switching element between an on position and an off position. According to another design, a microsystem switch ( 40, 55 ) has a support ( 41 ) defining a recess ( 42 ), and an elongate torsion member ( 44 ) is mounted on the support ( 41 ) bridging the recess ( 42 ). A flexible bridge ( 43, 56 ) is mounted on the support ( 41 ) bridging the recess ( 42 ) in a direction substantially perpendicular to the torsion member ( 44 ). The bridge ( 43, 56 ) is connected to the torsion member ( 44 ) at the cross-point thereof so that a first section of the bridge extends between the cross-point and one side of the recess ( 42 ) and a second section of the bridge extends between the cross-point and the opposite side of the recess ( 42 ). The bridge ( 43, 56 ) is shaped so as to hold selectively a first stable state, in which the first section of the bridge bulges into the recess and the second section of the bridge bulges out of the recess, and a second stable state in which this configuration is reversed. A switching element ( 45 ) is mounted at the cross-point of the bridge ( 43, 56 ) and torsion member ( 44 ), and an actuator ( 46 a, 46 b; 58 a, 58 b) is again provided for effecting flexing of the bridge ( 43, 56 ) between the stable states. Here, movement of the bridge ( 43, 56 ) between the stable states effects twisting of the torsion member ( 44 ) and rotation of the switching element ( 45 ) between an on position and an off position. Switching devices incorporating these switches, and switching apparatus comprising arrays of such switching devices, are also provided.

公开(公告)号：AU2002309106A1

公开(公告)日：2003-02-24

申请号：AU2002309106

申请日：2002-06-07

Applicant: IBM

Inventor： ROTHUIZEN HUGO E ,  DESPONT MICHEL ,  DRECHSLER UTE ,  VETTIGER PETER ,  WIDMER ROLAND W

IPC: G02B26/08 ,  B81B3/00 ,  G02B6/122 ,  G02B6/35 ,  G11C23/00 ,  H01H1/00 ,  H01H61/02

Abstract: A microsystem switch ( 1, 20, 25, 30, 33 ) has a support ( 2 ) defining a recess ( 3 ), and a flexible bridge ( 6 ) is mounted on the support ( 2 ) bridging the recess ( 3 ). The bridge ( 6 ) is shaped so as to hold selectively a concave stable state, in which the bridge bulges into the recess ( 3 ), and a convex stable state in which the bridge bulges out of the recess ( 3 ). The switch includes an actuator ( 8, 9; 26, 27 ) for effecting flexing of the bridge ( 6 ) between the stable states, and a switching element ( 7, 31, 34 ) is mounted on the bridge ( 6 ) such that movement of the bridge between the stable states moves the switching element between an on position and an off position. According to another design, a microsystem switch ( 40, 55 ) has a support ( 41 ) defining a recess ( 42 ), and an elongate torsion member ( 44 ) is mounted on the support ( 41 ) bridging the recess ( 42 ). A flexible bridge ( 43, 56 ) is mounted on the support ( 41 ) bridging the recess ( 42 ) in a direction substantially perpendicular to the torsion member ( 44 ). The bridge ( 43, 56 ) is connected to the torsion member ( 44 ) at the cross-point thereof so that a first section of the bridge extends between the cross-point and one side of the recess ( 42 ) and a second section of the bridge extends between the cross-point and the opposite side of the recess ( 42 ). The bridge ( 43, 56 ) is shaped so as to hold selectively a first stable state, in which the first section of the bridge bulges into the recess and the second section of the bridge bulges out of the recess, and a second stable state in which this configuration is reversed. A switching element ( 45 ) is mounted at the cross-point of the bridge ( 43, 56 ) and torsion member ( 44 ), and an actuator ( 46 a, 46 b; 58 a, 58 b) is again provided for effecting flexing of the bridge ( 43, 56 ) between the stable states. Here, movement of the bridge ( 43, 56 ) between the stable states effects twisting of the torsion member ( 44 ) and rotation of the switching element ( 45 ) between an on position and an off position. Switching devices incorporating these switches, and switching apparatus comprising arrays of such switching devices, are also provided.

公开(公告)号：DE60239734D1

公开(公告)日：2011-05-26

申请号：DE60239734

申请日：2002-01-11

Applicant: IBM

Inventor： DESPONT MICHEL ,  DRECHSLER UTE ,  MAGNUSON ROY H

IPC: B81B3/00 ,  B81C1/00 ,  C23F13/14 ,  H01L21/306

公开(公告)号：CA2470206C

公开(公告)日：2010-03-30

申请号：CA2470206

申请日：2002-11-26

Applicant: IBM

Inventor： ALVARADO SANTOS F ,  BEIERLEIN TILMAN A ,  CRONE BRIAN ,  DRECHSLER UTE ,  GERMANN ROLAND W ,  KARG SIEGFRIED F ,  MUELLER PETER ,  RIEL HEIKE ,  RIESS WALTER ,  RUHSTALLER BEAT ,  SEIDLER PAUL ,  WIDMER ROLAND W

IPC: H05B33/22 ,  H01L51/50 ,  H01L51/52 ,  H05B33/10

Abstract: The present invention discloses an electrode structure for electronic and opto-electronic devices. Such a device comprises a first electrode substantially having a conductive layer (204), a nonmetal layer (206) formed on the conductive layer, a fluorocarbon layer (208) formed on the nonmetal layer, a structure (210) formed on the structure. The electrode may further comprise a buffer layer (205) between the conductive layer and the nonmetal layer.

公开(公告)号：AU2003301975A1

公开(公告)日：2004-06-03

申请号：AU2003301975

申请日：2003-11-07

Applicant: IBM

Inventor： POGGE BERNHARD ,  DESPONT MICHEL ,  DRECHSLER UTE ,  PRASAD CHANDRIKA ,  VETTIGER PETER ,  YU ROY

IPC: B81C3/00 ,  H01L21/768

Abstract: A vertically integrated structure includes a micro-electromechanical system (MEMS) and a chip for delivering signals to the MEMS. The structure includes a metal stud connecting a surface of the chip and the MEMS; the MEMS has an anchor portion having a conducting pad on an underside thereof contacting the metal stud. The MEMS is spaced from the chip by a distance corresponding to a height of the metal stud, and the MEMS includes a doped region in contact with the conducting pad. In particular, the MEMS may include a cantilever structure, with the end portion including a tip extending in the vertical direction. A support structure (e.g. of polyimide) may surround the metal stud and contact both the underside of the MEMS and the surface of the chip. A temporary carrier plate is used to facilitate handling of the MEMS and alignment to the chip.