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公开(公告)号:DE602005005302T2
公开(公告)日:2009-03-12
申请号:DE602005005302
申请日:2005-01-13
Applicant: IBM
Inventor: FURUKAWA TOSHIHARU , HAKEY MARK CHARLES , HOLMES STEVEN JOHN , HORAK DAVID VACLAV , MITCHELL PETER , NESBIT LARRY ALAN
Abstract: Vertical field effect transistors having a channel region defined by at least one semiconducting nanotube and methods for fabricating such vertical field effect transistors by chemical vapor deposition using a spacer-defined channel. Each nanotube is grown by chemical vapor deposition catalyzed by a catalyst pad positioned at the base of a high-aspect-ratio passage defined between a spacer and a gate electrode. Each nanotube grows in the passage with a vertical orientation constrained by the confining presence of the spacer. A gap may be provided in the base of the spacer remote from the mouth of the passage. Reactants flowing through the gap to the catalyst pad participate in nanotube growth.
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公开(公告)号:DE602005005302D1
公开(公告)日:2008-04-24
申请号:DE602005005302
申请日:2005-01-13
Applicant: IBM
Inventor: FURUKAWA TOSHIHARU , HAKEY MARK CHARLES , HOLMES STEVEN JOHN , HORAK DAVID VACLAV , MITCHELL PETER , NESBIT LARRY ALAN
Abstract: Vertical field effect transistors having a channel region defined by at least one semiconducting nanotube and methods for fabricating such vertical field effect transistors by chemical vapor deposition using a spacer-defined channel. Each nanotube is grown by chemical vapor deposition catalyzed by a catalyst pad positioned at the base of a high-aspect-ratio passage defined between a spacer and a gate electrode. Each nanotube grows in the passage with a vertical orientation constrained by the confining presence of the spacer. A gap may be provided in the base of the spacer remote from the mouth of the passage. Reactants flowing through the gap to the catalyst pad participate in nanotube growth.
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公开(公告)号:AU624467B2
公开(公告)日:1992-06-11
申请号:AU4778890
申请日:1990-01-08
Applicant: IBM
Inventor: DOBUZINSKY DAVID MARK , HAKEY MARK CHARLES , HOLMES STEVEN JOHN , HORAK DAVID VACLAV
IPC: C08G77/06 , C08G77/48 , C08G77/60 , C09D183/00 , C09D183/16 , C23C14/14 , C23C14/24 , G03F7/075 , G03F7/16 , H01L21/027 , H01L21/30 , H01L21/312 , C01B33/04 , C23C16/24
Abstract: Disclosed is a process for forming a film comprising a polysilane composition on a substrate. The film is formed by vapor deposition directly on a substrate, thus avoiding the cumbersome steps ordinarily encountered in preparing and applying polysilanes by conventional spin application techniques. The film is used in a lithographic process for forming an image on a substrate.
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