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公开(公告)号：GB2500966B
公开(公告)日：2016-03-02
申请号：GB201301549
申请日：2013-01-29
Applicant: IBM
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公开(公告)号：AT391406T
公开(公告)日：2008-04-15
申请号：AT05817223
申请日：2005-12-07
Applicant: IBM
Inventor： CAMPBELL LEVI , CHU RICHARD , ELLSWORTH MICHAEL , IYENGAR MADHUSUDAN , SCHMIDT ROGER , SIMONS ROBERT
IPC: H05K7/20 , F25D23/12 , H01L23/473
Abstract: A cooling approach is provided for one or more subsystems of an electronics rack. The cooling approach employs a coolant distribution unit and a thermal dissipation unit. The coolant distribution unit has a first heat exchanger, a first cooling loop and a second cooling loop. The first cooling loop passes facility coolant through the first heat exchanger, and the second cooling loop provides system coolant to an electronics subsystem, and expels heat in the first heat exchanger from the subsystem to the facility coolant. The thermal dissipation unit is associated with the electronics subsystem and includes a second heat exchanger, the second cooling loop, and a third cooling loop. The second cooling loop provides system coolant to the second heat exchanger, and the third cooling loop circulates conditioned coolant within the electronics subsystem and expels heat in the second heat exchanger from the electronics subsystem to the system coolant.
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公开(公告)号：GB2509675B
公开(公告)日：2014-12-10
申请号：GB201407967
申请日：2012-10-25
Applicant: IBM
Inventor： CAMPBELL LEVI , CHU RICHARD , DAVID MILNES P , ELLSWORTH MICHAEL , MCKEEVER ERIC , SIMONS ROBERT , IYENGAR MADHUSUDAN
IPC: H05K7/20
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公开(公告)号：GB2511419A
公开(公告)日：2014-09-03
申请号：GB201401041
申请日：2012-07-08
Applicant: IBM
Inventor： IYENGAR MADHUSUDAN , PARIDA PRITISH RANJAN , SCHULTZ MARK D
Abstract: A data center cooling system is operated in a first mode; it has an indoor portion wherein heat is absorbed from components in the data center, and an outdoor heat exchanger portion wherein outside air is used to cool a first heat transfer fluid in at least the outdoor heat exchanger portion of the cooling system during the first mode. The first heat transfer fluid is a relatively high performance heat transfer fluid (as compared to the second fluid), and has a first heat transfer fluid freezing point. A determination is made that an appropriate time has been reached to switch from the first mode to a second mode. Based on this determination, the outdoor heat exchanger portion of the data cooling system is switched to a second heat transfer fluid, which is a relatively low performance heat transfer fluid, as compared to the first heat transfer fluid.
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公开(公告)号：GB2509675A
公开(公告)日：2014-07-09
申请号：GB201407967
申请日：2012-10-25
Applicant: IBM
Inventor： CAMPBELL LEVI , CHU RICHARD , DAVID MILNES P , ELLSWORTH MICHAEL , MCKEEVER ERIC , SIMONS ROBERT , IYENGAR MADHUSUDAN
IPC: H05K7/20
Abstract: A cooling apparatus is provided which includes one or more coolant-cooled structures attached to one or more electronic components, one or more coolant conduits, and one or more coolant manifolds. The coolant-cooled structure(s) includes one or more coolant-carrying channels, and the coolant manifolds includes one or more rotatable manifold sections. One coolant conduit couples in fluid communication a respective rotatable manifold section and the coolant-carrying channel(s) of a respective coolant- cooled structure. The respective rotatable manifold section is rotatable relative to another portion of the coolant manifold to facilitate detaching of the coolant-cooled structure from its associated electronic component while maintaining the coolant-cooled structure in fluid communication with the respective rotatable manifold section through the one coolant conduit, which in one embodiment, is a substantially rigid coolant conduit.
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Patent Agency Ranking
公开(公告)号：GB2500965A
公开(公告)日：2013-10-09
申请号：GB201301546
申请日：2013-01-29
Applicant: IBM
Inventor： PARIDA PRITISH RANJAN , CHAINER TIMOTHY JOSEPH , IYENGAR MADHUSUDAN , MILNES DAVID PAUL , SIMONS ROBERT
Abstract: A cooling system such as an intra-rack cooling system 500 of a data centre comprises: one or more nodes, such as servers 300, each node having at least one temperature sensor to monitor a temperature of the node components; an air-to-liquid heat exchanger 402 configured to accept a liquid coolant input, preferably via a first shut-off valve 504, to provide cooled air to the one or more nodes; and a temperature sensor to monitor a temperature of air Tai provided by the heat exchanger. The cooling system also comprises a direct liquid cooling apparatus to provide liquid coolant to components of the one or more nodes, preferably an inlet plenum 404, i.e. manifold, and an outlet plenum 406. The apparatus supplies cold input coolant 412, preferably via a second shut-off valve 506, to the one or more nodes and ejects warm coolant 410. A valve, ideally a three-way valve 502, is configured to control a proportion of the coolant flow directed to the heat exchanger and the one or more nodes based upon the monitored temperatures. A flow rate of coolant is also controlled based upon the monitored temperatures, preferably by varying the pump strength of a pump 401.
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公开(公告)号：GB2499158A
公开(公告)日：2013-08-07
申请号：GB201309199
申请日：2011-10-27
Applicant: IBM
Inventor： SCHMIDT ROGER , IYENGAR MADHUSUDAN
IPC: H05K7/20
Abstract: Methods of preventing overheating of computer equipment in a cabinet when a supply coolant to a cooler in the cabinet fails. An example embodiment is a data center that includes a plurality of cabinets and at least two coolant supply lines. The cabinets are configured to house computer equipment and the coolant supply lines provide coolant for the cabinets. Moreover, the cabinets are arranged in at least one row of adjacent cabinets such that each row of adjacent cabinets receives coolant from alternating coolant supply lines.
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公开(公告)号：DE602005005859D1
公开(公告)日：2008-05-15
申请号：DE602005005859
申请日：2005-12-07
Applicant: IBM
Inventor： CAMPBELL LEVI , CHU RICHARD , ELLSWORTH MICHAEL , IYENGAR MADHUSUDAN , SCHMIDT ROGER , SIMONS ROBERT
IPC: H05K7/20 , F25D23/12 , H01L23/473
Abstract: A cooling approach is provided for one or more subsystems of an electronics rack. The cooling approach employs a coolant distribution unit and a thermal dissipation unit. The coolant distribution unit has a first heat exchanger, a first cooling loop and a second cooling loop. The first cooling loop passes facility coolant through the first heat exchanger, and the second cooling loop provides system coolant to an electronics subsystem, and expels heat in the first heat exchanger from the subsystem to the facility coolant. The thermal dissipation unit is associated with the electronics subsystem and includes a second heat exchanger, the second cooling loop, and a third cooling loop. The second cooling loop provides system coolant to the second heat exchanger, and the third cooling loop circulates conditioned coolant within the electronics subsystem and expels heat in the second heat exchanger from the electronics subsystem to the system coolant.
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公开(公告)号：DE112012004136B4
公开(公告)日：2018-11-29
申请号：DE112012004136
申请日：2012-10-23
Applicant: IBM
Inventor： IYENGAR MADHUSUDAN , CHU RICHARD , SIMONS ROBERT , ELLSWORTH MICHAEL , CAMPBELL LEVI , DAVID MILNES PAUL
Abstract: Kühleinheit, aufweisend: wenigstens eine Wärmeabführeinheit, die so konfiguriert ist, dass sie Wärme von einem Kühlmittel an die Luft abführt, das durch einen Kühlmittelkreislauf hindurchfließt und dabei durch die wenigstens eine Wärmeabführeinheit hindurchfließt, wobei die wenigstens eine Wärmeabführeinheit wenigstens eine Wärmetauscherbaugruppe aufweist, die mit dem Kühlmittelkreislauf verbunden ist, so dass wenigstens ein Teil des Kühlmittels durch ihn hindurchfließen kann, wobei eine Wärmetauscherbaugruppe der wenigstens einen Wärmetauscherbaugruppe der wenigstens einen Wärmeabführeinheit drehbar auf einer Tragvorrichtung montiert ist, und wobei die Kühleinheit des Weiteren einen Controller aufweist, der verbunden ist, um wenigstens einen Abschnitt der einen Wärmetauscherbaugruppe in Reaktion auf eine Änderung der Umgebungsluftstromrichtung an der einen Wärmetauscherbaugruppe automatisch zu drehen, um Abführen von Wärme, die über die eine Wärmetauscherbaugruppe strömt, an die Luft zu ermöglichen; und einen erhöht angeordneten Kühlmittelbehälter, der mittels Flüssigkeitsübertragung mit der wenigstens einen Wärmetauscherbaugruppe der wenigstens einen Wärmeabführeinheit verbunden ist, wobei der erhöht angeordnete Kühlmittelbehälter Rückführen des Kühlmittels an den Kühlmittelkreislauf bei einem im Wesentlichen konstanten Druck ermöglicht, wobei der erhöht angeordnete Kühlmittelbehälter über wenigstens einem Abschnitt des Kühlmittelkreislaufes erhöht angeordnet ist.
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公开(公告)号：GB2511419B
公开(公告)日：2015-10-07
申请号：GB201401041
申请日：2012-07-08
Applicant: IBM
Inventor： IYENGAR MADHUSUDAN , PARIDA PRITISH RANJAN , SCHULTZ MARK D
Abstract: A data center cooling system has an indoor portion wherein heat is absorbed from components in the data center, and an outdoor heat exchanger portion wherein outside air is used to cool a first heat transfer fluid (e.g., water) present in at least the outdoor heat exchanger portion of the cooling system during a first mode. When an appropriate time has been reached to switch from the first mode to a second mode, the outdoor heat exchanger portion of the data cooling system is switched to a second heat transfer fluid, which is a relatively low performance heat transfer fluid (compared to the first fluid). It has a second heat transfer fluid freezing point, lower than the first heat transfer fluid freezing point, and sufficiently low to operate without freezing when the outdoor air temperature drops below a first predetermined relationship with the first heat transfer fluid freezing point.
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