公开(公告)号：JPH06125519A

公开(公告)日：1994-05-06

申请号：JP8450393

申请日：1993-04-12

Applicant: IBM

Inventor： ARII AFUZAARI ARUDAKAANI ,  MARII ANGEROPUUROSU ,  JIYATSUKU ARUBUIN DEITSUKAASON ,  TOOMASU BEAADO PIRUSUBERII ,  KAARU JIYOOZEFU PATORITSUTSU ,  JIEEN MAAGARETSUTO SHIYOO ,  JIEFURII DONARUDO JIEROOMU

IPC: C08K3/22 ,  B05D5/02 ,  B05D5/12 ,  C08G61/12 ,  C08L101/00 ,  C09D5/24 ,  H01B1/12 ,  H01J29/86 ,  H01L23/29 ,  H01L23/498 ,  H01L23/60 ,  H04N5/65 ,  H05K9/00

Abstract: PURPOSE: To provide an abrasion-resistant and scratch-resistant conductive polymer composition which can be used as an electrostatic discharge layer having an abrasion resistance and light transmittance and, at the same time, can prevent the deposition of dusts and scratches due to static electricity. CONSTITUTION: An abrasion-resistant and scratch-resistant conductive polymer composition is manufactured by mixing an abrasion-resistant material with a conductive polymer material. The abrasion-resistant polymer material is composed of silicone, polysiloxane, acrylate, epoxy, methacrylate, epoxy acrylate, epoxy methacrylate, and styrene and a conductive polymer material is selected out of a group composed of substituted and nonsubstituted polyaniline, polyparaphenylene vinylene, substituted and nonsubstituted polythiophene, substituted and nonsubstituted poly-p-phenylene sulfide, substituted and nonsubstituted polyfuran, substituted and nonsubstituted polypyrrole, substituted and nonsubstituted polyselenophene, polyacetylene prepared from a soluble precursor, and their combinations. It is also possible to constitute the composition in such a laminated structure that an abrasion-resistance layer is provided on a layer of the conductive polymer.

公开(公告)号：JPH0643640A

公开(公告)日：1994-02-18

申请号：JP25254792

申请日：1992-09-22

Applicant: IBM

Inventor： JIEFURII DONARUDO JIEROOMU ,  MAATEIN JIYOZEFU GOORUDOBAAGU ,  NANSHII KARORIN RABIANKA ,  JIEIN MAAGARETSUTO SHIYOO

IPC: C08G73/10 ,  C08L79/08 ,  G03F7/004 ,  G03F7/027 ,  G03F7/037 ,  G03F7/038

Abstract: PURPOSE: To obtain a compsn. increasing resolution and sensitivity while reducing the lass of thickness at the time of development by using a polyimide precursor and a complex cation of a polymerizable functional carboxylic acid compd. having a tert. amino functional group as a reactivity modifier. CONSTITUTION: An unmodified polyimide precursor such as a precursor of polyester imide, polyamide-imide-ester, polyamide-imide or polysiloxane-imide as well as other mixed polyimides is included in a polyimide precursor (polyamic acid) used. A required reactivity modifier is a complex cation of a polymerizable functional carboxylic acid compd. having a tert. amino functional group. This tert. amino functional substance preferably contains a polymerizable part such as an ethylenic unsatd. part and/or plural tert. amino positions.

公开(公告)号：JPH03237106A

公开(公告)日：1991-10-23

申请号：JP23730290

申请日：1990-09-10

Applicant: IBM

Inventor： EDOWAADO DAAKO BAABIKU ,  JIEFURII DONARUDO JIEROOMU ,  MAIKURU HATSUAKISU ,  JIEIN MAAGARETSUTO SHIYOO ,  KEBIN JIEI SUCHIYUAATO ,  DEIBITSUDO FURANKU UITSUTOMAN

IPC: G03F7/031 ,  C08F2/50 ,  C08G59/68 ,  C08G77/14 ,  C08G77/22 ,  C08G85/00 ,  C08L83/04 ,  C08L83/06 ,  G03F7/027 ,  G03F7/029 ,  G03F7/075

公开(公告)号：JPH02269719A

公开(公告)日：1990-11-05

申请号：JP4739190

申请日：1990-03-01

Applicant: IBM

Inventor： JIEFURII DONARUDO JIEROOMU ,  YUUJIN ROOMAN SUKAARUBINKO

IPC: C08F299/00 ,  C08F2/44 ,  C08F2/48 ,  C08F2/50 ,  C08F290/00 ,  C08F299/02 ,  C08G59/08 ,  C09J4/00 ,  C09J4/06 ,  C09J163/00 ,  C09J163/10 ,  C09J171/00 ,  H01L23/14 ,  H05K3/10 ,  H05K3/28 ,  H05K3/38

公开(公告)号：JPH02259762A

公开(公告)日：1990-10-22

申请号：JP30943489

申请日：1989-11-30

Applicant: IBM

Inventor： RORENSU MAAKU BURAUN ,  JIEFURII DONARUDO JIEROOMU ,  JIYOZEFU POORU KUTSUINSUKII ,  UIRIAMU HAUERU RORENSU

IPC: C08F2/50 ,  C08G59/00 ,  C08G59/18 ,  G03F7/038 ,  G03F7/20 ,  H05K3/00 ,  H05K3/28

Abstract: PURPOSE: To enable free radical polymn. without using an oxygen barrier sheet and to enhance the resolution of an image by using a specified photoresist. CONSTITUTION: A curable cationic photoresist is formed on a substrate and imagewisely exposed with laser beams from Ar ion laser, etc., the exposed part of the photoresist is cured by cationic polymn. and the photoresist is patterned by development. The photoresist preferably contains about 69-79wt.% octafunctional bisphenol A epoxy novolak (e.g. a compd. represented by formula I), about 15-17wt.% bifunctional alicyclic epoxy (e.g. a compd. represented by formula II), about 4-6wt.% trifunctional epoxy (e.g. a compd. represented by formula III), about 2.9-6.9wt.% photosensitizer (e.g. a compd. represented by formula IV) and 0 to about 0.15wt.% surfactant (e.g. a desired fluorine-contg. surfactant).