公开(公告)号：AT526684T

公开(公告)日：2011-10-15

申请号：AT05826298

申请日：2005-12-02

Applicant: IBM

Inventor： CALLEGARI ALESSANDRO C ,  FRANK MARTIN M ,  JAMMY RAJARAO ,  LACEY DIANNE L ,  MCFEELY FENTON R ,  ZAFAR SUFI

IPC: H01L27/088 ,  H01L21/28 ,  H01L29/49

Abstract: A compound metal comprising HfSiN which is a n-type metal having a workfunction of about 4.0 to about 4.5, preferably about 4.3, eV which is thermally stable on a gate stack comprising a high k dielectric and an interfacial layer. Furthermore, after annealing the stack of HfSiN/high k dielectric/interfacial layer at a high temperature (on the order of about 1000° C.), there is a reduction of the interfacial layer, thus the gate stack produces a very small equivalent oxide thickness (12 Å classical), which cannot be achieved using TaSiN.

公开(公告)号：DE602005022493D1

公开(公告)日：2010-09-02

申请号：DE602005022493

申请日：2005-12-02

Applicant: IBM

Inventor： CALLEGARI ALESSANDRO C ,  GRIBELYUK MICHAEL A ,  LACEY DIANNE L ,  MCFEELY FENTON R ,  SAENGER KATHERINE L ,  ZAFAR SUFI

IPC: H01L29/94 ,  C23C14/06 ,  C23C14/34 ,  H01L29/49 ,  H01L29/51

公开(公告)号：AT475195T

公开(公告)日：2010-08-15

申请号：AT05826022

申请日：2005-12-02

Applicant: IBM

Inventor： CALLEGARI ALESSANDRO C ,  GRIBELYUK MICHAEL A ,  LACEY DIANNE L ,  MCFEELY FENTON R ,  SAENGER KATHERINE L ,  ZAFAR SUFI

IPC: H01L21/28 ,  C23C14/06 ,  C23C14/34 ,  H01L29/49 ,  H01L29/51

Abstract: A compound metal comprising TiC which is a p-type metal having a workfunction of about 4.75 to about 5.3, preferably about 5, eV that is thermally stable on a gate stack comprising a high k dielectric and an interfacial layer is provided as well as a method of fabricating the TiC compound metal. Furthermore, the TiC metal compound of the present invention is a very efficient oxygen diffusion barrier at 1000° C. allowing very aggressive equivalent oxide thickness (EOT) and inversion layer thickness scaling below 14 Å in a p-metal oxide semiconductor (pMOS) device.