公开(公告)号：JP2012060183A

公开(公告)日：2012-03-22

申请号：JP2011281227

申请日：2011-12-22

Applicant: Internatl Business Mach Corp ,  インターナショナル・ビジネス・マシーンズ・コーポレーションInternational Business Maschines Corporation

Inventor： XICHANG LIU ,  OIGA A OTIENO ,  NATARAJAN GOVINDARAJAN ,  CHRISTIAN DUC ,  HAMILTON LISA A ,  GOTTSCHALK JR MELVIN R ,  SEBASTIAN LOSCERBO ,  J VANT ,  KLEIN THOMAS ,  LAPLANTE MARK J ,  FOLEY THOMAS ,  WEISMAN RENEE L ,  DONALD W DIANGELO

IPC: H01G13/00 ,  H01G4/12 ,  H01G4/30

CPC classification number: B32B37/0007 ,  B32B37/26 ,  B32B2315/02 ,  H05K1/0306 ,  H05K3/0052 ,  H05K3/4611 ,  H05K3/4629 ,  H05K2201/09781 ,  H05K2203/0169 ,  H05K2203/068 ,  Y10T156/1052 ,  Y10T156/108

Abstract: PROBLEM TO BE SOLVED: To provide an apparatus for providing uniaxial load distribution for laminate layers of multilayer ceramic chip carriers.SOLUTION: The apparatus includes a base plate configured to support a plurality of green sheet layers 502 thereon, the base plate having at least one resiliently mounted load support bar disposed adjacent to outer edges of the base plate. The load support bar is mounted on one or more biasing members such that the top surface of the support bar extends above the top surface of the base plate by a selected distance.

Abstract translation: 要解决的问题：提供一种用于为多层陶瓷芯片载体的层叠层提供单轴负载分布的装置。 解决方案：该设备包括被配置为在其上支撑多个生片层502的基板，所述基板具有邻近基板的外边缘设置的至少一个弹性安装的负载支撑杆。 负载支撑杆安装在一个或多个偏压构件上，使得支撑杆的顶表面在基板的顶表面上延伸选定的距离。 版权所有（C）2012，JPO＆INPIT

公开(公告)号：JP2000261143A

公开(公告)日：2000-09-22

申请号：JP2000049993

申请日：2000-02-25

Applicant: IBM

Inventor： RASUCHIDO J BEZAMA ,  NATARAJAN GOVINDARAJAN

IPC: B28B11/08 ,  H01L21/48 ,  H01L23/12 ,  H05K1/03 ,  H05K3/38 ,  H05K3/46

Abstract: PROBLEM TO BE SOLVED: To provide a method and a structure to reduce generation of a failure due to a weak interface of metal and ceramic under an input/output pad of an MLC(multiplayer ceramic) substrate. SOLUTION: Resistance for low intensity structure failure of the interface 64 betweenmetal and ceramic under an input/ output pad 54 is increased by controlling the surface metallizing of a green sheet 50 during the process, and thereby a tensile strength of a pin of an input/output pad 54 on the multiplayer ceramic substrate can be increased. In view of increasing an area of the contact surface between the green sheet 50 and input/output pad, the region where the input/output pad 54 at the surface of green sheet 50 is printed by the screen printing method is changed to the rough surface. The number of coupling points between the green sheet 50 and input/output metallization is increased and different screen printing material is used and thereby mechanical interlock at the interface between metal and ceramic surface 64 is intensified.

公开(公告)号：JP2013037010A

公开(公告)日：2013-02-21

申请号：JP2012228505

申请日：2012-10-16

Applicant: Internatl Business Mach Corp ,  インターナショナル・ビジネス・マシーンズ・コーポレーションInternational Business Machines Corporation

Inventor： NATARAJAN GOVINDARAJAN ,  HUMENIK JAMES N ,  WIWEL TIMOTHY M ,  ECKBERG ERIC A ,  DELAMARCHE EMMANUEL ,  PARTINGTON SCOTT ,  MCGRODDY-GOETZ KATHLEEN A ,  TRIVELLA MARCO G ,  PERRERA CHRISTOPHER F

IPC: G01N27/06

CPC classification number: G01N13/04 ,  A61B2010/0067

Abstract: PROBLEM TO BE SOLVED: To provide a system and method for determining the osmolarity of a fluid.SOLUTION: A system 200 for determining the osmolarity of a fluid comprises: a holder 205 which has a substantially planar layer 225, a receiving portion 235 disposed on the layer, at least one shelf 230 disposed beneath the layer, and a hole 240 within a perimeter of the receiving portion and extending through the layer; and a guide 210 having a through hole 260 and an external shape substantially corresponding to an internal shape of the receiving portion. The hole and the through hole are aligned with each other, and are arranged to be aligned with a test site, when the guide is received in the receiving portion. The system further comprises electrodes 270 disposed in the vicinity of the at least one shelf.

Abstract translation: 要解决的问题：提供用于确定流体的渗透压浓度的系统和方法。 解决方案：用于确定流体的渗透压浓度的系统200包括：保持器205，其具有基本平坦的层225，设置在层上的接收部分235，设置在层下方的至少一个搁架230和孔 240在所述接收部分的周边内并延伸穿过所述层; 以及具有通孔260的引导件210和与接收部分的内部形状基本对应的外部形状。 孔和通孔彼此对准，并且当引导件被容纳在接收部分中时被布置成与测试位置对齐。 系统还包括设置在至少一个搁架附近的电极270。 版权所有（C）2013，JPO＆INPIT

公开(公告)号：JP2007232719A

公开(公告)日：2007-09-13

申请号：JP2007040368

申请日：2007-02-21

Applicant: Internatl Business Mach Corp ,  インターナショナル・ビジネス・マシーンズ・コーポレーションInternational Business Maschines Corporation

Inventor： NATARAJAN GOVINDARAJAN

IPC: B67D99/00 ,  G01N35/10 ,  G01N1/00

CPC classification number: B01L3/0268 ,  B01J19/0046 ,  B01J2219/0036 ,  B01J2219/00369 ,  B01J2219/00418 ,  B01J2219/00527 ,  B01J2219/00585 ,  B01J2219/00596 ,  B01J2219/00605 ,  B01J2219/00612 ,  B01J2219/00659 ,  B01L2200/021 ,  B01L2200/12 ,  B01L2300/12 ,  B01L2400/0487 ,  B32B38/04 ,  B32B2305/77 ,  B32B2315/02 ,  Y10T156/1056 ,  Y10T436/2575

Abstract: PROBLEM TO BE SOLVED: To provide a minute device having a minute well and a minute channel and a method of forming the same. SOLUTION: The micro spotting device is provided with a plurality of feeding holes, a plurality of dispensing nozzles, open cavities communicating with the nozzles, and a plurality of channels. The channels are connected with feeding holes with the dispense nozzles, and from the feeding nozzles the fluid is transferred under capillary force. The channels connect a single feeding hole retaining a liquid to a dispensing nozzle for dispensing the liquid. The micro spotting plate allows the continuous self feeding flow through the hydrophilic layer by the capillary force, while enabling controlled dispensing of the multi-array liquid droplet on the substrate. The substrate is preferably a test slide for later use. COPYRIGHT: (C)2007,JPO&INPIT

Abstract translation: 要解决的问题：提供具有分钟和微通道的分钟装置及其形成方法。 解决方案：微型点样装置设置有多个供给孔，多个分配喷嘴，与喷嘴连通的开放空腔以及多个通道。 通道与分配喷嘴与进料孔连接，并且从进料喷嘴将流体在毛细管力下转移。 通道将保持液体的单个进料孔连接到用于分配液体的分配喷嘴。 微型斑点板允许通过毛细管力连续自我馈送通过亲水层，同时使得多阵列液滴能够在衬底上受控地分配。 基底优选是用于稍后使用的测试载玻片。 版权所有（C）2007，JPO＆INPIT

公开(公告)号：JP2007142431A

公开(公告)日：2007-06-07

申请号：JP2006310966

申请日：2006-11-17

Applicant: Internatl Business Mach Corp ,  インターナショナル・ビジネス・マシーンズ・コーポレーションInternational Business Maschines Corporation

Inventor： LIU HSICHANG ,  OLGA A OTIENO ,  NATARAJAN GOVINDARAJAN ,  CHRISTIAN DOCU ,  HAMILTON LISA A ,  GOTTSCHALK JR MELVIN R ,  SEBASTIAN LOSCERBO ,  JAY BUNT ,  THOMAS KLINE ,  LAPLANTE MARK J ,  THOMAS FOLEY ,  WEISMAN RENEE L ,  DONALD W DIANGELO

IPC: H01G13/00 ,  H01G4/12 ,  H01G4/30

CPC classification number: B32B37/0007 ,  B32B37/26 ,  B32B2315/02 ,  H05K1/0306 ,  H05K3/0052 ,  H05K3/4611 ,  H05K3/4629 ,  H05K2201/09781 ,  H05K2203/0169 ,  H05K2203/068 ,  Y10T156/1052 ,  Y10T156/108

Abstract: PROBLEM TO BE SOLVED: To provide a device for providing a uniform axial load distribution when laminating layers of a multilayer ceramic chip carrier. SOLUTION: The device comprises a base plate 1201 configured so as to support a plurality of green sheet layers from under. The base plate has at least one elastically-attached load support bar 1202 arranged adjacent to the outer edge thereof. The load support bar is attached onto one or more biasing members so that the upper surface of the load support bar can extend as far as a selected distance on the upper surface of the base plate. COPYRIGHT: (C)2007,JPO&INPIT

Abstract translation: 要解决的问题：提供一种当层叠多层陶瓷芯片载体层时提供均匀轴向载荷分布的装置。 解决方案：该装置包括基板1201，其被配置为从下方支撑多个生片层。 基板具有邻近其外边缘布置的至少一个弹性附接的负载支撑杆1202。 负载支撑杆附接到一个或多个偏置构件上，使得负载支撑杆的上表面可以在基板的上表面上延伸至选定的距离。 版权所有（C）2007，JPO＆INPIT

公开(公告)号：JP2006055843A

公开(公告)日：2006-03-02

申请号：JP2005235552

申请日：2005-08-15

Applicant: Internatl Business Mach Corp ,  インターナショナル・ビジネス・マシーンズ・コーポレーションInternational Business Maschines Corporation

Inventor： NATARAJAN GOVINDARAJAN ,  GABRIELS DAVID H ,  KAPFHAMMER MARK W ,  SHELLEMAN RICHARD A ,  SMITH KURT A

IPC: B01J19/00 ,  B81B1/00 ,  B81C3/00 ,  G01N35/02

CPC classification number: B01L3/5085 ,  B01L3/50255 ,  B01L3/5027 ,  B01L2300/0654 ,  B01L2300/0663 ,  B01L2300/0829 ,  B01L2300/12 ,  B01L2300/1827 ,  G01N21/03 ,  G01N2021/0346

Abstract: PROBLEM TO BE SOLVED: To provide a device and a method for mounting/incorporating a micro device in a macro instrument to be used for analyzing or testing a reagent.
SOLUTION: A method of making and the resultant micro well plate that includes a plurality of greensheets, either laminated or sintered together, whereby these greensheets have a plurality of well reaction chamber openings therein, and optionally a plurality of horizontal channels connecting selected well reaction chamber openings. The vertical well reaction chamber openings have at least one end thereof a plurality of optical micro plugs which are aligned to the vertical well reaction chamber openings. The plurality of optical micro plugs allow for the micro well plate to be integrated with macro analytical instrumentation for the analysis, examination, and/or testing of chemicals, reagents or samples provided within the vertical well reaction chamber openings.
COPYRIGHT: (C)2006,JPO&NCIPI

Abstract translation: 要解决的问题：提供一种用于将微型装置安装/结合在用于分析或测试试剂的宏观仪器中的装置和方法。 解决方案：一种制造方法和所得到的微孔板，其包括层叠或烧结在一起的多个湿纸板，由此这些纸板在其中具有多个良好的反应室开口，并且可选地，连接所选择的多个水平通道 井反应室开口。 垂直孔反应室开口的至少一端具有与垂直孔反应室开口对准的多个光学微插头。 多个光学微插头允许微孔板与宏观分析仪器集成，用于分析，检查和/或测试在垂直孔反应室开口内提供的化学品，试剂或样品。 版权所有（C）2006，JPO＆NCIPI

公开(公告)号：AT512793T

公开(公告)日：2011-07-15

申请号：AT03819267

申请日：2003-12-05

Applicant: IBM

Inventor： NATARAJAN GOVINDARAJAN ,  BEZAMA RASCHID

IPC: B32B18/00 ,  C04B35/645 ,  H01L21/48 ,  H05K1/03 ,  H05K3/46

Abstract: A method to control the post sinter distortion of hot pressing sintered multilayer ceramic laminate by placing a non-densifying structure in the green ceramic laminate prior to sintering. One or more non-densifying structures are placed on one or more ceramic greensheets which are then stacked and laminated to form a green ceramic laminate. The laminate is then sintered and the non-densifying structure will control the dimensions of the hot pressed multilayer ceramic substrate. The method can be used to control post sinter dimensions in MLC substrates manufactured as either single or multi-up substrates by placing the non-densifying structure in the kerf area between the individual product ups prior to sintering.

公开(公告)号：AU2003297642A1

公开(公告)日：2005-08-12

申请号：AU2003297642

申请日：2003-12-05

Applicant: IBM

Inventor： NATARAJAN GOVINDARAJAN ,  BEZAMA RASCHID J

IPC: B32B18/00 ,  C04B35/645 ,  H01L21/48 ,  H05K1/03 ,  H05K3/46 ,  B32B31/26 ,  B32B31/18

Abstract: A method to control the post sinter distortion of hot pressing sintered multilayer ceramic laminate by placing a non-densifying structure in the green ceramic laminate prior to sintering. One or more non-densifying structures are placed on one or more ceramic greensheets which are then stacked and laminated to form a green ceramic laminate. The laminate is then sintered and the non-densifying structure will control the dimensions of the hot pressed multilayer ceramic substrate. The method can be used to control post sinter dimensions in MLC substrates manufactured as either single or multi-up substrates by placing the non-densifying structure in the kerf area between the individual product ups prior to sintering.

公开(公告)号：DE69208675D1

公开(公告)日：1996-04-04

申请号：DE69208675

申请日：1992-06-23

Applicant: IBM

Inventor： AOUDE FARID ,  DAVID LAWRENCE ,  DIVAKARUNI RENUKA SHASTRI ,  FAROOQ SHAJI ,  HERRON LESTER ,  LASKY HAL ,  MASTREANI ANTHONY ,  NATARAJAN GOVINDARAJAN ,  REDDY SRINIVASA ,  SURA VIVEK MADAN ,  VALLABHANENI RAO ,  WALL DONALD RENE

IPC: H01L23/12 ,  H01L21/48 ,  H01L23/498 ,  H05K1/09 ,  H05K3/46 ,  H01B1/02 ,  H01B1/16

Abstract: A copper-based paste is disclosed for filling vias in, and forming conductive surface patterns on, ceramic substrate packages for semiconductor chip devices. The paste contains copper aluminate powder in proper particle size and weight proportion to achieve grain size and shrinkage control of the via and thick film copper produced by sintering. The shrinkage of the copper material during sintering is closely matched to that of the ceramic substrate.

公开(公告)号：AU2002249166A1

公开(公告)日：2002-07-30

申请号：AU2002249166

申请日：2002-01-16

Applicant: IBM

Inventor： NATARAJAN GOVINDARAJAN ,  TERPENING ARNOLD W ,  FLACK AMY C ,  WEISMAN RENEE L ,  CASEY JON A ,  PASCO ROBERT W ,  BESAMA RASCHID J

IPC: B28B11/00 ,  B32B18/00 ,  H05K1/03 ,  H05K3/46 ,  C04B33/30 ,  H01L23/498 ,  H01L21/48 ,  C04B35/622

Abstract: A method of processing greensheets, wherein the following steps are performed:a) providing a greensheet having a width, length, thickness, a first side and a second side;b) bonding to the first side of the greensheet at least one strip, wherein the strip lies in a first plane;c) bonding to the second side of the green sheet at least one strip, wherein the strip lies in a second plane;d) processing the greensheet; ande) removing the strips from the processed greensheet.