公开(公告)号：WO02057075A2

公开(公告)日：2002-07-25

申请号：PCT/EP0201048

申请日：2002-01-16

Applicant: IBM ,  IBM FRANCE

Inventor： NATARAJAN GOVINDARAJAN ,  BESAMA RASCHID J ,  CASEY JON A ,  FLACK AMY C ,  PASCO ROBERT W ,  TERPENING ARNOLD W ,  WEISMAN RENEE L

IPC: B28B11/00 ,  B32B18/00 ,  H05K1/03 ,  H05K3/46

CPC classification number: B32B18/00 ,  C04B2235/6562 ,  C04B2237/068 ,  C04B2237/122 ,  C04B2237/123 ,  C04B2237/366 ,  H05K1/0306 ,  H05K3/4611 ,  H05K3/4629 ,  Y10T156/1056 ,  Y10T156/1057

Abstract: A method of processing greensheets, wherein the following steps are performed: a) providing a greensheet (1) having a width, length, thickness, a first side (5) and a second side (7); b) bonding to the first side of the greensheet at least one strip (a, b, c...), wherein the strip lies in a first plane; c) bonding to the second side of the green sheet at least one strip, wherein the strip lies in a second plane; d) processing the greensheet; and e) removing the strips from the processed greensheet.

Abstract translation: 一种处理毛坯的方法，其中执行以下步骤：a）提供具有宽度，长度，厚度，第一侧（5）和第二侧（7）的毛坯（1）; b）将至少一个条带（a，b，c ...）粘结到毛坯的第一侧，其中条带位于第一平面中; c）将至少一个条带连接到生片的第二侧，其中条位于第二平面中; d）加工毛坯; 以及e）从加工的毛坯上去除条带。

公开(公告)号：JP2007142431A

公开(公告)日：2007-06-07

申请号：JP2006310966

申请日：2006-11-17

Applicant: Internatl Business Mach Corp ,  インターナショナル・ビジネス・マシーンズ・コーポレーションInternational Business Maschines Corporation

Inventor： LIU HSICHANG ,  OLGA A OTIENO ,  NATARAJAN GOVINDARAJAN ,  CHRISTIAN DOCU ,  HAMILTON LISA A ,  GOTTSCHALK JR MELVIN R ,  SEBASTIAN LOSCERBO ,  JAY BUNT ,  THOMAS KLINE ,  LAPLANTE MARK J ,  THOMAS FOLEY ,  WEISMAN RENEE L ,  DONALD W DIANGELO

IPC: H01G13/00 ,  H01G4/12 ,  H01G4/30

CPC classification number: B32B37/0007 ,  B32B37/26 ,  B32B2315/02 ,  H05K1/0306 ,  H05K3/0052 ,  H05K3/4611 ,  H05K3/4629 ,  H05K2201/09781 ,  H05K2203/0169 ,  H05K2203/068 ,  Y10T156/1052 ,  Y10T156/108

Abstract: PROBLEM TO BE SOLVED: To provide a device for providing a uniform axial load distribution when laminating layers of a multilayer ceramic chip carrier. SOLUTION: The device comprises a base plate 1201 configured so as to support a plurality of green sheet layers from under. The base plate has at least one elastically-attached load support bar 1202 arranged adjacent to the outer edge thereof. The load support bar is attached onto one or more biasing members so that the upper surface of the load support bar can extend as far as a selected distance on the upper surface of the base plate. COPYRIGHT: (C)2007,JPO&INPIT

Abstract translation: 要解决的问题：提供一种当层叠多层陶瓷芯片载体层时提供均匀轴向载荷分布的装置。 解决方案：该装置包括基板1201，其被配置为从下方支撑多个生片层。 基板具有邻近其外边缘布置的至少一个弹性附接的负载支撑杆1202。 负载支撑杆附接到一个或多个偏置构件上，使得负载支撑杆的上表面可以在基板的上表面上延伸至选定的距离。 版权所有（C）2007，JPO＆INPIT

公开(公告)号：JP2012094890A

公开(公告)日：2012-05-17

申请号：JP2011281229

申请日：2011-12-22

Applicant: Internatl Business Mach Corp ,  インターナショナル・ビジネス・マシーンズ・コーポレーションInternational Business Maschines Corporation

Inventor： XICHANG LIU ,  OIGA A OTIENO ,  NATARAJAN GOVINDARAJAN ,  CHRISTIAN DUC ,  HAMILTON LISA A ,  GOTTSCHALK JR MELVIN R ,  SEBASTIAN LOSCERBO ,  J VANT ,  KLEIN THOMAS ,  LAPLANTE MARK J ,  FOLEY THOMAS ,  WEISMAN RENEE L ,  DONALD W DIANGELO

IPC: H05K3/46 ,  H01G4/12 ,  H01G4/30 ,  H01G13/00

CPC classification number: B32B37/0007 ,  B32B37/26 ,  B32B2315/02 ,  H05K1/0306 ,  H05K3/0052 ,  H05K3/4611 ,  H05K3/4629 ,  H05K2201/09781 ,  H05K2203/0169 ,  H05K2203/068 ,  Y10T156/1052 ,  Y10T156/108

Abstract: PROBLEM TO BE SOLVED: To provide an apparatus for providing a uniform axial load distribution for laminate layers of multilayer ceramic chip carriers.SOLUTION: The apparatus includes a baseplate configured to support a plurality of green sheet layers 502 thereon. The baseplate has at least one resiliently mounted load support bar disposed adjacent outer edges thereof. The load support bar is mounted on one or more biasing members such that a top surface thereof extends above a top surface of the baseplate by a selected distance.

Abstract translation: 要解决的问题：提供一种用于为多层陶瓷芯片载体的层压层提供均匀的轴向载荷分布的装置。 解决方案：该设备包括被配置为在其上支撑多个生片层502的基板。 底板具有至少一个与其外边缘相邻设置的弹性安装的负载支撑杆。 负载支撑杆安装在一个或多个偏压构件上，使得其顶表面在基板的顶表面上方延伸选定距离。 版权所有（C）2012，JPO＆INPIT

公开(公告)号：JP2012060183A

公开(公告)日：2012-03-22

申请号：JP2011281227

申请日：2011-12-22

Applicant: Internatl Business Mach Corp ,  インターナショナル・ビジネス・マシーンズ・コーポレーションInternational Business Maschines Corporation

Inventor： XICHANG LIU ,  OIGA A OTIENO ,  NATARAJAN GOVINDARAJAN ,  CHRISTIAN DUC ,  HAMILTON LISA A ,  GOTTSCHALK JR MELVIN R ,  SEBASTIAN LOSCERBO ,  J VANT ,  KLEIN THOMAS ,  LAPLANTE MARK J ,  FOLEY THOMAS ,  WEISMAN RENEE L ,  DONALD W DIANGELO

IPC: H01G13/00 ,  H01G4/12 ,  H01G4/30

CPC classification number: B32B37/0007 ,  B32B37/26 ,  B32B2315/02 ,  H05K1/0306 ,  H05K3/0052 ,  H05K3/4611 ,  H05K3/4629 ,  H05K2201/09781 ,  H05K2203/0169 ,  H05K2203/068 ,  Y10T156/1052 ,  Y10T156/108

Abstract: PROBLEM TO BE SOLVED: To provide an apparatus for providing uniaxial load distribution for laminate layers of multilayer ceramic chip carriers.SOLUTION: The apparatus includes a base plate configured to support a plurality of green sheet layers 502 thereon, the base plate having at least one resiliently mounted load support bar disposed adjacent to outer edges of the base plate. The load support bar is mounted on one or more biasing members such that the top surface of the support bar extends above the top surface of the base plate by a selected distance.

Abstract translation: 要解决的问题：提供一种用于为多层陶瓷芯片载体的层叠层提供单轴负载分布的装置。 解决方案：该设备包括被配置为在其上支撑多个生片层502的基板，所述基板具有邻近基板的外边缘设置的至少一个弹性安装的负载支撑杆。 负载支撑杆安装在一个或多个偏压构件上，使得支撑杆的顶表面在基板的顶表面上延伸选定的距离。 版权所有（C）2012，JPO＆INPIT

公开(公告)号：JP2012080122A

公开(公告)日：2012-04-19

申请号：JP2011281228

申请日：2011-12-22

Applicant: Internatl Business Mach Corp ,  インターナショナル・ビジネス・マシーンズ・コーポレーションInternational Business Maschines Corporation

Inventor： XICHANG LIU ,  OIGA A OTIENO ,  NATARAJAN GOVINDARAJAN ,  CHRISTIAN DUC ,  HAMILTON LISA A ,  GOTTSCHALK JR MELVIN R ,  SEBASTIAN LOSCERBO ,  J VANT ,  KLEIN THOMAS ,  LAPLANTE MARK J ,  FOLEY THOMAS ,  WEISMAN RENEE L ,  DONALD W DIANGELO

IPC: H01G4/30 ,  H01G4/12 ,  H01G13/00

CPC classification number: B32B37/0007 ,  B32B37/26 ,  B32B2315/02 ,  H05K1/0306 ,  H05K3/0052 ,  H05K3/4611 ,  H05K3/4629 ,  H05K2201/09781 ,  H05K2203/0169 ,  H05K2203/068 ,  Y10T156/1052 ,  Y10T156/108

Abstract: PROBLEM TO BE SOLVED: To provide an apparatus for providing a uniaxial load distribution on laminating layers of multilayer ceramic chip carriers.SOLUTION: The apparatus includes a base plate configured to support a plurality of green sheet layers 502 thereon, the base plate having at least one resiliently mounted load support bar disposed adjacent outer edges of the base plate. The load support bar is mounted on one or more biasing members such that the top surface of the support bar extends above the top surface of the base plate by a selected distance.

Abstract translation: 要解决的问题：提供一种用于在多层陶瓷芯片载体的层压层上提供单轴载荷分布的装置。 解决方案：该设备包括被配置为在其上支撑多个生片层502的基板，该基板具有邻近底板的外边缘设置的至少一个弹性安装的负载支撑杆。 负载支撑杆安装在一个或多个偏压构件上，使得支撑杆的顶表面在基板的顶表面上延伸选定的距离。 版权所有（C）2012，JPO＆INPIT

公开(公告)号：JP2004311998A

公开(公告)日：2004-11-04

申请号：JP2004101141

申请日：2004-03-30

Applicant: Internatl Business Mach Corp ,  インターナショナル・ビジネス・マシーンズ・コーポレーションInternational Business Maschines Corporation

Inventor： RASHID J BEZAMA ,  WEISMAN RENEE L

IPC: H05K3/22 ,  H01L21/48 ,  H01L23/12

CPC classification number: H01L21/4807

Abstract: PROBLEM TO BE SOLVED: To provide an improved method and apparatus for flattening a sintered multilayer ceramic substrate for fabricating a microelectronic chip. SOLUTION: In the apparatus for flattening the sintered-ceramic electronic package substrates having surfaces facing each other and suffering from undesirable cambers, the substrates are arranged alternately with spacers. At least one heating zone is movable to close or apart from the alternately arranged stack of the ceramic substrates and spacers and includes a heat conducting medium that performs a heating action at a desired rate by directly contacting or coming very closely to the side surface of the stack. A plunger serves for applying pressure to the stack in the direction perpendicular to the surfaces facing each other of the substrates. At least one cooling zone is movable to close or apart from the stack and includes heat the conducting medium that dissipates the heat, having been introduced by the heating zone, by directly contacting or coming very closely to the side surface of the stack. A reducing gas supply communicates with at least one heating zone and at least one cooling zone to supply the gas and maintains a controlled reducing gas atmosphere in the interior of the apparatus. COPYRIGHT: (C)2005,JPO&NCIPI

公开(公告)号：MY126247A

公开(公告)日：2006-09-29

申请号：MYPI20022733

申请日：2002-07-18

Applicant: IBM

Inventor： ALCOE DAVID JANES ,  STUTZMAN RANDALL JOSEPH ,  WEISMAN RENEE L ,  ZITZ JEFFREY ALLEN ,  COFFIN JEFFREY THOMAS ,  GAYNES MICHAEL ANTHONY ,  HAMEL HARVEY CHARLES ,  INTERRANTE MARIO J ,  PETERSON BRENDA LEE ,  SHANNON MEGAN J ,  SABLINSKI WILLIAM EDWARD ,  SPRING CHRISTOPHER TODD

IPC: H01L23/29 ,  H01L23/552 ,  H01L23/31 ,  H05K9/00

Abstract: ELECTRONIC PACKAGES INCORPORATING EMI SHIELDING, AND PARTICULARLY SEMICONDUCTOR DEVICES WHICH INCORPORATED SEMICONDUCTOR CHIP-CARRIER STRUCTURES HAVING GROUNDED BANDS EMBEDDED THEREIN WHICH ARE ADAPTED TO REDUCE OUTGOING AND INCLUDENT EMI EMISSIONS FOR HIGH-SPEED SWITCHING ELECTRONIC PACKAGES. (FIG. 1)

公开(公告)号：AU2002249166A1

公开(公告)日：2002-07-30

申请号：AU2002249166

申请日：2002-01-16

Applicant: IBM

Inventor： NATARAJAN GOVINDARAJAN ,  TERPENING ARNOLD W ,  FLACK AMY C ,  WEISMAN RENEE L ,  CASEY JON A ,  PASCO ROBERT W ,  BESAMA RASCHID J

IPC: B28B11/00 ,  B32B18/00 ,  H05K1/03 ,  H05K3/46 ,  C04B33/30 ,  H01L23/498 ,  H01L21/48 ,  C04B35/622

Abstract: A method of processing greensheets, wherein the following steps are performed:a) providing a greensheet having a width, length, thickness, a first side and a second side;b) bonding to the first side of the greensheet at least one strip, wherein the strip lies in a first plane;c) bonding to the second side of the green sheet at least one strip, wherein the strip lies in a second plane;d) processing the greensheet; ande) removing the strips from the processed greensheet.