公开(公告)号：DE69208675D1

公开(公告)日：1996-04-04

申请号：DE69208675

申请日：1992-06-23

Applicant: IBM

Inventor： AOUDE FARID ,  DAVID LAWRENCE ,  DIVAKARUNI RENUKA SHASTRI ,  FAROOQ SHAJI ,  HERRON LESTER ,  LASKY HAL ,  MASTREANI ANTHONY ,  NATARAJAN GOVINDARAJAN ,  REDDY SRINIVASA ,  SURA VIVEK MADAN ,  VALLABHANENI RAO ,  WALL DONALD RENE

IPC: H01L23/12 ,  H01L21/48 ,  H01L23/498 ,  H05K1/09 ,  H05K3/46 ,  H01B1/02 ,  H01B1/16

Abstract: A copper-based paste is disclosed for filling vias in, and forming conductive surface patterns on, ceramic substrate packages for semiconductor chip devices. The paste contains copper aluminate powder in proper particle size and weight proportion to achieve grain size and shrinkage control of the via and thick film copper produced by sintering. The shrinkage of the copper material during sintering is closely matched to that of the ceramic substrate.

公开(公告)号：CA2072727A1

公开(公告)日：1993-03-11

申请号：CA2072727

申请日：1992-06-29

Applicant: IBM

Inventor： AOUDE FARID Y ,  DAVID LAWRENCE D ,  DIVAKARUNI RENUKA S ,  FAROOQ SHAJI ,  HERRON LESTER W ,  LASKY HAL M ,  MASTREANI ANTHONY ,  NATARAJAN GOVINDARAJAN ,  REDDY SRINIVASA S N ,  SURA VIVEK M ,  VALLABHANENI RAO V ,  WALL DONALD R

IPC: H01L23/12 ,  H01L21/48 ,  H01L23/498 ,  H05K1/09 ,  H05K3/46 ,  H01B1/02

Abstract: FI9-90-027 COPPER-BASED PASTE CONTAINING COPPER ALUMINATE FOR MICROSTRUCTURAL AND SHRINKAGE CONTROL OF COPPER-FILLED VIAS A copper-based paste is disclosed for filling vias in, and forming conductive surface patterns on, ceramic substrate packages for semiconductor chip devices. The paste contains copper aluminate powder in proper particle size and weight proportion to achieve grain size and shrinkage control of the via and thick film copper produced by sintering. The shrinkage of the copper material during sintering is closely matched to that of the ceramic substrate.

公开(公告)号：DE69208675T2

公开(公告)日：1996-09-26

申请号：DE69208675

申请日：1992-06-23

Applicant: IBM

Inventor： AOUDE FARID ,  DAVID LAWRENCE ,  DIVAKARUNI RENUKA SHASTRI ,  FAROOQ SHAJI ,  HERRON LESTER ,  LASKY HAL ,  MASTREANI ANTHONY ,  NATARAJAN GOVINDARAJAN ,  REDDY SRINIVASA ,  SURA VIVEK MADAN ,  VALLABHANENI RAO ,  WALL DONALD RENE

IPC: H01L23/12 ,  H01L21/48 ,  H01L23/498 ,  H05K1/09 ,  H05K3/46 ,  H01B1/02 ,  H01B1/16

Abstract: A copper-based paste is disclosed for filling vias in, and forming conductive surface patterns on, ceramic substrate packages for semiconductor chip devices. The paste contains copper aluminate powder in proper particle size and weight proportion to achieve grain size and shrinkage control of the via and thick film copper produced by sintering. The shrinkage of the copper material during sintering is closely matched to that of the ceramic substrate.