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公开(公告)号:DE3787993T2
公开(公告)日:1994-05-19
申请号:DE3787993
申请日:1987-04-22
Applicant: IBM
Inventor: FLAITZ PHILIP LEE , FLANAGAN ARLYNE MARIE , HARVILCHUCK JOSEPH MATTHEW , HERRON LESTER WYNN , KNICKERBOCKER JOHN ULRICH , NUFER ROBERT WOLFF , PERRY CHARLES HAMPTON , REDDY SRINIVASA N
IPC: C04B35/638 , C04B35/64 , H01L21/48
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公开(公告)号:DE3787399T2
公开(公告)日:1994-04-21
申请号:DE3787399
申请日:1987-04-22
Applicant: IBM
Inventor: HERRON LESTER WYNN , LUSSOW ROBERT OTIS , NUFER ROBERT WOLFF , SCHWARTZ BERNARD , ACOCELLA JOHN , REDDY SRINIVASA N
Abstract: A multilayered ceramic (MLC) substrate having embedded and exposed conductors suitable for mounting and interconnecting a plurality of electronic devices exterior thereof. The horizontal planar conductors comprise substantially a plurality of solid, non porous, homogeneous metal patterns (26), whereas the vertical interplanar connection conductors (26A) are substantially porous metal conductors that are formed by methods such as screening. The process to form the MLC substrate involves forming a pattern of solid, nonporous conductors to a backing sheet (24) having a release layer, then transferring the pattern to a ceramic green sheet (22). Zero X-Y shrinkage sintering processes allow the MLC substrate and solid metal conductors to be densified without distortion of the solid metal patterns or the ceramic.
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公开(公告)号:FR2278652A1
公开(公告)日:1976-02-13
申请号:FR7519823
申请日:1975-06-19
Applicant: IBM
Inventor: NUFER ROBERT WOLFF , HAI GERALD F
IPC: C04B33/30 , C04B35/111 , C04B35/622 , C04B35/634 , C04B41/20
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公开(公告)号:DE2451236A1
公开(公告)日:1975-06-19
申请号:DE2451236
申请日:1974-10-29
Applicant: IBM
Inventor: KAISER HAROLD DALTON , NUFER ROBERT WOLFF
IPC: C04B33/26 , C04B35/622 , C04B35/634 , H01B3/00 , H05K1/03 , H05K3/12 , C04B35/00 , H01L27/12 , H01G4/12
Abstract: Production of a sintered ceramic dielectric formed from a green sheet having a uniform microporous structure providing uniform dielectric properties and compressibility for lamination of stacked green sheets into a unitary laminate which may be provided with an internal pattern of electrical conductors extending therein. The structure is obtained by blending the ceramic particulate with a binder resin soluble in an azeotropic mixture which is formed from a solvent for the binder resin and a non-solvent in which the resin is at most only slightly soluble, which on evaporation of said azeotropic mixture forms said structure.
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