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Patent Agency Ranking
公开(公告)号：AU6751774A
公开(公告)日：1975-10-09
申请号：AU6751774
申请日：1974-04-03
Applicant: IBM
Inventor： LUSSOW ROBERT OTIS , REISMAN ARNOLD , BERKENBLIT MELVIN
Abstract: A process for the in situ fabrication of a glass from an admixed frit, for example, of two starting glasses on the required existing substrate structure therefore. The admixed frit comprises a low glass transition temperature glass and a higher glass transition temperature glass, which glasses are uniquely capable of forming a continuous vitreous phase over their entire compositional range. During thermal cycling, the low glass transition temperature glass flows out and solubilizes the higher glass transition temperature glass to thereby synthesize in situ a new glass. The temperature required to form the glass by the in situ process is less than that required where a glass of identical composition is first preequilibrated externally and then applied in frit form to the existing substrate structure and flowed out thereon. The in situ synthesized new glass softens and flows at a temperature higher than that of the low glass transistion temperature glass and lower than that of the higher glass transition temperature glass, and exhibits a glass transition temperature intermediate to the two starting glasses.
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公开(公告)号：DE3787399D1
公开(公告)日：1993-10-21
申请号：DE3787399
申请日：1987-04-22
Applicant: IBM
Inventor： HERRON LESTER WYNN , LUSSOW ROBERT OTIS , NUFER ROBERT WOLFF , SCHWARTZ BERNARD , ACOCELLA JOHN , REDDY SRINIVASA N
Abstract: A multilayered ceramic (MLC) substrate having embedded and exposed conductors suitable for mounting and interconnecting a plurality of electronic devices exterior thereof. The horizontal planar conductors comprise substantially a plurality of solid, non porous, homogeneous metal patterns (26), whereas the vertical interplanar connection conductors (26A) are substantially porous metal conductors that are formed by methods such as screening. The process to form the MLC substrate involves forming a pattern of solid, nonporous conductors to a backing sheet (24) having a release layer, then transferring the pattern to a ceramic green sheet (22). Zero X-Y shrinkage sintering processes allow the MLC substrate and solid metal conductors to be densified without distortion of the solid metal patterns or the ceramic.
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公开(公告)号：DE2418462A1
公开(公告)日：1974-11-07
申请号：DE2418462
申请日：1974-04-17
Applicant: IBM
Inventor： BERKENBLIT MELVIN , LUSSOW ROBERT OTIS , REISMAN ARNOLD
IPC: C03C27/04 , C03B19/00 , C03C3/072 , C03C3/102 , C03C17/02 , C03C27/06 , C03C27/10 , C03C3/10 , C03C3/14 , C03C3/24 , C03C3/30
Abstract: A process for the in situ fabrication of a glass from an admixed frit, for example, of two starting glasses on the required existing substrate structure therefore. The admixed frit comprises a low glass transition temperature glass and a higher glass transition temperature glass, which glasses are uniquely capable of forming a continuous vitreous phase over their entire compositional range. During thermal cycling, the low glass transition temperature glass flows out and solubilizes the higher glass transition temperature glass to thereby synthesize in situ a new glass. The temperature required to form the glass by the in situ process is less than that required where a glass of identical composition is first preequilibrated externally and then applied in frit form to the existing substrate structure and flowed out thereon. The in situ synthesized new glass softens and flows at a temperature higher than that of the low glass transistion temperature glass and lower than that of the higher glass transition temperature glass, and exhibits a glass transition temperature intermediate to the two starting glasses.
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公开(公告)号：DE3787399T2
公开(公告)日：1994-04-21
申请号：DE3787399
申请日：1987-04-22
Applicant: IBM
Inventor： HERRON LESTER WYNN , LUSSOW ROBERT OTIS , NUFER ROBERT WOLFF , SCHWARTZ BERNARD , ACOCELLA JOHN , REDDY SRINIVASA N
Abstract: A multilayered ceramic (MLC) substrate having embedded and exposed conductors suitable for mounting and interconnecting a plurality of electronic devices exterior thereof. The horizontal planar conductors comprise substantially a plurality of solid, non porous, homogeneous metal patterns (26), whereas the vertical interplanar connection conductors (26A) are substantially porous metal conductors that are formed by methods such as screening. The process to form the MLC substrate involves forming a pattern of solid, nonporous conductors to a backing sheet (24) having a release layer, then transferring the pattern to a ceramic green sheet (22). Zero X-Y shrinkage sintering processes allow the MLC substrate and solid metal conductors to be densified without distortion of the solid metal patterns or the ceramic.
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