公开(公告)号：FR2740224B1

公开(公告)日：1998-12-31

申请号：FR9612844

申请日：1996-10-15

Applicant: IBM

Inventor： BAYER THOMAS ,  MEISSNER KLAUS ,  STOHR ROLAND ,  GRESCHNER JOHANN ,  STEINER WERNER

IPC: G01R1/073 ,  G01R31/28 ,  H01L21/66

Abstract: The invention relates to a contact probe arrangement for electrically connecting a test system with contact pads of a device to be tested. The contact probes are located in guide grooves. The guide grooves as well as areas are provided in a plane parallel to the surface of a guide plate and are covered by a protective plate. The contact probes may bend out laterally into the respective areas. This assures a very dense contact probe array. Contact probe arrays of this type may be used, for example, for detecting opens and shorts in integrated circuits or semiconductor chips. The invention overcomes the problem of adjusting for height differences in the contact pads caused by an uneven surface of the device to be tested.

公开(公告)号：CA2049261A1

公开(公告)日：1992-02-18

申请号：CA2049261

申请日：1991-08-15

Applicant: IBM

Inventor： TRIPPEL GERHARD ,  STEINER WERNER

IPC: B05D1/40 ,  B05D7/24 ,  B29C43/18 ,  B29D17/00 ,  B29K83/00 ,  B29L17/00 ,  G11B7/26 ,  G11B7/24

Abstract: GE9-90-001 Grooved substrates and multilayer structures, especially suitable for optical disks, are taught. The major process steps include spin coating of a supporting plate (1) with dissolved material forming a soft layer (7) thereon, stamping grooves (2) into the soft layer (7) to form a structured soft layer showing the negative image of the stamp and hardening the structured soft layer (7) by thermal treatment. The dissolved material contains polymeric organometal compounds comprising polymer siloxane and/or polymer silicates. In one embodiment the structured soft layer is a dielectric layer (8) containing various combinations of the oxides SiO2, La2O3, PbO and TiO2. The multilayer structure is completed by a magneto-optic layer (4), a reflector layer (5) and a passivation layer (6).

公开(公告)号：ES2004550A6

公开(公告)日：1989-01-16

申请号：ES8700650

申请日：1987-03-10

Applicant: IBM

Inventor： TRIPPEL GERHARD ,  BRUNSCH ARWED ,  SCHMIDT CLAUS ,  STEINER WERNER ,  RINK HELMUT

IPC: G11B5/842 ,  G11B5/845

Abstract: METODO Y DISPOSICION PARA MEJORAR LA DISPERSION DE PARTICULAS MAGNETICAS EN UN LIQUIDO CONSTITUIDO POR RESINA Y DISOLVENTE PARA FORMAR UNA COMPOSICION DE REVESTIMIENTO, COMPRENDIENDO EL METODO SOMETER LA COMPOSICION DE REVESTIMIENTO A UN CAMPO MAGNETICO DE PARAMETROS OPTIMOS CON RELACION A LA FRECUENCIA, INTENSIDAD DE CAMPO Y DURACION, DE TAL MODO QUE SE OBTENGA UNA DISTRIBUCION HOMOGENEA DE LAS PARTICULAS MAGNETICAS EN EL LIQUIDO. LA DISPOSICION COMPRENDE DOS ELECTROIMANES (1, 2) QUE FORMAN UN ANGULO ENTRE SI Y QUE ESTAN DISPUESTOS ALREDEDOR DE UN TUBO (3) QUE LLEVA LA COMPOSICION DE REVESTIMIENTO. EL INVENTO ES APLICABLE A LA PRODUCCION DE SOPORTES DE GRABACION MAGNETICOS, TALES COMO DISCOS Y CINTAS MAGNETICAS.

公开(公告)号：DE19538792A1

公开(公告)日：1997-04-24

申请号：DE19538792

申请日：1995-10-18

Applicant: IBM

Inventor： BAYER THOMAS ,  GRESCHNER JOHANN DR ,  MEISSNER KLAUS ,  STEINER WERNER ,  STOEHR ROLAND

IPC: G01R1/073 ,  G01R31/28 ,  H01L21/66

Abstract: The invention relates to a contact probe arrangement 1 for electrically connecting a test system with the circular contact pads 2 of a device to be tested 3. In order to achieve a low contact resistance the contact probes 4 are orthogonally pressed onto the contact pads 2, and for adjusting height differences in the contact pads 2 caused by an uneven surface of the device to be tested 3 they may bend out laterally into the provided areas 6a, 6b. The contact probes 4 are located in guide grooves 5. The guide grooves 5 as well as the areas 6a, 6b are provided in a plane parallel to the surface of a guide plate 7 and are covered by a protective plate. This assures a very dense contact probe array. Contact probe arrays of this type may be used, for example, for detecting opens and shorts in electrical circuit arrays of microelectronic compounds.

公开(公告)号：CA1175774A

公开(公告)日：1984-10-09

申请号：CA372914

申请日：1981-03-12

Applicant: IBM

Inventor： KIENLE HELMUT ,  SCHMID GERHARD E ,  STEINER WERNER ,  TRIPPEL GERHARD

IPC: G11B5/66 ,  C09D163/00 ,  G11B5/73 ,  G11B5/738 ,  G11B5/82 ,  G11B5/84 ,  G11B5/85 ,  G11B5/858 ,  H01F10/26 ,  H01F10/30 ,  H01R12/18 ,  C25D11/18 ,  G11B5/62

Abstract: Multi-layer magnetic thin-film disks comprising substrates with aluminum and a synthetic resin layer underneath the matallic magnetic layer are subject to the formation of pin holes in the synthetic resin layer, which pin holes are caused by galvano corrosion of the aluminum of the substrate. The pin holes are passivated by aluminum oxide which is advantageously effected by anodically oxidizing the aluminum of the substrate in an electrolytic bath, the electric voltage of the bath being well below the normal passivation voltage for aluminum. GE9-79-034

公开(公告)号：GB2306804B

公开(公告)日：1999-07-14

申请号：GB9621500

申请日：1996-10-16

Applicant: IBM

Inventor： BAYER THOMAS ,  GRESCHNER JOHANN ,  MEISSNER KLAUS ,  STOEHR ROLAND ,  STEINER WERNER

IPC: G01R1/073 ,  G01R31/28 ,  H01L21/66

Abstract: The invention relates to a contact probe arrangement for electrically connecting a test system with contact pads of a device to be tested. The contact probes are located in guide grooves. The guide grooves as well as areas are provided in a plane parallel to the surface of a guide plate and are covered by a protective plate. The contact probes may bend out laterally into the respective areas. This assures a very dense contact probe array. Contact probe arrays of this type may be used, for example, for detecting opens and shorts in integrated circuits or semiconductor chips. The invention overcomes the problem of adjusting for height differences in the contact pads caused by an uneven surface of the device to be tested.

公开(公告)号：GB2306804A

公开(公告)日：1997-05-07

申请号：GB9621500

申请日：1996-10-16

Applicant: IBM

Inventor： BAYER THOMAS ,  GRESCHNER JOHANN ,  MEISSNER KLAUS ,  STOEHR ROLAND ,  STEINER WERNER

IPC: G01R1/073 ,  G01R31/28 ,  H01L21/66

Abstract: The invention relates to a contact probe arrangement for electrically connecting a test system with contact pads of a device to be tested. The contact probes are located in guide grooves. The guide grooves as well as areas are provided in a plane parallel to the surface of a guide plate and are covered by a protective plate. The contact probes may bend out laterally into the respective areas. This assures a very dense contact probe array. Contact probe arrays of this type may be used, for example, for detecting opens and shorts in integrated circuits or semiconductor chips. The invention overcomes the problem of adjusting for height differences in the contact pads caused by an uneven surface of the device to be tested.

公开(公告)号：DE3162204D1

公开(公告)日：1984-03-22

申请号：DE3162204

申请日：1981-03-12

Applicant: IBM

Inventor： KIENLE HELMUT ,  SCHMID GERHARD E DR ,  STEINER WERNER ,  TRIPPEL GERHARD DR

IPC: G11B5/66 ,  C09D163/00 ,  G11B5/73 ,  G11B5/738 ,  G11B5/82 ,  G11B5/84 ,  G11B5/85 ,  G11B5/858 ,  H01F10/26 ,  H01F10/30 ,  H01R12/18

Abstract: Multi-layer magnetic thin film disks comprising a synthetic resin layer on an aluminum-containing substrate and an overlying metallic magnetic layer, are liable to have pin holes in the synthetic resin layer caused by galvanic corrosion of the aluminum in the substrate. The pin holes are passivated by aluminum oxide produced therein by anodically oxidizing the aluminum of the substrate in an electrolytic bath, the electric voltage of which is well below the normal passivation voltage for aluminum.