公开(公告)号：DE10140757A1

公开(公告)日：2003-03-13

申请号：DE10140757

申请日：2001-08-20

Applicant: INFINEON TECHNOLOGIES AG

Inventor： ADLER FRANK ,  VERSEN MARTIN ,  MOSER MANFRED ,  HUBER THOMAS

IPC: G01R31/28 ,  G01R31/30 ,  G11C29/02 ,  G11C29/50

Abstract: Signal transit times on printed circuit boards which are equipped with all the passive components but without any active components can be determined using automatic standard test equipment composed of a standard test unit and a performance board with fittings attached thereto. In that first, using a standard routine of the test unit, a transit time is measured on the performance board from the CIF connector as far as the fitting, then a printed circuit board is plugged into the fitting location determined for it and then the sum transit time of the CIF connector is measured as far as the landing pad on the printed circuit board. By forming differences between the two measured values, the transit times on a printed circuit board can be measured with a high degree of precision with the automatic standard test equipment used in standard module testing technology.

公开(公告)号：DE10358357A1

公开(公告)日：2005-07-21

申请号：DE10358357

申请日：2003-12-12

Applicant: INFINEON TECHNOLOGIES AG

Inventor： SCHROEDER STEPHAN ,  PROELL MANFRED ,  AUGE JUERGEN ,  HUBER THOMAS

IPC: G01K1/02 ,  G01K7/01 ,  H01L23/544 ,  H01L21/66 ,  H01L21/60

Abstract: Detector comprises integrated semiconductor chip (1) with solderable contact(s) (2) or external contact(s) (14d), conductively linked to temperature sensor (3), picking-up measuring magnitude allocated to temperature of chip. Processor (4,5) includes A/D converter (5), coupled to temperature sensor for converting measuring magnitude into signal, representing temperature load that can be stored. There is at least one voltage supply source (10) and data memory (6), with all connections and process steps specified. Independent claims are included for method for detecting temperature load.

公开(公告)号：DE10319984A1

公开(公告)日：2004-12-09

申请号：DE10319984

申请日：2003-05-05

Applicant: INFINEON TECHNOLOGIES AG

Inventor： STOCKEN CHRISTIAN ,  HUBER THOMAS ,  SCHROEDER STEPHAN ,  PROELL MANFRED

IPC: G06F1/20 ,  H01L23/367 ,  H01L23/433 ,  H01L23/34 ,  H01L23/38 ,  H01L25/11 ,  H05K7/20

Abstract: Device for cooling memory modules in a computer, especially a PC, comprises elements for thermally coupling two or more individual memory modules, especially DIMM modules. In particular the device comprises a comb-shaped base body (10) that can connected to a fan if necessary.