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公开(公告)号:DE10355333B3
公开(公告)日:2005-06-30
申请号:DE10355333
申请日:2003-11-27
Applicant: INFINEON TECHNOLOGIES AG
Inventor: EGGERS GEORG , WIRTH NORBERT , BENZINGER HERBERT , HUBER THOMAS
Abstract: The invention relates to a method and a device ( 1, 11, 21 ) for detecting the overheating of a semiconductor device, comprising a temperature measuring means ( 3, 13, 23 ) that changes its electrical conductivity when the temperature of the semiconductor device changes.
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公开(公告)号:DE10140757B4
公开(公告)日:2004-11-04
申请号:DE10140757
申请日:2001-08-20
Applicant: INFINEON TECHNOLOGIES AG
Inventor: ADLER FRANK , VERSEN MARTIN , MOSER MANFRED , HUBER THOMAS
Abstract: Signal transit times on printed circuit boards which are equipped with all the passive components but without any active components can be determined using automatic standard test equipment composed of a standard test unit and a performance board with fittings attached thereto. In that first, using a standard routine of the test unit, a transit time is measured on the performance board from the CIF connector as far as the fitting, then a printed circuit board is plugged into the fitting location determined for it and then the sum transit time of the CIF connector is measured as far as the landing pad on the printed circuit board. By forming differences between the two measured values, the transit times on a printed circuit board can be measured with a high degree of precision with the automatic standard test equipment used in standard module testing technology.
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公开(公告)号:DE10102872A1
公开(公告)日:2002-08-29
申请号:DE10102872
申请日:2001-01-23
Applicant: INFINEON TECHNOLOGIES AG
Inventor: HUBER THOMAS , MOSER MANFRED
Abstract: A computer includes a CPU (10) having at least one semiconductor component, a working store (40), an optical-core type bus (36,33) via which the CPU (10) is connected to the working memory. Electro-optical converters (11,47) convert between the optical signals and the electrical signals, the optical interfaces of which are connected to the optical cores (36,33) and whose electrical interfaces are joined to the respective semiconductor components (10,41) of the processor and the working memory.
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公开(公告)号:DE10203570A1
公开(公告)日:2003-08-14
申请号:DE10203570
申请日:2002-01-30
Applicant: INFINEON TECHNOLOGIES AG
Inventor: ADLER FRANK , MOSER MANFRED , HUBER THOMAS
Abstract: The method involves making read and write accesses to the semiconducting component by writing a first information item by driving a memory address so no address lines (L1-6) are electrically biased, writing a different second item, whereby a second address is selected so that only one address line is biased, reading the first memory address, which is driven so no address lines are biased, and checking which information item was read out.
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公开(公告)号:DE10111752A1
公开(公告)日:2002-10-02
申请号:DE10111752
申请日:2001-03-12
Applicant: INFINEON TECHNOLOGIES AG
Inventor: ADLER FRANK , ANGENENDT GUIDO , HUBER THOMAS
Abstract: A contact terminal (4) and a testing device (3) both couple to a semiconductor component (1). A safe contact can be monitored e.g. via a contacting wire (13) with a measurement device (6) that connects to the testing device and the contact terminal. A safe contact is set up for a semiconductor component e.g. on a microchip pad (12). An Independent claim is also included for a method for setting up contacts for a semiconductor component for testing purposes.
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公开(公告)号:DE10220138A1
公开(公告)日:2003-11-27
申请号:DE10220138
申请日:2002-05-06
Applicant: INFINEON TECHNOLOGIES AG
Inventor: DOBLER MANFRED , STOCKEN CHRISTIAN , HUBER THOMAS
Abstract: A memory device has a carrier substrate (6) with a terminal for supplying a system clock signal (CLK), a number of clock-controlled integrated memory elements (11-18), a sync. device (7) coupled on the input-side with the system clock signal terminal, and a phase-shifter circuit (2-4) as an element of the sync. device (7) by which a phase-shift between the input-side supplied system clock signal (CLK) and the output-side prepared sync. clock signal (Q) is adjusted depending on a control signal (S,S1,S2), the latter being adjusted via an externally programmable memory device (8), coupled with the phase-shifter device. An Independent claim is given for a method of calibrating a memory arrangement.
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公开(公告)号:DE10102872C2
公开(公告)日:2003-07-17
申请号:DE10102872
申请日:2001-01-23
Applicant: INFINEON TECHNOLOGIES AG
Inventor: HUBER THOMAS , MOSER MANFRED
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公开(公告)号:DE102021115349A1
公开(公告)日:2022-01-20
申请号:DE102021115349
申请日:2021-06-14
Applicant: INFINEON TECHNOLOGIES AG
Inventor: KÜNLE MATTHIAS , FIEDLER OLAF , HUBER THOMAS , ILLEMANN CHRISTIAN , MALE MATHIAS
IPC: C23C16/455
Abstract: Eine Prozesskammer zur Prozessierung eines Substrats umfasst einen Kammerkörper, der einen inneren Substratprozessierungsbereich definiert. Die Prozesskammer umfasst ferner einen Substratträger zum Halten eines Substrats und einen Vorwärmring mit einer zentralen Öffnung, die so bemessen ist, dass sie um das auf dem Substratträger zu platzierende Substrat herum angeordnet ist. Ein Prozessgaseinlass ist so konfiguriert, dass er Prozessgas in einer seitlichen Richtung leitet, um über den Vorwärmring und über das auf dem Substratträger zu platzierende Substrat zu strömen. Ein Prozessgasauslass ist gegenüber dem Prozessgaseinlass angeordnet. Ein Prozessgasströmungsablenker umfasst einen radial äußeren Befestigungsabschnitt und einen radial inneren, sich in radialer Richtung erstreckenden, blattförmigen Prozessgasablenkungsabschnitt, wobei der radial innere, blattförmige Prozessgasablenkungsabschnitt als Ringsegment ausgebildet ist. Der radial innere, blattförmige Prozessgasablenkungsabschnitt ist oberhalb des Prozessgaseinlasses angeordnet und so dimensioniert, dass er mit dem Vorwärmring überlappt, wobei der Grad der Überlappung zwischen dem Vorwärmring und dem Prozessgasströmungsablenker in radialer Richtung mindestens 1/2 der radialen Abmessung des Vorwärmrings beträgt.
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公开(公告)号:DE102004015539A1
公开(公告)日:2005-10-20
申请号:DE102004015539
申请日:2004-03-30
Applicant: INFINEON TECHNOLOGIES AG
Inventor: HUBER THOMAS , MENCK PEGGY , EGGERS GEORG
Abstract: The invention involves a process for heating a semi-conductor component, as well as a semi-conductor component, whereby a device for heating the semi-conductor component is provided on the semi-conductor component.
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公开(公告)号:DE10208737A1
公开(公告)日:2003-09-18
申请号:DE10208737
申请日:2002-02-28
Applicant: INFINEON TECHNOLOGIES AG
Inventor: HUBER THOMAS , DOBLER MANFRED
Abstract: An adapter apparatus for receiving memory modules, each of which has a plurality of data terminals and a plurality of control terminals, comprises first data terminals, first control terminals, a first socket for receiving a first memory module with second data terminals and second control terminals, wherein the second data terminals are associated to the data terminals of the first memory module, wherein the second control terminals are associated to the control terminals of the first memory module, a second socket for receiving a second memory module with third data terminals and third control terminals, wherein the third data terminals are associated to the data terminals of the second memory module, wherein the third control terminals are associated to the control terminals of the second memory module, a signal transformation circuit with an input and an output, wherein the input is connected to the first control terminals, and wherein the output is connected to the second control terminals and to the third control terminals, and wherein a second group of first data terminals is connected to the third data terminals.
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